EXHIBIT 99.9
Header of all slides
[Logo] Microsemi more than solutions - enabling possibilities
Analyst Day | 11/7/2001 |
http://www.microsemi.com
Slide 1
MMSM - the RF and LED Patented Architecture
Ken Philpot, Director of Applications, Microsemi Microwave
Manuel Lynch, VP of Business Development
Slide 2
What sets us apart in Microwave?
. Product & Process diversity: More tools in our toolbox!
- Products
- PIN Diodes for Switching, Attenuating and Limiting
- Varactor Diodes for VCOs
- Schottky Diodes for Detection and Up/Down Conversion
- Packaging
- Ceramic for Military and Space (up to 40GHz)
- Innovative Flip Chip for High Speed commercial applications (WLAN
802.11a)
- Processes
- Automated Microwave Fab
- Package-less technology
- Diversity ranges from Silicon to InGaN
. Rich experience in military microwave
- Over 30 years experience
- Our heritage is engineering performance
. We understand microwave - we speak the language
- We solve problems
Slide 3
What is Microwave?
- --------------------------------------------------------------------------------
100% | | | MMSM |
| DO-7 | EPSM |
| DO-14 | | Microwave |
| | SOT23 Microsemi Monolithic |
| | SOD323 Enhanced Surface Mount|
Package | | Performance |
Functionality Glass Axial | Surface Mount Wafer Scale |
50% Leaded | | Substrate |
| 5 thru hole | (circa 1995) |
| (circa 1960) | | (circa 2000 |
| | | | |
| LP= 5nH | LP= 0.5nH LP= 0.2nH |
| | | | |
| | Plastic | |
0% | Injection | |
| molded | |
| S.M. | |
| (circa 1980) | |
| | | |
| LP= 2nH | |
| | | |
- --------------------------------------------------------------------------------
DC 0.5 1 2 3 4 5 6 7 8 9 10
Frequency (GHz)
Slide 4
What exactly is MMSM?
. MMSM stands for Monolithic Microwave Surface Mount packaging
. MMSM is a wafer scale surface mount packaging concept that offers greatly
reduced parasitics:
- low package inductance
- low series resistance
- low package capacitance
. Properties which limit bandwidth and microwave frequency functionality
. It is a Microsemi patented technology
[picture of a dime with component on top of it]
Slide 5
Why did we decide to make MMSM?
. It's all about bandwidth! Customers needed a solution.
- 10% bandwidth at 2.4 gHz = 240 mHz
- 10% bandwidth at 5.6 gHz = 560 mHz
. Surface mount packaging has always limited the performance of microwave
devices
. Higher frequency functionality means more available bandwidth which means
higher speed telecommunications data rates
Slide 6
MMSM: Design Criteria
Must Have Why What Did We Do
- ----------------------- ----------------------- --------------------
Must be monolithic performance and price
Must be small reduces parasitics Developed
MMSM
Must perform like unpackaged reduces parasitics Smaller is Better
chip but without wirebonds
Must have superior thermals power handling/cost
to Gallium Arsenide to performance ratio
[schematic] Top, Cathode Indicator, 0.040", Side, 0.015", 0.020", Bottom,
0.019". 2 PLCS, 0.011", 0.016", 0.012", Gold Pads, 2 PLCS, All
Dimension Tolerances are +- .002"
[graphic of component]
Slide 7
MMSM: Additional Design Criteria
. Must have superior consistency to function > 4 gHz
. Must be hermetic - for military communication applications
. Must be deliverable on wafer or tape & reel for high volume / low cost
applications
- Direct pick and place from wafer to tape and reel
. Must be completely compatible with conventional surface mount assembly
- Standardized first versions on 0204 ceramic chip capacitors
. Must offer a platform process which can be expanded to house other products
- Transistors (gain blocks, LNAs, etc)
- LEDs
Slide 8
The Recipe: Creating MMSM
. Patented process
. Importance of Know How
. Key Processes
- Build diode from top side
- Proprietary high temperature glass isolation step - separate contacts
- Protect junction
- Develop interconnects that replace wire bonds
- Seal in Glass
- Backlap to predetermined depth to make backside - "flip chip" contacts
- Electrical Probe
- Pick and place to tape and reel
. What you see is what you get
[graphic of component]
[picture of component]
Slide 9
MMSM vs. Competing Packages
Package Comparisons
Package Style Outline Size Package Parasitic Maximum Frequency Construction
- ------------- ------------ ----------------- ----------------- ------------
SOD-323 50x70 mils 1500 pH 2.5 gHz Injection molded
plastic / lead frame
SC-79 30x60 mils 700 pH 4 gHz Injection molded
plastic / lead frame
MMSM 20x40 mils 200 pH 10 gHz Monolithic Silicon/
Glass
Slide 10
MMSM Specs vs. The Competition
Device Comparisons
Device Capacitance Functional To
- --------- ----------- -------------
SMP 1320 300 fF 2.5 gHz
BAR63-02L 300 fF 2.5 gHz
MPP 4203 100 fF 8 gHz
Slide 11
Ahead of the Game - NanoMOUNT
. Most customers are building antenna switches with our MSMM technology
. We simplified the design cycle and accelerated the utilization of our
packaging by offering complete switches
- Take 4 MMSM PIN devices / Combine on EPSM substrate in ring
[picture of a dime with antenna switches next to it]
A complete 5 gHz WLAN spatial diversity switching solution on a single 100mil
square surface mountable platform!
Slide 12
NanoMount vs GaAs MESFET
GaAs MESFET SPDT switch Microsemi Silicon Nanomount switch
-------------------------- ----------------------------------
Bandwidth DC to 2500 MHz 100 to 6000 MHz
Isolation: 900 MHz (LMDS) 23 dB typical 40 dB typical
2400 MHz (PCS) Not Specified 30 dB typical
5600 MHz (WLAN) Not Useable 20 dB typical
Insertion loss 900 MHz (LMDS) 1 dB typical 0.25 dB typical
2400 MHz (PCS) Not Specified 0.5 dB typical
5600 MHz (WLAN) Not Useable 1 dB typical
Power Handling 1 Watt 10 Watts
Third order IP + 39 dBm Typical + 39 dBm Typical
Switching Speed Not Specified 10 nS typical
Package Construction SOT-23-5 Plastic injection MMSM hermetic-
molded lead frame; on-microstrip
EPSM ceramic;
Overall Footprint 118 X 122 mils maximum 75 X 100 mils maximum
Bias supply 0 to +8 V +/- 20 mA
Control supply -1 to +6 V Reverse bias polarity
Slide 13
Typical NanoMOUNT Application
[schematic] Antenna 1, Antenna Diversity Switch, Antenna 2, Band Pass Filter,
TX/RX Switch, LNA, RF/IF Conversion Chip(s), PA, Low Pass Filter,
Baseband Chip Set
[picture of Band Pass Filter]
[picture of Switches]
Slide 14
Ahead of the Curve
. We develop solutions that meet next generation standards
- 802.11a WLAN & HiperLAN/2 (developed switches in CY99)
- 802.16 high power point to multi point (developed in CY99)
- Multi mode 2.4 gHz & 5.6 gHz access - not yet offered in the market (we
developed a solution in CY99)
- WCDMA & point to point backbone infrastructure - need solution that can
handle power and heat (we were well ahead of the market)
- Supporting test equipment applications (we help test companies develop the
products that keep telecommunication systems up and running and evolving)
. Markets catch up to our technological advances
Slide 15
MMSM as an LED
Manuel Lynch
Slide 16
Using MMSM for LED
. Eliminates EPOXY
- Optical parasitic
. Eliminates Wirebond
- Reduces VF
- Increases reliability
. Increases Active Area of Light Emitting Structure
. Reduces ESD
- Some competitors integrate TVS devices on their LEDs
. On chip probing
- Self packaged
. Integrated Reflector cup
. Low Thermal Resistance
- Can handle more power and produce more light
[graphic of Typical CREE LED Installation]
[graphic of Typical Nichia LED]
[graphic of Microsemi MMSM Blue LED]
(Components in the above graphics: Epoxy, Glass, InGaN Junction, Contact Pads,
Wire Bond, and Metallized Trace)