48 patents
Utility
Scatter Melt Detection Systems and Methods of Using the Same
9 Nov 23
High bandwidth time-and-space resolved scatter phase transition microscopy systems configured to detect melt onset in a wafer being processed by laser annealing systems with ultra-short dwell times and spot size.
Matthew Earl Wallace Reed, Xiaohua Shen
Filed: 10 Apr 23
Utility
Apparatus and method for die stack flux removal
12 Sep 23
A system for removing flux from openings formed in a substrate that has openings (e.g., sized 20 microns or less) formed therein includes a spay nozzle device that has a spray nozzle arm that is formed at an angle of about 45 degrees or less for discharging fluid towards the openings in the substrate for flux removal.
John Taddei, Kenji Nulman, Jonathan Fijal, Phillip Tyler, Ian Rafter
Filed: 10 Dec 20
Utility
Wafer Carrier Assembly with Pedestal and Cover Restraint Arrangements That Control Thermal Gaps
2 Mar 23
A wafer carrier assembly as described herein improves thermal control across a top surface thereof to maintain highly controlled deposition locations and thicknesses.
Sandeep Krishnan, Bojan Mitrovic, Eric A. Armour, Yuliy Rashkovsky, Robert S. Maxwell, IV, Matthew J. Van Doren
Filed: 31 Aug 21
Utility
Enhanced cathodic ARC source for ARC plasma deposition
11 Oct 22
An improved cathodic arc source and method of DLC film deposition with a carbon containing directional-jet plasma flow produced inside of cylindrical graphite cavity with depth of the cavity approximately equal to the cathode diameter.
Boris L. Druz, Viktor Kanarov, Yuriy N. Yevtukhov, Sandeep Kohli, Xingjie Fang
Filed: 19 Aug 20
Utility
High pressure spray head
23 Aug 22
A device for spraying substrates comprises a longitudinal extending fluid dispensing head coupled to a supply of fluid and including a perpendicularly extending flange, a spacer having first and second ends, the first end of the spacer coupled to the extending flange of the dispensing head, a nozzle adapted to eject fluid coupled to the second end of the spacer, and a locking nut enclosing the spacer and securely the dispensing head, spacer and nozzle.
Steven Honigman, Kenji Nulman
Filed: 7 Jun 19
Utility
High-efficiency line-forming optical systems and methods using a serrated spatial filter
16 Aug 22
High-efficiency line-forming optical systems and methods that employ a serrated aperture are disclosed.
Serguei Anikitchev
Filed: 15 Jul 19
Utility
Melt detection systems and methods of using the same
16 Aug 22
High bandwidth time-and-space resolved phase transition microscopy systems configured to detect melt onset in a wafer being processed by laser annealing systems with ultra-short dwell times and spot size.
Matthew Earl Wallace Reed
Filed: 30 Jun 20
Utility
Rotating Disk Reactor with Split Substrate Carrier
4 Aug 22
A self-centering split substrate carrier that supports a semiconductor substrate in a CVD system includes a first section configured to be centrally located in the split substrate carrier having a top surface with a recessed area for receiving a substrate for CVD processing and comprising a plurality of apertures positioned in an outer surface.
Sandeep Krishnan, Alexander I. Gurary, Yuliy Rashkovsky, Robert Scott Maxwell IV, Aniruddha Bagchi
Filed: 11 Apr 22
Utility
Semiconductor wafer processing chamber
24 May 22
A housing of a wafer processing system includes at least one chamber exhaust outlet and at least one chemical exhaust outlet.
William Gilbert Breingan, Chris Hofmeister, Lev Rapoport, John Taddei
Filed: 23 Apr 18
Utility
Automated Batch Production Thin Film Deposition Systems and Methods of Using the Same
10 Mar 22
Fully automated batch production thin film deposition systems configured to deliver uniformity combined with high throughput at a low cost-per-wafer.
Michael W. Pacier, Michael J. Sershen, Adam F. Bertuch, Laurent Lecordier, Thousif Ahamad Khan Hosakote Buden, Ramesh Prasad Manchaladore Narahari Rao
Filed: 19 Feb 20
Utility
Reactor with Centering Pin for Epitaxial Deposition
3 Mar 22
A substrate reactor with centering pin for epitaxial deposition includes a vacuum chamber and a tube configured to rotate in the vacuum chamber around a tube geometrical center axis.
Alexander Gurary, Sandeep Krishnan, Aniruddha Bagchi, Yuliy Rashkovsky, Siddharth Patel
Filed: 27 Aug 21
Utility
Wafer carrier having retention pockets with compound radii for chemical vapor deposition systems
15 Feb 22
A wafer carrier for use in a chemical vapor deposition (CVD) system includes a plurality of wafer retention pockets, each having a peripheral wall surface surrounding a floor surface and defining a periphery of that wafer retention pocket.
Sandeep Krishnan, Lukas Urban
Filed: 30 Nov 18
Utility
System and method for self-cleaning wet treatment process
25 Jan 22
An apparatus for supporting and maneuvering a wafer comprises a handle having a gas inlet adapted to couple to a gas supply, a supporting surface coupled to the handle section including a frame structure having edge segments connecting at vertices and spoke elements extending from a center of the frame structure to the vertices, a gas supply channel coupled to the gas inlet that extends from the handle and branches into channels that run through the spoke elements, and a plurality of nozzles positioned at the vertices on the supporting surface and coupled to the channels in the spoke elements.
Kenji Michael Nulman, Mark Yannuzzi, Phillip Tyler, Jonathan Fijal, William Gilbert Breingan, John Taddei, Nicholas Baverov, James Swallow, Christopher Orlando, Paul Vit, Christopher Hofmeister, Tremayne Diggs
Filed: 19 Jun 19
Utility
Ion Beam Deposition of a Low Resistivity Metal
30 Dec 21
Methods for forming thin, low resistivity metal layers, such as tungsten (W) and ruthenium (Ru) layers.
Narasimhan SRINIVASAN, Tania HENRY, Frank CERIO, Paul TURNER, Vincent IP, Rutvik MEHTA
Filed: 14 Sep 21
Utility
Ion Beam Deposition of a Low Resistivity Metal
23 Sep 21
Methods for forming thin, low resistivity metal layers, such as tungsten (W) and ruthenium (Ru) layers.
Narasimhan SRINIVASAN, Tania HENRY, Frank CERIO, Paul TURNER, Vincent IP, Rutvik MEHTA
Filed: 10 Mar 21
Utility
Apparatus and method for the minimization of undercut during a UBM etch process
20 Jul 21
A plurality of endpoints in a wet etching process of a substrate are determined.
John Taddei, David A. Goldberg, Elena Lawrence, Ian Cochran, Christopher Orlando, James Swallow, William Gilbert Breingan
Filed: 15 Nov 19
Utility
Apparatus and Method for Die Stack Flux Removal
1 Jul 21
A system for removing flux from openings formed in a substrate that has openings (e.g., sized 20 microns or less) formed therein includes a spay nozzle device that has a spray nozzle arm that is formed at an angle of about 45 degrees or less for discharging fluid towards the openings in the substrate for flux removal.
John Taddei, Kenji Nulman, Jonathan Fijal, Phillip Tyler, Ian Rafter
Filed: 10 Dec 20
Utility
Enhanced Cathodic Arc Source for Arc Plasma Deposition
10 Jun 21
An improved cathodic arc source and method of DLC film deposition with a carbon containing directional-jet plasma flow produced inside of cylindrical graphite cavity with depth s of the cavity approximately equal to the cathode diameter.
Boris L. Druz, Viktor Kanarov, Yuriy N. Yevtukhov, Sandeep Kohli, Xingjie Fang
Filed: 19 Aug 20
Design
Multi-filament heater assembly
8 Jun 21
Sandeep Krishnan, Bojan Mitrovic, Aniruddha Bagchi, Alexander Gurary, Chenghung Paul Chang, Ian Kunsch, Matthew J. Van Doren
Filed: 1 Apr 19
Utility
Apparatus and method for the minimization of undercut during a UBM etch process
11 May 21
A semiconductor etch process is provided in which an undercut is minimized during an etch process through tight control of etch profile, recognition of etch completion, and minimization of over etch time to increase productivity.
John Taddei, David A. Goldberg, Elena Lawrence, Ian Cochran, Christopher Orlando, James Swallow
Filed: 20 Jun 19