22850 patents
Utility
Euv Photo Masks and Manufacturing Method Thereof
23 Mar 23
A reflective mask includes a substrate, a reflective multilayer disposed over the substrate, a capping layer disposed over the reflective multilayer, an intermediate layer disposed over the capping layer, an absorber layer disposed over the intermediate layer, and a cover layer disposed over the absorber layer.
Pei-Cheng HSU, Ta-Cheng LIEN, Hsin-Chang LEE
Filed: 21 Nov 22
Utility
Method for Enhancing Tunnel Magnetoresistance In Memory Device
23 Mar 23
A method to control a memory cell in a memory device, where the memory cell includes a switch, a memory element, and a negative resistance device coupled in series, the method includes: determine whether the memory cell is in a read operation or not; during the read operation in the memory cell, apply a read voltage greater than a predetermined threshold voltage of the negative resistance device for making the negative resistance device entering into a negative resistance state.
Wen-Chin Lin, Hung-Chang Yu
Filed: 28 Nov 22
Utility
Semiconductor Die Contact Structure and Method
23 Mar 23
A system and method for forming a semiconductor die contact structure is disclosed.
Chung-Shi Liu, Chen-Hua Yu
Filed: 28 Nov 22
Utility
Semiconductor Device Structure with Nanostructures
23 Mar 23
A semiconductor device structure is provided.
Hung-Li CHIANG, I-Sheng CHEN, Tzu-Chiang CHEN
Filed: 28 Nov 22
Utility
Memory Device with Tunable Probabilistic State
23 Mar 23
Some embodiments relate to a probabilistic random number generator.
Ming Yuan Song
Filed: 5 Dec 22
Utility
Semiconductor Device and Method for Forming the Same
23 Mar 23
A semiconductor device includes a substrate, a 2-D material channel layer, a 2-D material passivation layer, source/drain contacts, and a gate structure.
Shih-Yen LIN, Po-Cheng TSAI
Filed: 10 Mar 22
Utility
Method of Manufacturing a Semiconductor Device and a Semiconductor Device
23 Mar 23
A semiconductor device includes semiconductor nanostructures disposed over a substrate, a source/drain epitaxial layer in contact with the semiconductor nanostructures, a gate dielectric layer disposed on and wrapping around each channel region of the semiconductor nanostructures, a gate electrode layer disposed on the gate dielectric layer and wrapping around each channel region, and insulating spacers disposed in spaces, respectively.
Shahaji B. More
Filed: 21 Nov 22
Utility
Semiconductor Device Having Fins and Method of Fabricating the Same
23 Mar 23
A method includes providing a semiconductor structure including a first semiconductor substrate, an insulator layer over the first semiconductor substrate, and a second semiconductor substrate over the insulator layer; patterning the second semiconductor substrate to form a top fin portion over the insulator layer; conformally depositing a protection layer to cover the top fin portion, wherein a first portion of the protection layer is in contact with a top surface of the insulator layer; etching the protection layer to remove a second portion of the protection layer directly over the top fin portion while a third portion of the protection layer still covers a sidewall of the top fin portion; etching the insulator layer by using the third portion of the protection layer as an etch mask; and after etching the insulator layer, removing the third portion of the protection layer.
Shu-Hao KUO, Jung-Hao CHANG, Chao-Hsien HUANG, Li-Te LIN, Kuo-Cheng CHING
Filed: 28 Nov 22
Utility
Photosensitive Material for Photoresist and Lithography
23 Mar 23
Photosensitive polymers and their use in photoresists for photolithographic processes are disclosed.
Wei-Che Hsieh, Yu-Chung Su, Chia-Ching Chu, Tzu-Yi Wang, Ta-Cheng Lien, Hsin-Chang Lee, Ching-Yu Chang, Yahru Cheng
Filed: 15 Mar 22
Utility
Package Structure and Method of Manufacturing the Same
23 Mar 23
Package structure and method of manufacturing the same are provided.
Shih-Ting Lin, Szu-Wei Lu
Filed: 8 Nov 22
Utility
Semiconductor Structure and Manufacturing Method Thereof
23 Mar 23
A semiconductor structure includes a first conductive member, a second conductive member and a third conductive member.
POKUAN HO, CHIA-TIEN WU, CHENG-CHI CHUANG
Filed: 29 Nov 22
Utility
Transmission Line Structures for Millimeter Wave Signals
23 Mar 23
A coplanar waveguide structure includes a dielectric layer disposed over at least a portion of a substrate and a planar transmission line disposed within the dielectric layer.
Jun-De Jin
Filed: 23 Nov 22
Utility
Semiconductor Structure and Method of Forming the Same
23 Mar 23
The present disclosure provides a semiconductor structure, including an Nth metal layer over a transistor region, where N is a natural number, and a bottom electrode over the Nth metal layer.
Harry-Hak-Lay CHUANG, Kuei-Hung SHEN, Chern-Yow HS, Shih-Chang LIU
Filed: 28 Nov 22
Utility
System and Method for Automated Wafer Carrier Handling
23 Mar 23
A system and an operating method for automated wafer carrier handling are provided.
Yung-Ho Chen, Chung-Hsung Yang
Filed: 30 Nov 22
Utility
Integrated Circuit Device and Method of Manufacturing
23 Mar 23
An integrated circuit (IC) device includes a first substrate, a through substrate via (TSV) in the first substrate, and a first antenna effect protection circuit over the first substrate and electrically coupled to the TSV.
CunCun CHEN, XinYong WANG, Yaqi MA, Lei PAN, MingJian WANG, JiaLiang ZHONG
Filed: 9 Nov 21
Utility
Semiconductor Package
23 Mar 23
A semiconductor package including a semiconductor die, an encapsulant, an electrical connector, a conductive pad and an inter-dielectric layer is provided.
Po-Han Wang, Hung-Jui Kuo, Yu-Hsiang Hu, Sih-Hao Liao
Filed: 25 Nov 22
Utility
Air Spacer For A Gate Structure Of A Transistor
23 Mar 23
A semiconductor structure includes a first device and a second device.
Yi-Hsiu Liu, Feng-Cheng Yang, Tsung-Lin Lee, Wei-Yang Lee, Yen-Ming Chen, Yen-Ting Chen
Filed: 21 Nov 22
Utility
Impedance Measurement Circuit and Impedance Measurement Method Thereof
23 Mar 23
An impedance measurement circuit and an operating method thereof are provided.
Tsung-Che Lu, Chin-Ming Fu, Chih-Hsien Chang
Filed: 30 Nov 22
Utility
Electro-migration Barrier for Interconnect
23 Mar 23
The present disclosure relates to an integrated circuit.
Su-Jen Sung, Chih-Chiang Chang, Chia-Ho Chen
Filed: 28 Nov 22
Utility
Footprint for Multi-bit Flip Flop
23 Mar 23
An integrated circuit includes first bit cells, second bit cells, and clock cells.
Po-Chun WANG, Hui-Zhong ZHUANG, Chih-Liang CHEN, Jerry Chang-Jui KAO, Tzu-Ying LIN
Filed: 21 Nov 22