CENTRAL TRUST OF CHINA PROCUREMENT DEPARTMENT Contract No. YL-7604-5498 (95-GFR3-0453) Contract Date June 5, 1995 CENTRAL TRUST OF CHINA, Procurement Department, (hereinafter referred to as Buyer) 45 Wu-Chang Street, Section 1, Taipei, Taiwan 100, Republic of China (Telex: 11377 TRUSTPRO, Fax: (02)382-2010) on behalf of the client Chung Shan Institute of Science and Technology hereby agrees to buy and Parlex Corporation, 145 Milk Street, Methuen, MA 01844 U.S.A. (hereinafter referred to as Seller) agrees to sell the following in accordance with the terms and conditions set forth hereunder and at the back of this contract: - -------------------------------------------------------------------------------------- Item No. Description Qty. Extension - -------------------------------------------------------------------------------------- Rigid-Flex PCB Manufacturing Technology Transfer. 1 lot * Details as per attached statement of work. Payment by 100% irrevocable L/C against invoices, etc., and advised through Shawmut Bank N.A., 1 Federal Street, Boston, MA 02210, USA, A/C #020-074183-9, ABA #011000206. All banking charges outside Taiwan shall be paid by the beneficiary. All required documentation should be delivered to consignee by common carrier. The consignee's address: Chung Shan Institute of Science and Technology, No. 481, Chia-An Sec., Chung-Cheng Rd.., Chia-An Village, Lungtan, Taiwan. All other requirements specified in special notes attached. SHIPPING MARKS: L/C beneficiary ____________________ ORDER NO: YL-7604-5498(95-GFR3-0453) same as seller Address: same as seller Supplier: same as seller Shipping Wts: Address: same as seller GFR3-840321 Measurements: Manufacturer: same as seller XB4165A Case No.: Address: same as seller CSIST P D Taipei, Taiwan INSURANCE: To be effected by Buyer upon receipt of Seller's shipping notice. TO COMPLETE THE PROGRAM: SHIPMENT: Within 28 weeks after the contract being effected. Partial shipments are/not permitted. INSPECTION: Maker's Inspection Certificate required on specifications, quantity, quality, proper packing and marking. IN WITNESS WHEREOF, the parties hereto have caused this Contract signed by their respective officers duly authorized. FOR CENTRAL TRUST OF CHINA FOR Parlex Corporation PROCUREMENT DEPARTMENT /s/ JAMES CHANG /s/ PETER J. MURPHY - ---------------------------------- ---------------------------------- * Confidential information has been omitted and filed separately with the Commission. CENTRAL TRUST OF CHINA REPRESENTATIVE OFFICE IN NEW YORK ONE WORLD TRADE CENTER - SUITE 3857 NEW YORK, NY 10048-0279 Telephone: (212)775-1055-9 Fax: (212)775-0490 CONTRACT NO. YL-7604-5498, 95-GFR3-0453 ATTACHMENT: SPECIAL NOTES 1. THE SELLER IS RESPONSIBLE FOR THE TRANSPORTATION, LODGING AND MEALS OF THREE TRAINEES VISITATION DURING THE PHASE ONE. 2. THE SELLER SHOULD PROVIDE THE SUPPORT OF ANY REASONABLE REQUEST FOR ENGINEERING ASSISTANCE IN WRITTEN FORM WITHOUT ANY ADDITIONAL CHARGE. IF THE ENGINEERING SUPPORT IN THE BUYER'S FACILITY IS REQUIRED, WITHIN A PERIOD OF TWO YEARS, THE FEE SHOULD BE LESS THAN US * (PLUS AIR FARE, HOTEL & SUBSISTENCE). IF REFRESHER TRAINING IS REQUIRED BY THE ENDUSER, CSIST, AFTER 12 MONTHS, THE FEE WILL BE NO MORE THAN *. 3. THE REQUIRED DOCUMENTATION AND TRAINING MATERIALS WHICH WILL BE DELIVERED TO THE ENDUSER, CSIST, IN TAIWAN VIA COMMON CARRIER WITH AIR FREIGHT PREPAID. THE DOCUMENTATION SHALL BE SHIPPED TO CSIST WITHIN TWO MONTHS AFTER RECEIPT OF THE LETTER OF CREDIT. 4. CONSIGNEE: CHUNG-SHAN INSTITUTE OF SCIENCE OF TECHNOLOGY 481, CHIA-AN SEC., CHUNG-CHENG ROAD, CHIA-AN VILLAGE LUNG-TAN, TAIWAN, R.O.C. 5. THE SELLER SHALL SEND A SHIPPING NOTICE TO CSIST BY FAX (#011-886-3-471- 1494) FOR APPROVAL AT LEAST 30 DAYS BEFORE SHIPMENT. CSIST WILL APPROVE THE SHIPMENT WITHIN TWO WORKING DAYS AFTER RECEIPT OF SUCH NOTICE AND NOTIFY CTC/PD TO ISSUE AN APPROVED SHIPPING ADVICE, STATING THAT SHIPMENT IS APPROVED AND CAN BE MADE, THROUGH THE L/C ISSUING BANK TO THE SELLER. THE APPROVED SHIPPING ADVICE ISSUED BY CTC/PD SHALL BE PRESENTED WITH THE SHIPPING DOCUMENTS FOR L/C NEGOTIATION. 6. PAYMENT SCHEDULE: 1ST PAYMENT: * FOR DOCUMENTATION WILL BE MADE AGAINST SHIPPING DOCUMENTS EVIDENCING THE SHIPMENT OF DOCUMENTATION HAVE BEEN DONE. 2ND PAYMENT: * FOR TECHNOLOGY, MATERIAL AND TRAINING AT PARLEX & CSIST WILL BE MADE AGAINST SIGNED SIMPLE RECEIPT AND CTC/PD'S PAYMENT ADVICE THROUGH THE L/C ISSUING BANK AFTER THE COMPLETION OF TRAINING. 3RD PAYMENT: * FOR SAMPLE QUALIFICATION ADMINISTRATION AND PROGRAM MANAGEMENT WILL BE MADE AGAINST SIGNED SIMPLE RECEIPT AND CTC/PD'S PAYMENT ADVICE THROUGH THE L/C ISSUING BANK AFTER THE FINAL ACCEPTANCE OF THE ENTIRE PROGRAM BY THE CSIST. * Confidential information has been omitted and filed separately with the Commission. CENTRAL TRUST OF CHINA REPRESENTATIVE OFFICE IN NEW YORK ONE WORLD TRADE CENTER - SUITE 3857 NEW YORK, NY 10048-0279 Telephone: (212)775-1055-9 Fax: (212)775-0490 CONTRACT NO. YL-7604-5498, 95-GFR3-0453 ATTACHMENT: SPECIAL NOTES (continuing from previous page) 7. ALL SERVICE INCOMES INCURRED IN TAIWAN, R.O.C. WILL BE LEVIED THE BUSINESS INCOME TAX AT PREVAILING RATE AT THE TIME OF PAYMENT. THE CURRENT RATE FOR SAID TAX IS 20%. SELLER HAS TO PAY THE TAX FOR DOING TRAINING AT CSIST AND THE TAX AMOUNT, * WILL BE WITHHELD UPON PAYMENT. 8. EFFECTIVENESS OF THE CONTRACT: THIS CONTRACT WILL BE IN EFFECT AFTER CSIST'S TRAINING AT PARLEX PROGRAM HAS BEEN APPROVED BY THE DEFENSE DEPT. GOVERNMENT OF TAIWAN REPUBLIC OF CHINA. CSIST SHOULD SEND A NOTICE BY FAX TO SELLER (FAX: 508-685-8809) TO EFFECT THE CONTRACT WITH A COPY TO CTC/PD FOR ISSUING THE L/C AFTER THE SAID PROGRAM BEING APPROVED. 9. THE AIR TICKETS FEE AND LIVING EXPENSES FOR CSIST'S PERSONNEL (TRAINEES) SENT TO PARLEX SHALL BE BORNE BY CSIST. HOWEVER, PARLEX SHALL PROVIDE ASSISTANCE IN ARRANGING LOCAL TRANSPORTATION, ROOM AND BOARD, MEDICAL ASSISTANCE, ETC. FOR THOSE TRAINEES. * Confidential information has been omitted and filed separately with the Commission. PARLEX CORPORATION RIGID-FLEX PCB TECHNOLOGY TRANSFER PROPOSAL FOR CENTRAL TRUST OF CHINA AND CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY 16 May 95 TABLE OF CONTENTS Section I - Introduction Section II - Technology Section III - Training Plan Section IV - Documentation Section V - Pricing ---------------------------------------------------------------------------- | This proposal and the entirety of its contents is proprietary to | | Parlex Corporation. Its use is restricted to staff members of CSIST for | | evaluation and it may not be transferred to any other organization without | | the written permission of Parlex. Further the data included must be | | treated as commercially confidential information. | ---------------------------------------------------------------------------- SECTION I INTRODUCTION: Parlex, a Methuen, Massachusetts based corporation is a world leader in the flexible interconnect industry. Founded in 1970, the Company has maintained a focus on flexible and rigid flex circuits and has been a prime influence in the development of this technology. Parlex has a large engineering staff and is active in the development of new interconnect technologies. The Company is highly capitalized and has the proper organization to support a technology sharing venture. CSIST can expect the highest level of support from every level of this organization. SECTION II TECHNOLOGY Introduction 1. QUALIFICATION PROGRAM 2. FLEXIBLE MULTILAYERS 3. FLEX RIGID MULTILAYERS 4. ADHESIVELESS FLEX RIGID MULTILAYERS Qualification Program for Rigid-Flex Printed Wiring Boards Parlex will assist CSIST in the fabrication of Qualification Rigid-Flex printed wiring boards. This program is designed around the ten layer Rigid- Flex board used to qualify manufacturers to fabricate boards which will be in compliance with MIL-P-50884C, the Specification for Flexible and Rigid- Flex Printed Wiring and MIL-STD-2118, the Design Requirements for Flexible and Rigid-Flex Printed Wiring for Electronic Equipment. The board to be fabricated during this program will be manufactured using the artwork for the IPC-A-100043. This has the advantage of incorporating several degrees of difficulty which allow for the evaluation of your process technology as well as demonstrating the ability to fabricate complex Rigid- Flex boards. Parlex has designed this program so that upon successful completion, you should be able to fabricate Zone B level boards and pass the qualification of Zone B level by the Defense Electronics Supply Center (DESC). FLEXIBLE CIRCUITRY ALL FLEXIBLE MULTILAYER CROSS SECTION CU ______ Copper Pad Layer ______ Cover Coat KAPTON ______ Inner Layer COPPER ______ Base Laminate KAPTON ______ Inner Layer COPPER ______ Cover Coat KAPTON ______ Copper Pad Layer CU (Adhesive layers not shown for clarity) FLEXIBLE CIRCUITRY FLEX RIGID MULTILAYER CROSS SECTION CU FR-4 OR GI ______ Double sided rigid board COPPER KAPTON COPPER ______ Single flexible layer KAPTON COPPER FR-4 OR GI ______ Double sided rigid board CU (Adhesive layers not shown for clarity) SECTION III TRAINING REQUIREMENTS 1 - TRAINING AT PARLEX 2 - TRAINING AT CSIST TRAINING AT PARLEX --------------------------------------------------------- | The training program will be centered on the required | | elements for qualification to Mil-P-50884C. | --------------------------------------------------------- CSIST TECHNOLOGY TRANSFER PROGRAM Option I Training at Parlex: The training session at Parlex is critical to successful transfer of technology. The technicians from CSIST will learn every unique element of the rigid flex process and gain first hand experience designing and manufacturing circuits. Training will include the following: 1.0 Flexible Circuit Design 1.1 Design rule layout for various power conditions 1.2 EMI optimization 1.3 Mil-coupon considerations 1.4 Producibility considerations 1.5 Conductor routing and design 2.0 Material 2.1 Compatibility 2.2 Producibility 2.3 Reliability 2.4 Flexibility 2.5 Testing 3.0 Product Process Design 3.1 Mil-P-50884C requirements 3.2 Standard Constructions 3.3 Density issues 3.4 Alternative constructions 4.0 Processing Techniques 4.1 Material prep 4.2 Image 4.3 Etching 4.4 Lamination 4.5 Drill Rout 4.6 Plating 4.7 Photo Develop TRAINING AT PARLEX - Continued --------------------------------------------------------- | The training program will be centered on the required | | elements for qualification to Mil-P-50884C. | --------------------------------------------------------- CSIST TECHNOLOGY TRANSFER PROGRAM Option I 5.0 Assembly 5.1 Soldering (hand and wave) 5.2 Connector prep 5.3 Rigid flex prep 5.4 Assembly considerations 5.5 Dielectric sealing 5.6 Assembly testing --------------------------------------------------------- | Typical Training Sequence | | | | Review Documentation | | | | Classroom Training of Process | | | | Practical Training of Process | | | | Associated Quality Training | --------------------------------------------------------- The intensive course will require students to spend 50 hours a week at Parlex. The course will last 30 days. * Parlex will develop and implement a comprehensive training program for your technical staff and will provide a matrix for material selection for each process. Parlex will also provide the supporting documentation, encompassing Engineering procedures. Quality standards and Manufacturing work instructions. * Parlex personnel will be assigned to work with CSIST technical staff to assure a smooth transition of technical information. TRAINING AT PARLEX - Continued * Parlex will provide a complete list of all equipment that will be necessary for processing advanced products. TRAINING AT CSIST * Engineering and Manufacturing personnel will be available to assist CSIST in Taiwan for 200 hours. * Phase two training will include: 1.0 Quality Assurance: 1.1 Classroom training 1.2 Practical training 2.0 Rigid-flex multilayer board fabrication: Parlex will assist CSIST in the fabrication of ten-layer rigid-flex board using the artwork of the IPC-A-100043) which will be in compliance with MIL-P-50884C. The total time duration for this program is limited to 28 weeks. The time duration for phase one shall be no less than five (5) weeks or six hundred (600) hours. The phase two should start six weeks after the phase one is completed. The time duration for phase two shall be no less than two weeks or two hundred (200) hours. Parlex will provide the exact time schedule for this program. Parlex will provide a matrix for material selection for each process. Parlex will also provide the supporting documentation, encompassing Engineering procedures, Quality standards and Manufacturing work instructions. SECTION IV DOCUMENTATION REQUIREMENTS DOCUMENTATION Parlex will provide CSIST with all of the documentation required to manufacture the advanced products. The attached list represents the level of detail that will be provided to your technical, quality and management staff. The key to any successful technical exchange is a comprehensive documentation package. In addition to providing the documentation, Parlex will also assist CSIST in the establishment of documentation control procedures. Parlex will provide semi-annual updates on the documentation for a period of two years from contract date and will make additional updates available upon request. It should be noted that some documentation is proprietary data and must be treated as CSIST treats its own proprietary information. COMPANY CONFIDENTIAL - ---------------------------------------------------------------------------------------------- Parlex Document List Prefix Number Revision Title - ---------------------------------------------------------------------------------------------- POP 1000 B Documentation and Revision Control POP 1001 - Quality Manual POP 1002 A Document Generation Procedure POP 1003 - Handling and Storage of Resin Impregnated Glass Cloth POP 1004 - Handling, Storage, Packaging, and Delivery POP 1005 - Shipping and Packaging Procedure EPS 1006 - Engineering Change Order Procedure POP 1007 A Control of Nonconforming Product POP 1008 - Indication of Inspection Status POP 1009 - Corrective Action Procedure POP 1010 - Problem Solving Procedure POP 1011 - Contract Review Procedure POP 1012 A Final Inspection Procedure POP 1013 - Electrical Test Procedure POP 1014 - Receiving Inspection Procedure MPS 1015 - Chemical Clean MPS 1017 - Chemical Clean Etch Rate Measurement MPS 1018 - ASI Chemical Clean Water Break Test POP 1019 - Material Review Procedure QCP 1020 - Final Visual Inspection Work Instruction EPS 1022 - On Hold Procedure PMS 1023 - GF Prepreg Specification PMS 1024 - GF Laminate Specification PMS 1025 - GI Prepreg Specification PMS 1026 - GI Laminate Specification MPS 1027 - Chemical Add Notice POP 1029 A Calibration Procedure MPS 1030 - Developing MPS 1031 - Developer pH Control MPS 1032 - Developer Concentration SOW 1033 - Documentation Control Software POP 1034 - Control of Customer Supplied Product POP 1035 - Selection and Approval of Material Suppliers POP 1036 A Purchasing Procedure POP 1037 - Control of Purchased Product POP 1038 A Internal Audit Procedure POP 1040 - Product Identification and Traceability POP 1041 - New Process/Equipment/Material Release Procedure POP 1042 - Process Control Plan POP 1043 - In-process Inspection Procedure QCP 1044 - Quality Plan POP 1045 A Storage and Retrieval of Quality Records POP 1046 - New Employee Orientation MPS 1049 - Automatic Screening ATP 1050 - ED Copper Test Plan MPS 1052 - Developer Direct Bath Addition Procedure MPS 1053 - pH Probe Cleaning and Calibration MPS 1054 - Hand Stamping MPS 1055 - Etch Inspection MPS 1056 - AOI Inspection MPS 1057 - Shipping MPS 1058 - Shearing ATP 1059 - Impedence Test Guideline ATP 1060 - SIR Test MPS 1061 - Trace 948E Tester MPS 1062 - Electrical Test Program Generation MPS 1063 - Procedure F.A.C.T. MPS 1064 - Cross Section, Automatic MPS 1065 - Cross Section, Manual MPS 1066 - Glass Etch MPS 1067 - Pouch Venting and Sealing MPS 1068 - Plasma Desmear and Etchback MPS 1069 - In-process Cross Section MPS 1070 - Nickel/Gold Plating MPS 1071 - Solder Strip MPS 1073 - Developer 1/2 Process Control Plan EPS 1074 - New Order Procedure EPS 1075 - Repeat Order Procedure EPS 1076 - Electrical Test Fixture Generation Procedure ATP 1077 - Cleanliness Testing Procedure MPS 1078 - Production Control (Release of Material) MPS 1109 - Preventive Maintenance - Wave Solderer. MPS 1110 - Conformal Coat MPS 1111 - Clean Potting Molds MPS 1112 - Clean Prior Coat MPS 1113 - Prepare Potting Compound MPS 1114 - Filleting Circuits QCP 1115 - X- Ray MPS 1116 A Copper Solder Plating - Manual line MPS 1117 - Electroless Copper - Manual Line MPS 1118 - Application of Pressure Sensitive Adhesive to Backers/Stiffeners MPS 1119 - Entry/Exit Material Emboss MPS 1121 A Backer Tacking MPS 1122 - Heatsink /Backer Alignment MPS 1123 - Baking Prior to Comp Layup MPS 1124 - Composite Layup/Breakdown MPS 1125 - Dry Film Lamination MPS 1126 - Changing Resist Rolls MPS 1127 - Dry Film Parameter Matrix MPS 1128 - Image EPS 1130 - Engineering Departmental Development Plan EPS 1131 - Panel Pinning Requirements EPS 1132 - Drilling Requirements for Electrical Test Fixtures EPS 1133 - Rout Machine Special requirements EPS 1134 - Drill Machine Special Concerns EPS 1135 - Border Requirements EPS 1136 - Product Scaling Requirements EPS 1137 - Data Archiving EPS 1138 - Tooling Scheme Definitions EPS 1139 - Layering Convenetions EPS 1140 - Modeming Criteria EPS 1141 - Stiffener Programs EPS 1142 - Engineering Hardware and Software EPS 1144 - Spartanics Targets EPS 1145 - Master Pattern Requirements EPS 1146 - Design Rule Checking EPS 1147 - Data Format Requirements EPS 1148 - Shipping and Approving Master Pattern Artwork EPS 1149 - Outside Information Requirements EPS 1150 - Internal Master Pattern Approval EPS 1151 - Artwork Scaling EPS 1152 - Manufacturing Release Procedure EPS 1153 - Compliance Requirements EPS 1154 - A/W Sign off Procedure EPS 1155 - D/P Sign off Procedure EPS 1156 - Tooling Sign off Procedure EPS 1157 - BOM Release Procedure EPS 1158 - Repeat Review Procedure EPS 1159 - New Product Introduction EPS 1160 - Design Quoting Procedure EPS 1161 - Panel Design Review EPS 1162 - Order Entry Requirement EPS 1163 - Prototype Release Procedure EPS 1164 - Product vs. Process Requirements EPS 1165 - Feedback Implementation Procedure EPS 1166 - Vent Hole Requirements EPS 1167 - Soldermask Pullback EPS 1168 - Panel Size & Profiling EPS 1169 - A/W Registration System EPS 1170 - Panel Plating Rack Requirements EPS 1171 - PPE vs. PE Criteria EPS 1172 - Preco Tooling Concepts EPS 1173 - Black vs. Brown Oxide EPS 1174 - Manufacturing Capabilities EPS 1175 - Plasma Etch Standards and Requirements EPS 1176 - Plating Requirements EPS 1177 - Soldermask Requirements EPS 1179 - RTV's EPS 1180 - Rubbers EPS 1181 - Pre-preg Types and Compression's EPS 1182 - Kapton Types EPS 1183 - Laminate Types EPS 1184 - Construction Options EPS 1185 - Pouching Method EPS 1186 - Figure Sheets Requirements EPS 1187 - Marking of Military Parts & Packaging EPS 1188 - Marking of Commercial Parts & Packaging EPS 1189 - Tooling Schemes EPS 1190 - Tool System Entry Procedure EPS 1191 - Cost Estimating and Quoting EPS 1192 - ECO Review for the Quoting EPS 1193 - P.O.Review EPS 1194 - Cancellation Procedure EPS 1195 - Generating APEC Quote EPS 1196 - Steel Rule Dies EPS 1197 - Covercoat Rigistration Fixtures EPS 1198 - Wave Solder Fixture EPS 1199 - Punch Jigs EPS 1200 - Hard Tooling (Blanking Dies) EPS 1201 - Tool Request EPS 1202 - Tool Storage EPS 1203 - Tool Obsoleting Requirements EPS 1204 - Producing and Using Diazo's EPS 1205 - Numbering of Artworks EPS 1206 - Remakes EPS 1207 - Revision Verification EPS 1208 - Tagging Artwork EPS 1209 - Inspection of Artwork EPS 1210 - Obsoleting Artwork EPS 1211 - Drill Program Generation EPS 1212 - Rout Program Generation EPS 1213 - Drill Rout Program Generation EPS 1214 - Cost Estimating and Quoting POP 1227 - Management Review Procedure POP 1228 - Order Entry Procedure MPS 1229 - Vacuum Oven MPS 1230 - Water Break Test EPS 1231 - Soldermask Requirements MPS 1232 - Image MPS 1233 - Image Matrix MPS 1234 - Image - Process Control Plan POP 1235 - Preventative Maintenance Procedures QCP 1238 - Thermal Shock Test QCP 1239 - Moisture and Humidity KEY DESCRIPTION POP Parlex Operating Procedure EPS Engineering Process Specifications MPS Manufacturing Process Specification QCP Quality Control Procedure PMS Parlex Material Specification ATP Acceptance Test Plan Parlex will make available the following documents (as determined applicable) SECTION V PRICING PROPOSAL Definitions: Item 5.1 Technology Rights to proprietary data and intellectual property concerning development, design and production of mil approved rigid flex circuitry - technology transfer. Item 5.2 Supporting Documentation The establishment of a documentation system, all required documentation, documentation updates for two years. Item 5.3 Training Training to be conducted at Parlex for 5 weeks and CSIST for two weeks in preparation for qualifications to Mil-P-50884C. Item 5.4 Materials Materials required to understand characteristics of various constructions, learn testing techniques and build sample products at Parlex and CSIST, fees for filing export license and Mil-P-508842 quality charges. Item 5.5 Equipment (optional item) Parlex has reviewed the equipment list supplied by CSIST. It is our understanding that all required equipment is in place for the production of rigid flex circuits with the following exception: Single drawer mechanical press system; controlled Z axis outlining maching to be used in conjunction with steel rule dies. The cost of new equipment is * . Parlex could supply reconditioned used equipment for * (FOB, Methuen, MA). Item 5.6 Payment Method Payment will be made by an irrevocable letter of credit to Shawmut Bank N.A., 1 Federal Street, Boston, MA 02210, account # 020-074183-9, ABA # 011000206, swift code NASHUS33. * Confidential information has been omitted and filed separately with the Commission. SECTION V 5.7 PAYMENT SCHEDULE - --------------------------------------------------------------------------------------- Accumulated Payment Due Date - --------------------------------------------------------------------------------------- 1. A. Technology * * Completion of Training B. Material * * at Parlex 2. Documentation * * Shipment of Documents 3. Training at Parlex * * Completion of Training at Parlex 4. Training at CSIST * * Completion of Training at CSIST 5. A. Sample Qualification * * Completion of Sample Build and B. Admin. & Program Submittal of Data for Mil Management * * Approval * Confidential information has been omitted and filed separately with the Commission. Parlex will provide the support of any reasonable request for engineering assistance in written from without any charge. If the engineering support in the Buyer's facility is required, within a period of two years, the fee will be * (plus airfare, hotel & subsistence). If refresher training is required by CSIST, after 12 months, the fee will be *. * Confidential information has been omitted and filed separately with the Commission.