SECURITIES AND EXCHANGE COMMISSION
WASHINGTON, D.C. 20549
FORM 8-K
CURRENT REPORT
Pursuant to Section 13 or 15(d) of
the Securities Exchange Act of 1934
Date of Report (Date of earliest event reported)
September 28, 1995
LATTICE SEMICONDUCTOR CORPORATION
(Exact Name of Registrant as Specified in Charter)
Delaware
(State or other jurisdiction of incorporation)
0-18032 93-0835214
(Commission File No.) (IRS Employer Identification Number)
5555 NE Moore Court
Hillsboro, Oregon 97124-6421
(Address of Principal Executive Offices)
(503) 681-0118
(Registrant's Telephone Number, Including Area Code)
Item 5. Other Events
Lattice Semiconductor Corporation (the "Company") signed a definitive
agreement on September 14, 1995 with United Microelectronics Corporation
("UMC") to join several other fabless semiconductor companies in a previously
announced venture to form a separate Taiwanese company for the purpose of
building and managing an advanced semiconductor manufacturing facility in Hsin
Chu City, Taiwan, Republic of China.
Under terms of the agreement, the Company will invest $60 million, payable
in three installments over the next two years, for a 10% equity interest in the
venture. The proposed facility is expected to commence production of eight-inch
sub-micron wafers during the second half of 1997. UMC will transfer its 0.5
micron, and when developed, its 0.35 and 0.25 micron process technologies to the
venture on a royalty free basis. As a result of its equity ownership, the
Company will receive rights to a percentage of the wafer production from the new
facility. Formation of the venture is subject to a number of conditions:
including arrangement of the necessary debt financing and obtaining requisite
government approvals.
In a related arrangement, UMC has committed to supply the Company with sub-
micron wafers beginning in the first calender quarter of 1996 and continuing,
with phased increases, until such capacity is available from the new facility.
Item 7. Financial Statements, Pro Forma Financial Information and Exhibits
(c) Exhibits
10.1 Bridge Capacity Letter dated September 12,1995 between Lattice
Semiconductor Corporation and United Microelectronics
Corporation. (Confidential treatment has been requested with
respect to this exhibit. A full unredacted copy of this exhibit
has been filed with the Securities and Exchange Commission
pursuant to such request.)
10.2 Foundry Venture Side Letter dated September 13, 1995 among
Lattice Semiconductor Corporation, United Microelectronics
Corporation and FabVen. (Confidential treatment has been
requested with respect to this exhibit. A full unredacted copy
of this exhibit has been filed with the Securities and Exchange
Commission pursuant to such request.)
10.3 FabVen Foundry Capacity Agreement dated as of August __, 1995
among FabVen, United Microelectronics Corporation and Lattice
Semiconductor Corporation. (Confidential treatment has been
requested with respect to this exhibit. A full unredacted copy
of this exhibit has been filed with the Securities and Exchange
Commission pursuant to such request.)
10.4 Foundry Venture Agreement dated as of August __, 1995,
between Lattice Semiconductor Corporation and United
Microelectronics Corporation. (Confidential treatment has been
requested with respect to this exhibit. A full unredacted copy
of this exhibit has been filed with the Securities and Exchange
Commission pursuant to such request.)
SIGNATURE
Pursuant to the requirements of the Securities Exchange Act of 1934, the
Registrant has duly caused this report to be signed on its behalf by the
undersigned hereunto duly authorized.
LATTICE SEMICONDUCTOR CORPORATION
Dated: October 2, 1995 By: /s/ Rodney F. Sloss
--------------------
Rodney F. Sloss
Vice President, Finance
LATTICE SEMICONDUCTOR CORPORATION
CURRENT REPORT ON FORM 8-K
INDEX TO EXHIBITS
Exhibit No. Description
10.1 Bridge Capacity Letter dated September 12,1995 between
Lattice Semiconductor Corporation and United
Microelectronics Corporation. (Confidential treatment
has been requested with respect to this exhibit. A full
unredacted copy of this exhibit has been filed with the
Securities and Exchange Commission pursuant to such
request.)
10.2 Foundry Venture Side Letter dated September 13, 1995
among Lattice Semiconductor Corporation, United
Microelectronics Corporation and FabVen. (Confidential
treatment has been requested with respect to this
exhibit. A full unredacted copy of this exhibit has
been filed with the Securities and Exchange Commission
pursuant to such request.)
10.3 FabVen Foundry Capacity Agreement dated as of August
__, 1995 among FabVen, United Microelectronics
Corporation and Lattice Semiconductor Corporation.
(Confidential treatment has been requested with respect
to this exhibit. A full unredacted copy of this exhibit
has been filed with the Securities and Exchange
Commission pursuant to such request.)
10.4 Foundry Venture Agreement dated as of August __,
1995, between Lattice Semiconductor Corporation and
United Microelectronics Corporation. (Confidential
treatment has been requested with respect to this
exhibit. A full unredacted copy of this exhibit has
been filed with the Securities and Exchange Commission
pursuant to such request.)