Exhibit 99.1

                    Ibis Technology Receives Implanter Order

     DANVERS, Mass.--(BUSINESS WIRE)--Jan. 6, 2005--

     Leading silicon wafer manufacturer orders an Ibis i2000 oxygen implanter
for producing SIMOX-SOI wafers; order valued at approximately $6 million
     Ibis Technology Corporation (Nasdaq NM: IBIS), a leading provider of
SIMOX-SOI implantation equipment to the worldwide semiconductor industry, today
announced the receipt of an order for an Ibis i2000 oxygen implanter from a
leading manufacturer of silicon wafers. The dollar amount of the equipment sale
is approximately $6 million.
     Martin J. Reid, president and chief executive officer of Ibis Technology
Corporation, said, "We are very pleased to have received this order from one of
the world's top manufacturers of electronic grade silicon wafers. This customer
has used earlier generations of Ibis implanters to produce SIMOX-SOI wafers up
to 200-mm in size. This order is an investment in the newest generation of
implanters, which we believe will enable this customer to better meet the needs
of the world's semiconductor manufacturers for low cost, high quality 300-mm
SIMOX-SOI wafers."
     Reid noted that this is the second order Ibis has received from a wafer
manufacturer for an i2000 implanter, the first having been placed last year by
another customer. The company's receipt of an i2000 implanter order from a
second wafer manufacturer reinforces its belief that wafer manufacturers will
lead the adoption of the SIMOX-based SOI manufacturing process.
     Although Ibis is encouraged by the receipt of this order and the
opportunity to work with leading wafer manufacturers like this customer to
develop further both the i2000 implanter and to improve the SIMOX process, SOI
technology is still in an early stage. Further adoption of the technology and
timing of future equipment orders are dependent on the continuing qualification
of implanters and improvement programs at the device manufacturers, among other
factors.
     Although no assurances can be given, and while the customer has the right
to cancel based on the current terms of the order the Company expects to ship
the system in the second quarter of 2005 depending on customer acceptance of the
tool at Ibis' facility. Revenue recognition will be based on final customer
acceptance at the customer's facility, which is expected to occur in the third
quarter of this year. The timing of final acceptance and revenue recognition may
vary depending on a number of factors, which include among other things tool
performance at the customer site, and no guarantees can be given with respect to
whether or when the Company will recognize revenue on this transaction.
     The Ibis i2000 oxygen implanter was introduced in March 2002 as a
third-generation implanter designed to be a high-throughput, high-volume
production tool for manufacturing 200- and 300-millimeter SIMOX-SOI wafers. The
i2000 implanter's flexibility, automation and operator-friendly controls allow
this tool to produce a wide range of SIMOX-SOI wafer products.

     About SIMOX-SOI

     Silicon-on-Insulator (SOI) is a manufacturing technology where an
insulating layer is created within a silicon wafer, isolating the top layer of
silicon where the active transistors will be manufactured from the rest of the
bulk silicon wafer. The buried oxide layer acts as a barrier that reduces
electrical leakage from the transistors, resulting in semiconductor devices that
are faster and more power efficient. These benefits make SOI a valuable
technology for chipmakers producing IC's for high performance applications such
as servers and workstations, portable and desktop computers, wireless
communication devices, integrated optical components and automotive electronics.
     Separation-by-IMplantation-of-OXygen (SIMOX) refers to a technique used by
Ibis for manufacturing SOI wafers where an oxygen implanter creates a very thin
insulating layer within the wafer, just below a thin layer of silicon on the top
of the wafer. Compared to competing technologies, the SIMOX process offers high
quality SOI wafers at competitive costs in production quantities.

     About Ibis Technology

     Ibis Technology Corporation is a leading provider of oxygen implanters for
the production of SIMOX-SOI (Separation-by-Implantation-of-Oxygen
Silicon-On-Insulator) wafers for the worldwide semiconductor industry.
Headquartered in Danvers, Massachusetts, the Company maintains an additional
office in Aptos, California. Ibis Technology is traded on the Nasdaq National
Market under the symbol IBIS. Information about Ibis Technology Corporation and
SIMOX-SOI is available on Ibis' web site at www.ibis.com.

     "Safe Harbor" Statement under the Private Securities Litigation Reform Act
of 1995

     This release contains express or implied forward-looking statements
regarding, among other things, (i) customer interest in and demand for, and
market acceptance of, the Company's SIMOX-SOI technology, (ii) the Company's
belief that wafer manufacturers will become the primary suppliers of SIMOX-SOI
wafers to the chipmaking industry, (iii) the continuing qualification and
acceptance of SIMOX technology by our customers and the device manufacturers,
(iv) the throughput and production capacity of the i2000 implanter for
manufacturing 200- and 300-mm SIMOX-SOI wafers. (v) the expected on-site
acceptance of the i2000 implanter, (vi) the timing and likelihood of revenue
recognition on orders for the Company's implanters, (vii) the Company's plan to
focus on supplying implanters to wafer manufacturers, (viii) the Company's
expectations regarding future orders for i2000 implanters, and (ix) and the
adoption rate of SOI technology. Such statements are neither promises nor
guarantees but rather are subject to risks and uncertainties, which could cause
actual results to differ materially from those described in the forward-looking
statements. Such risks and uncertainties include, but are not limited to, future
continued migration to SOI technology and market acceptance of SIMOX, the level
of demand for the Company's products, the Company's ability to pursue and
maintain further strategic relationships, partnerships and alliances with third
parties, the Company's ability to protect its proprietary technology, the
potential trends in the semiconductor industry generally, the ease with which
the i2000 can be installed and qualified in fabrication facilities, the
likelihood that implanters, if ordered, will be qualified and accepted by
customers without substantial delay, modification or cancellation, in whole or
in part, the likelihood and timing of revenue recognition on such transactions,
the impact of competitive products, technologies and pricing, the impact of
rapidly changing technology, the possibility of further asset impairment and
resulting charges, equipment capacity and supply constraints or difficulties,
the Company's limited history in selling implanters, general economic
conditions, and other risks and uncertainties described in the Company's
Securities and Exchange Commission filings from time to time, including but not
limited to, the Company's Annual Report on Form 10-K for the year ended December
31, 2003. All information set forth in this press release is as of January 6,
2005, and Ibis undertakes no duty to update this information unless required by
law.


     CONTACT: Company Contact:
              Ibis Technology Corporation
              William J. Schmidt, 978-777-4247
                 or
              IR Agency Contact:
              Bill Monigle Associates
              Bill Monigle, 603-424-1184