EXHIBIT 99.1

Microsemi Expands 3G Focus with InGaP/GaAs HBT Technology

BusinessWire, Wednesday, March 01, 2000 at 08:08

SANTA ANA, Calif.--(BUSINESS WIRE)--March 1, 2000--

Infinesse HBT Products to Round Out Microsemi's Portfolio for Next-
Generation Multimedia Mobile Communication and Internet Applications
Represents Fourth Acquisition Aimed at
Wireless Broadband Communications Market

Microsemi Corporation (NASDAQ:MSCC) today announced that it has completed the
acquisition of the HBT Business Products Group of Infinesse Corporation for
cash, notes and convertible debentures aggregating $6 million; plus 312,000
shares of Microsemi common stock and contingent payments based upon future HBT
product design royalties for designs completed prior to the acquisition.

Under the terms of the agreement, Microsemi will hold 80 percent of the stock of
a subsidiary, which purchased and will operate the ongoing business of the HBT
Business Products Group. The remaining 20 percent of the stock of the new
subsidiary will be held by employees and former owners of the HBT Business
Products Group.

This acquisition rounds out Microsemi's product portfolio for next generation
multimedia mobile communication and Internet products. The acquisition follows
three successive acquisitions that highlight a refocus of Microsemi's strategy
toward becoming a major supplier of components in the fast growing wireless
broadband communications markets.

The HBT business products group, headquartered in Los Angeles, brings Microsemi
more than 100 man-years of RF and HBT-related expertise in III-V Compound
(primarily Gallium Arsenide and Indium Gallium Phosphide), and SiGe
semiconductors for advanced cellular, PCS and 3G, BlueTooth and 5.7 GHz LAN
Applications.

The Infinesse acquisition is part of Microsemi's strategy of expanding product
offerings into the high growth wireless, broadband and the analog and mixed
signal IC sectors. This new focus started with the acquisition of the RF
Products Group of SGS Thompson, followed by the purchases of LinFinity
Microelectronics Inc. and Narda Microwave Semiconductor and finally the
establishment of the company's San Diego Design Center, which specializes in
ultra low-power ASICs for battery powered applications.

The HBT group comes to Microsemi with experience at TRW where they provided the
HBT technology and initial manufacturing to RF Micro Devices. Dr. Michael Kim,
president of Infinesse, was responsible for introducing this technology to TRW
for high performance military satellite communication applications. Kim left TRW
to explore commercial applications for this technology with Korean and domestic
suppliers where their designs have been used in PCS/CDMA HBT Amplifiers.


Kim commented, "We were approached by several leading device manufacturers who
saw our expertise and product designs as being a vehicle to expand into these
dynamic high growth markets. After a period of evaluating the best fit for my
team and our goals to be a major player in the value added portion of the
wireless hand held market, we saw Microsemi's commitment to grow in these areas,
together with their recent acquisitions, as being the combination of resources
necessary to be successful in these exciting markets."

Microsemi plans to develop and ultimately produce a full set of single-function
packaged devices, multi-function multi-chip modules (MCM) with Advanced Power
Management techniques designed to improve RF amplifier linearity and efficiency.
Infinesse has a number of next generation HBT products under design for 3G
applications. These products will be co-developed with the Microsemi Linfinity
(Garden Grove, Calif.) and MicroPower Products (Carlsbad, Calif.) system and
device design groups and are expected to include multi-function RF modules for
cellular (800-950MHz), PCS (1.7-1.9 GHz) and 3G (2 GHz) applications with the
focus on CDMA and W-CDMA technologies. In the ISM Band, Microsemi's focus is
intended to be for Bluetooth (2.4 GHz) and LAN/Data (5.7 GHz) applications.

With the acquisition of Infinesse's HBT Amplifier group, Microsemi now has a
large complement of products in development or production for next generation
multimedia phones and radios. In addition to the HBT amplifiers, these include
Powermite(R) packaged battery protection Schottky diodes, micro-miniature high
speed EPSM/MMSM packaged varactors and Schottky limiters for antenna switches
and voltage control oscillators, CCFL backlight control ICs for true color
displays, transient protection products for data port ESD protection and Class D
high efficiency/low battery drain Audio ICs for high fidelity portable sound.

Manuel Lynch, Microsemi's worldwide marketing director commented, "In the next
three years, we're expecting a wide range of new applications, including mobile
phones, PDAs and household appliances to be tied into wireless broadband
communication networks. We believe that without the advent of next generation
high frequency InGaP HBT amplifiers, users will not be able to access the
anticipated multimedia data streams."

Lynch points to the shortages of RFICs seen in the marketplace today stating
that "we believe the suppliers cannot currently keep up with current 2G
requirements, the growth demands for next generation multimedia phones and
wireless PDAs, which are estimated to account for 330 million units of the
entire handset market by 2003 and an estimated 57 percent per year growth rate
in power amplifiers according to Strategies Unlimited. We believe that our
present and anticipated product offerings for multimedia phones will be as high
as $12 per phone and will make us a significant player in the future of mobile
communications."

He continued, "Infinesse has qualified foundry, as well as merchant assembly and
test capability, to handle their immediate production needs. However, as part of
Microsemi, we will expand these resources by allocating a portion of our
existing device fabrication capability to HBT products. Additionally, we will
use our existing relationships with high volume, low cost off-shore assembly and
test contractors to help to support the Infinesse products."


Commenting on the acquisition, Philip Frey Jr., president, CEO and chairman of
Microsemi stated, "We believe there is strong synergy developing among the
recent acquisitions and design centers. Our RF, Power Management, and Audio
expertise at the three new centers -- Linfinity, Microwave Products and
MicroPower Products -- is very complementary and we find ourselves able to draw
on extensive experience to develop the best of class next generation RF and
Power Management Products."

RF, Power Management and TVS protection products now account for more than 50
percent of Microsemi's revenues.

Microsemi will conduct a conference call March 1, 2000, at 1:45 pm PST to
discuss and answer questions about the acquisition. To participate in the call
dial 800/280-2151 or 415/904-2417 ten minutes prior to the scheduled call. A
replay of the conference call will be available from 3:45 pm PST on March 1
until 3:45 pm PST on March 8. The replay of the conference call my be heard by
calling 800/633-8284 or 858/812-6440; the reservation number is 14567271.

This conference call will also be broadcast live over the Internet and can be
accessed by all interested parties at www.vcall.com. To listen to the live call,
please go to the Web site at least 15 minutes prior to the start of the call to
register, download and install any necessary audio software. There will also be
a replay available shortly after the call on the Vcall site for 90 days.

About Microsemi Corp.

Microsemi Corp. is a global supplier of RF/Microwave, power management,
transient suppression and power conditioning semiconductor devices. It serves
the telecommunications, computer and peripherals, medical,
industrial/commercial, satellite and military/aerospace markets with high
reliability and commercial analog integrated circuits and power and signal
discrete semiconductors. More information may be obtained by contacting the
company directly or by visiting its Web site at http://www.microsemi.com.

"Safe Harbor" Statement under the Private Securities Litigation Reform Act of
1995: All of the statements set forth in the news release that are an expression
of management's views or beliefs and all statements that are not expressly
historical in nature are forward-looking statements. Forward-looking statements
are inherently subject to risks and uncertainties, some of which cannot be
predicted or quantified.

Potential risks and uncertainties include, but are not limited to, such factors
as the difficulties regarding the making of estimates and projections, the
hiring of qualified technical personnel in a competitive labor market, rapidly
changing technology and product obsolescence, the ability to realize cost
savings or productivity gains, potential cost increases, the strength and
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the company's products, the success of planned development, marketing and
promotional campaigns, changes in demand for products, difficulties of
foreseeing future demand, potential non-realization of backlog, business and
economic conditions such as the current industry conditions, customer order
preferences, company strategies, environmental matters, litigation and inventory
obsolescence.


In addition to these and any other factors mentioned elsewhere in this news
release, refer as well to the factors identified in the company's most recent
Form 10-K and subsequent Forms 10-Q filed by the company with the Securities and
Exchange Commission.



CONTACT: Microsemi Corporation, Santa Ana

David R. Sonksen, 714/979-8220 (Investors)

Fax: 714/966-5256

Cliff Silver, 714/372-8357 (Editorial)

Fax: 714/372-3566

Manuel Lynch, 714/979-8220 (Technical)

Fax: 714/966-5256

Coffin Communications, Sherman Oaks, Calif.

Sean Collins/William F. Coffin, 818/789-0100 (Investors)