EXHIBIT 3

     TOWER SEMICONDUCTOR SECURES FIRST VOLUME PRODUCTION ORDER FOR FAB 2 FROM
                             ALLIANCE SEMICONDUCTOR


MIGDAL  HAEMEK,  ISRAEL  -  APRIL  23, 2003 - Tower Semiconductor (NASDAQ: TSEM;
TASE:  TSEM)  has  achieved a significant objective by securing the first volume
production  order  for  its  new  manufacturing  facility,  Fab  2.  Alliance
Semiconductor  (NASDAQ:  ALSC)  placed a volume order for the manufacture of its
4-Mb,  asynchronous  SRAM  using  Tower's  0.18-micron process technology. Tower
expects  to  begin  commercial  shipments  of  the  product  in  mid-2003.

Tower's  new  state-of-the-art  wafer  fab  is  dedicated  to  the production of
semiconductor  devices  with  0.18-micron and lower geometries. Alliance, one of
Tower's four wafer partners, invested approximately $75 million in Tower for Fab
2's  construction.

"This  order  marks  a key milestone for Fab 2 and for Tower. By starting volume
production we are on our way to filling our new fab's capacity, which is a vital
part  of  our  global  growth  strategy,"  said  Harold  Blomquist,  senior vice
president  of  Tower  Semiconductor  Ltd.  and  chief executive officer of Tower
Semiconductor  USA.  "As  a  major  investor  in  Fab  2,  Alliance  has further
demonstrated  its  support  in the future of Fab 2 by working closely with us on
this  and  other  products."

A  fabless  semiconductor  company,  Alliance  Semiconductor  provides
high-performance memory, mixed signal and systems solutions products. Alliance's
Fast  Async  SRAM  product,  which  was  qualified  in  Tower's  prototyping and
pre-production phases, is the first product Tower will manufacture for Alliance.
The  product  will  be used with mainstream digital signal processors (DSPs) and
microcontrollers.

ABOUT ALLIANCE SEMICONDUCTOR
Alliance  Semiconductor  Corporation  is a leading worldwide provider of memory,
mixed  signal  and  system  solutions  for  networking,  wireless,  consumer and
computing  markets.  Through  these integrated business units, Alliance provides
leading  OEMs  with  synchronous and fast asynchronous SRAMs and super low-power
and  pseudo SRAMs, high-speed chip-to-chip interconnects based on HyperTransport
technology  and  mixed  signal  products  for Electromagnetic Interference (EMI)
management.  Alliance develops and manufactures its products through independent
manufacturing  foundries  using  advanced  CMOS  process  technologies with line
widths  as narrow as 0.13-microns. Founded in 1985, Alliance is headquartered in
Santa  Clara,  California. Additional information is available on Alliance's Web
site  at:  http://www.alsc.com.

ABOUT  TOWER  SEMICONDUCTOR  LTD.
Tower Semiconductor Ltd. is a pure-play independent wafer foundry established in
1993. The company manufactures integrated circuits with geometries ranging from
1.0 to 0.18 microns; it also provides complementary manufacturing services and
design support. In addition to digital CMOS process technology, Tower offers
advanced non-volatile memory solutions, mixed-signal and CMOS image-sensor
technologies. To provide world-class customer service, the company maintains two


manufacturing facilities: Fab 1 has process technologies from 1.0 to 0.35
microns and can produce up to 20,000 150mm wafers per month. Fab 2 features
0.18-micron and below process technologies, including foundry-standard
technology, and will offer full production capacity of 33,000 200mm wafers per
month. The Tower Web site is located at www.towersemi.com.

Safe Harbor
This press release includes forward-looking statements, which are subject to
risks and uncertainties. Actual results may vary from those projected or implied
by such forward-looking statements. Potential risks and uncertainties include,
without limitation, risks and uncertainties associated with (i) obtaining
required approvals of the shareholders of the Company and regulatory
authorities, to the amendment to the Fab 2 investment agreements, (ii) raising
$22 million before the end of 2003, which is a condition to our major
shareholders payment of the remaining portion of the fifth milestone, (iii)
conditions in the market for foundry manufacturing services and in the market
for semiconductor products generally, (iv) obtaining additional business from
new and existing customers, (v) obtaining additional financing for the Fab 2
project from wafer partners and/or equity partners and/or other sources, (vi)
any failure by Tower to raise additional funding by the deadlines set forth in
its agreement with its banks and/or a failure by Tower to reach an agreement
with its banks to extend the deadlines to raise additional financing in 2003
and/or failure by Tower to get the approval of its banks to the amendment to the
investment agreements, which would result in an event of default of Tower's loan
agreement, in which event the banks would have the right to call the loans and
exercise its liens against Tower's assets, (vii) a declaration of default by
Tower's wafer partners, financial investors and the Investment Center of the
State of Israel should Tower's banks call the loans, (viii) satisfaction of all
other conditions under the agreements with the Fab 2 equity and wafer partners,
the Israeli Investment Center and Tower's banks, (ix) completing the
construction of a new wafer manufacturing facility, (x) successful completion of
the development and/or transfer of advanced CMOS process technologies to be
utilized in Tower's existing facility and in Fab 2, (xi) market acceptance and
competitiveness of the products to be manufactured by Tower for customers using
these technologies, (xii) ramp-up of production at Fab 2 and (xiii) possible
loss of our exclusive foundry license with Saifun if we fail to meet certain
sales levels and other conditions.

A  more  complete  discussion  of  risks  and  uncertainties that may affect the
accuracy of these statements, and Tower's business generally, is included in the
documents  we  file  with  the  Securities  and  Exchange  Commission.


                                      # # #

PR  Agency  Contact     Investor  Relations  Contact    Corporate  Contact
Julie  Lass             Sheldon  Lutch                  Tamar  Cohen
Loomis  Group           Fusion  IR  & Communications    Tower Semiconductor Ltd.
+1  (713)  526  3737    +1  (212)  268  1816            +972-4650-6998
lassj@loomisgroup.com   sheldon@fusionir.com            pr@towersemi.com