Exhibit 99.1

Ibis Technology Announces Customer Acceptance of Oxygen Implanter; Customer now
positioned to become significant supplier of SIMOX-SOI wafers to the global
semiconductor industry

     DANVERS, Mass.--(BUSINESS WIRE)--Sept. 14, 2004--Ibis Technology
Corporation (Nasdaq NM: IBIS), a leading provider of SIMOX-SOI implantation
equipment to the worldwide semiconductor industry, today announced final
customer acceptance of the Ibis i2000 oxygen implanter that was ordered by a
leading silicon wafer manufacturer in February of this year and shipped to that
customer in May.
     Martin J. Reid, president and chief executive officer of Ibis Technology
Corporation, said, "Based on our customer's request for an expedited acceptance
process, the final installation, assembly and testing of this implanter were
completed ahead of schedule. We expect this customer to begin producing
300-millimeter SIMOX-SOI wafers immediately, ultimately providing an additional,
highly qualified source of supply for SIMOX-SOI wafers to the semiconductor
industry."
     "We believe that the world's leading wafer manufacturers are
best-positioned to meet the demand for production volumes of SOI wafers for the
global semiconductor industry," said Reid. "With SOI technology continuing to be
adopted by the leading chip manufacturers, the timing is excellent for this
customer to capitalize on their silicon wafer expertise and leverage their
know-how to gain share in the rapidly growing SOI marketplace."
     Reid added, "It is our goal to be the dominant supplier of oxygen
implantation equipment to the world's wafer manufacturers so they can, in turn,
be the most efficient and cost-effective supplier of SOI wafers to the
semiconductor industry."
     As a result of this customer acceptance, Ibis plans to recognize revenue of
approximately $7 million for this implanter in the current fiscal quarter,
ending September 30.

     About SIMOX-SOI

     Silicon-on-Insulator (SOI) is a manufacturing technology where an
insulating layer is created within a silicon wafer, isolating the top layer of
silicon where the active transistors will be manufactured from the rest of the
bulk silicon wafer. The buried oxide layer acts as a barrier that reduces
electrical leakage from the transistors, resulting in semiconductor devices that
are faster and more power efficient. These benefits make SOI a valuable
technology for chipmakers producing IC's for high performance applications such
as servers and workstations, portable and desktop computers, wireless
communication devices, integrated optical components and automotive electronics.
     Separation-by-IMplantation-of-OXygen (SIMOX) refers to a technique used to
manufacture SOI wafers where an oxygen implanter creates a very thin insulating
layer within the wafer, just below a thin layer of silicon on the top of the
wafer. Ibis believes that, compared to competing technologies, the SIMOX process
offers high quality SOI wafers at competitive costs in production quantities.

     About Ibis Technology

     Ibis Technology Corporation is a leading provider of oxygen implanters for
the production of SIMOX-SOI (Separation-by-Implantation-of-Oxygen
Silicon-On-Insulator) wafers for the worldwide semiconductor industry.
Headquartered in Danvers, Massachusetts, the company maintains an additional
office in Aptos, California. Ibis Technology is traded on the Nasdaq National
Market under the symbol IBIS. Information about Ibis Technology Corporation and
SIMOX-SOI implanters is available on Ibis' web site at www.ibis.com.

     "Safe Harbor" Statement under the Private Securities Litigation Reform Act
of 1995

     This release contains express or implied forward-looking statements
regarding, among other things, (i) customer interest in, demand for, and market
acceptance of, the Company's SIMOX-SOI technology, and the involvement generally
of the silicon wafer manufacturing industry in the SOI wafer market, (ii) the
company's belief that wafer manufacturers will become the primary suppliers of
SIMOX-SOI wafers to the chipmaking industry, (iii) the throughput and production
capacity of the i2000 implanter for manufacturing 200- and 300-mm SIMOX-SOI
wafers (iv) the company's plan to focus on supplying implanters to wafer
manufacturers, (v) the company's expectations regarding future orders for i2000
implanters, (vi) the company's expectations regarding future willingness of
wafer manufacturers to purchase equipment from the company, (vii) the adoption
rate of SOI technology, and (viii) the company's expectation of having
sufficient cash for operations. Such statements are neither promises nor
guarantees but rather are subject to risks and uncertainties, which could cause
actual results to differ materially from those described in the forward-looking
statements. Such risks and uncertainties include, but are not limited to, future
continued migration to SOI technology and market acceptance of SIMOX, the level
of demand for the company's products, the company's ability to pursue and
maintain further strategic relationships, partnerships and alliances with third
parties, the company's ability to protect its proprietary technology, the
potential trends in the semiconductor industry generally, the ease with which
the i2000 can be installed and qualified in fabrication facilities, the
likelihood that implanters, if ordered, will be qualified and accepted by
customers, the likelihood and timing of revenue recognition on such
transactions, the impact of competitive products, technologies and pricing, the
impact of rapidly changing technology, the possibility of further asset
impairment and resulting charges, equipment capacity and supply constraints or
difficulties, the company's limited history in selling implanters, general
economic conditions, and other risks and uncertainties described in the
company's Securities and Exchange Commission filings from time to time,
including but not limited to, the company's Annual Report on Form 10-K for the
year ended December 31, 2003. All information set forth in this press release is
current as of September 14, 2004 only and Ibis undertakes no duty to update this
information unless required by law.

     CONTACT: Ibis Technology Corporation
              William J. Schmidt, 978-777-4247
              or
              IR Agency Contact:
              Bill Monigle Associates
              Bill Monigle, 603-424-1184