EXHIBIT 99.1
FOR: BE SEMICONDUCTOR INDUSTRIES N.V.
Marconilaan 4
5151 DR Drunen
The Netherlands
PRESS RELEASE
BE SEMICONDUCTOR INDUSTRIES REPORTS PRELIMINARY NET SALES FOR THE SECOND
QUARTER OF 2005
* Sales of Aproximately E 37 Million Up 1% over First Quarter of 2005 *
* Orders of Approximately E 38 Million Down Approximately 5% over
First Quarter of 2005 *
* Book-to-Bill Ratio of Approximately 1.3 *
Drunen, the Netherlands, July 5, 2005, BE Semiconductor Industries N.V. ("the
Company" or "Besi") (Nasdaq: BESI; Euronext: BESI), a leading manufacturer of
assembly equipment for the semiconductor industry, today announced preliminary
sales for the second quarter ended June 30, 2005.
Net sales for the second quarter ended June 30, 2005 are expected to be
approximately E 37 million, an increase of 1% as compared to E 36.6 million for
the first quarter of 2005, and a decrease of approximately 23% as compared to
pro forma net sales of E 48.3 million in the second quarter of 2004 (the pro
forma information reflects the acquisition of Datacon as if such transaction had
occurred on January 1, 2004). Orders for the quarter ended June 30, 2005 totaled
approximately E 38 million, a decrease of approximately 5% as compared to E 40.3
million for the first quarter of 2005 and a decrease of approximately 43% as
compared to pro forma orders of E 66.8 million in the second quarter of 2004. In
addition, backlog was up slightly to approximately E 55.5 million at June 30,
2005 as compared to E 54.5 million at March 31, 2005 and increased approximately
9% as compared to a pro forma backlog of E 50.9 million at December 31, 2004.
Richard W. Blickman, President and Chief Executive Officer of the Company,
commented: "We are disappointed with preliminary indications of our second
quarter net sales and orders. The net sales shortfall versus our expectations
was due primarily to unanticipated delays in shipments of two orders aggregating
to approximately E 6 million by two major customers for certain assembly and
test handling production equipment. We currently expect to ship these orders in
the third and fourth quarters of 2005. In addition, we see in our second quarter
order book that customers continue to remain cautious in placing purchase orders
for assembly equipment, a trend that has resulted in fluctuating levels of
bookings in recent quarters. Based on input from certain customers and industry
sources, we could see a positive development of assembly equipment orders in the
second half of our fiscal year, but anticipate that quarterly bookings will
continue to fluctuate."
BE Semiconductor Industries N.V. designs, develops, manufacturers, markets and
services die sorting, flip chip bonding and multi-chip die bonding, packaging
and plating equipment for the semiconductor industry's assembly operations. Its
customers consist primarily of leading U.S., European, Asian, Korean and
Japanese semiconductor manufacturers and subcontractors which utilize its
products for both array connect and conventional leadframe manufacturing
processes.
CAUTION CONCERNING FORWARD LOOKING STATEMENTS
This press release contains forward-looking statements, which are found in
various places throughout the press release, including statements relating to
expectations of orders, net sales, product shipments, expenses, operating
results and the impact of the acquisition of Datacon on Besi's net income in
fiscal year 2005. The words "anticipate", "estimate", "expect", "intend", "may",
"plan", "predict", "project", "will", "would", and similar expressions are
intended to identify forward looking statements, although not all forward
looking statements contain these identifying words. While these forward-looking
statements represent our judgments and future expectations concerning the
development of our business, a number of risks, uncertainties and other
important factors could cause actual developments and results to differ
materially from our expectations. These factors include, but are not limited to,
those listed or discussed in our Annual Report on Form 20-F for the year ended
December 31, 2004, as well as the risk that anticipated orders may not
materialize or that orders received may be postponed or cancelled, generally
without charges; the volatility in the demand for semiconductors and our
products and services; acts of terrorism and violence; overall global economic
conditions; risks, such as changes in trade regulations, currency fluctuations,
political instability and war, associated with substantial foreign customers,
suppliers and foreign manufacturing operations; potential instability in foreign
capital markets; the risk of failure to successfully manage our expanding and
more diverse operations; and other key factors that could adversely affect our
businesses and financial performance contained in our filings and reports,
including those with the United States Securities and Exchange Commission. We
are under no obligation to (and expressly disclaim any such obligation to)
update or alter our forward-looking statements whether as a result of new
information, future events or otherwise.
CONTACTS:
Richard W. Blickman Cor te Hennepe
President and CEO Director of Finance
Tel. (31) 416 384345 Tel. (31) 416 384345