EXHIBIT 99.1

(GRAPHIC OMITTED)                  BRANDYWINE WEST, 1521 CONCORD PIKE, SUITE 301
                                                            WILMINGTON, DE 19803

                                                          N E W S  R E L E A S E

FOR IMMEDIATE RELEASE                                CONTACT: Elise A. Garofalo
                                                 Director of Investor Relations
                                                                   302-778-8227




         GRAFTECH ACHIEVES KEY COMMERCIAL APPROVALS OF EGRAF(TM)THERMAL
                               INTERFACE PRODUCTS


         Wilmington, DE - May 23, 2002 - GrafTech International Ltd. (NYSE: GTI)
today announced key commercial approvals and sales of its Advanced Energy
Technology (AET) Division's first generation eGraf(TM) 1200 series thermal
interface products to Hitachi, Plus Vision Corporation, Agilent and IBM for use
in a variety of applications including computer, consumer electronic and
telecommunication applications.

         The key approvals by Hitachi and Plus Vision validate the broad use of
the AET Division's eGraf product line in applications across the consumer
electronics industry. Hitachi is one of the world's leading global electronic
companies, manufacturing a wide range of products, including computers,
semiconductors, consumer products and industrial equipment. Hitachi is using
eGraf 1200 products as heat transmitters in its DVD camera models DZ-MV220 and
DZ-MV200. Plus Vision Corp. manufactures ultra-lightweight, ultra-portable
digital projectors. Plus Vision is using eGraf 1200 products as thermal
interface materials in their U3-1000 computer projector.

         The AET Division is also pleased to announce the sale of its eGraf 1200
series thermal interface products to Agilent Technologies, a global diversified
technology organization that provides enabling solutions to high growth markets
within the communications, electronics and life sciences industries. Agilent
will use these products in power converters, such as DC/DC and AC/DC converters,
for telecommunication applications.

         In addition, AET's eGraf 1200 series thermal interface products have
been qualified in a number of chip testing devices at various companies,
including IBM, the world's top provider of computer hardware and Enplas, a
leading manufacturer of chip testing devices.




         "The expansion of our sales of 1200 series thermal interface products,
our first generation material, into new applications clearly demonstrates the
commercial acceptance of our eGraf technology and the broad array of end
applications for these products." commented Scott Mason, President of the
Advanced Energy Technology Division. "We expect to continue to report on product
development and commercialization successes during 2002."

         The eGraf 1200 series products were introduced in December 2000, as
next generation materials for the electronic thermal management marketplace. In
December 2001, the Company introduced its new, advanced HiTherm series interface
products, which deliver performance levels beyond leading products such as phase
change materials. The HiTherm series products are moving into planned
commercialization during the 2002 second quarter.

         The eGraf electronic thermal management product line offers a full
range of thermal solutions and provides superior thermal performance. The eGraf
electronic thermal management product family includes thermal interface
components, heat sink components and other products that require thermal,
mechanical and EMI solutions.

         GRAFTECH INTERNATIONAL LTD. IS ONE OF THE WORLD'S LARGEST MANUFACTURERS
AND PROVIDERS OF HIGH QUALITY NATURAL AND SYNTHETIC GRAPHITE AND CARBON BASED
PRODUCTS AND SERVICES, OFFERING ENERGY SOLUTIONS TO INDUSTRY-LEADING CUSTOMERS
WORLDWIDE ENGAGED IN THE MANUFACTURE OF STEEL, ALUMINUM, SILICON METAL,
AUTOMOTIVE PRODUCTS AND ELECTRONICS. WE HAVE 13 MANUFACTURING FACILITIES IN 7
COUNTRIES AND ARE THE LEADING MANUFACTURER IN ALL OF OUR MAJOR PRODUCT LINES. WE
PRODUCE GRAPHITE ELECTRODES THAT ARE CONSUMED PRIMARILY IN THE PRODUCTION OF
STEEL IN ELECTRIC ARC FURNACES, THE STEEL MAKING TECHNOLOGY USED BY ALL
"MINI-MILLS," AND FOR REFINING STEEL IN LADLE FURNACES. WE ALSO PRODUCE CARBON
ELECTRODES THAT ARE CONSUMED IN THE MANUFACTURE OF SILICON METAL AND CATHODES
THAT ARE USED IN THE PRODUCTION OF ALUMINUM. IN ADDITION, WE DEVELOP AND
MANUFACTURE NATURAL GRAPHITE FOR USE IN MATERIALS AND COMPONENTS FOR PROTON
EXCHANGE MEMBRANE FUEL CELLS AND FUEL CELL SYSTEMS, THERMAL INTERFACE PRODUCTS
FOR COMPUTER, COMMUNICATIONS AND OTHER APPLICATIONS, FIRE RETARDANT PRODUCTS FOR
TRANSPORTATION APPLICATIONS AND BUILDING AND CONSTRUCTION MATERIALS
APPLICATIONS, INDUSTRIAL THERMAL MANAGEMENT PRODUCTS FOR HIGH TEMPERATURE
PROCESS APPLICATIONS, AND CONDUCTIVE PRODUCTS FOR BATTERIES AND SUPERCAPACITOR
POWER STORAGE APPLICATIONS. GRAFCELL(TM), GRAFGUARD(TM) , GRAFOIL(R),
GRAFSHIELD(TM) AND EGRAF(TM) ARE TRADEMARKS OF OUR SUBSIDIARY. FOR ADDITIONAL
INFORMATION ON GRAFTECH INTERNATIONAL, CALL 302-778-8227 OR VISIT OUR WEBSITE AT
WWW.GRAFTECHINTERNATIONAL.COM. FOR ADDITIONAL INFORMATION ON GRAFTECH INC., CALL
216-529-3777 OR VISIT ITS WEBSITE AT WWW.GRAFTECH.COM. FOR ADDITIONAL
INFORMATION ON OUR HIGH TECH HIGH TEMP BUSINESS UNIT, CALL 216-676-2100 OR VISIT
ITS WEBSITE AT WWW.HT2.COM.

         NOTE: THIS NEWS RELEASE CONTAINS FORWARD-LOOKING STATEMENTS AS DEFINED
IN THE PRIVATE SECURITIES LITIGATION REFORM ACT OF 1995. THESE INCLUDE
STATEMENTS ABOUT SUCH MATTERS AS PRODUCT APPROVALS, SALES, DEVELOPMENT,
PERFORMANCE, ADVANTAGES, COMMERCIAL ACCEPTANCE AND COMMERCIALIZATION. WE HAVE NO
DUTY TO UPDATE SUCH STATEMENTS. ACTUAL FUTURE EVENTS AND CIRCUMSTANCES
(INCLUDING FUTURE PERFORMANCE, RESULTS AND TRENDS) COULD DIFFER MATERIALLY FROM
THOSE SET FORTH IN THESE STATEMENTS DUE TO VARIOUS FACTORS. THESE FACTORS
INCLUDE RISKS GENERALLY ENCOUNTERED WITH COMMERCIAL LAUNCH AND ACCEPTANCE OF NEW
PRODUCTS, THE OCCURRENCE OF UNANTICIPATED EVENTS OR CIRCUMSTANCES RELATING TO
RESEARCH, DEVELOPMENT AND COLLABORATION ACTIVITIES, CHANGES IN STRATEGIC PLANS
OR PROGRAMS, CHANGES IN GLOBAL OR REGIONAL ECONOMIC AND COMPETITIVE CONDITIONS,
TECHNOLOGICAL DEVELOPMENTS, AND OTHER RISKS AND UNCERTAINTIES, INCLUDING THOSE
DETAILED IN OUR FILINGS WITH THE SECURITIES AND EXCHANGE COMMISSION.