111 patents
Utility
Solder Material and Method for Die Attachment
18 Jan 24
A solder material comprising a solder alloy and a thermal conductivity modifying component.
Angelo GULINO, Bogdan BANKIEWICZ, Oscar KHASELEV, Anna LIFTON, Michael T. MARCZI, Girard SIDONE, Paul SALERNO, Paul J. KOEP
Filed: 19 Sep 23
Utility
Copper Electrodeposition in Microelectronics
18 Jan 24
An electrolytic plating composition for superfilling submicron features in a semiconductor integrated circuit device and a method of using the same.
Vincent Paneccasio, JR., Kyle Whitten, Richard Hurtubise, John Commander, Eric Rouya
Filed: 25 Sep 23
Utility
Compositions and methods for the electrodeposition of nanotwinned copper
16 Jan 24
A copper electroplating solution comprising a copper salt, a source of halide ions, and a linear or branched polyhydroxyl.
Kyle M. Whitten, Stephan I. Braye, Jianwen Han, Pingping Ye, Thomas B. Richardson, Elie H. Najjar
Filed: 7 Jun 22
Utility
Filter Containing Flow Disrupter
21 Dec 23
A filter for removing particles held in suspension by a fluid.
Mark Hall, Samuel Hayes
Filed: 10 Nov 21
Utility
Method and Wet Chemical Compositions for Diffusion Barrier Formation
21 Dec 23
A method of forming a diffusion barrier layer on a dielectric or semiconductor substrate by a wet process.
Richard W. Hurtubise, Eric Yakobson, Shaopeng Sun, Taylor L. Wilkins, Elie H. Najjar, Wenbo Shao
Filed: 6 Sep 23
Utility
Method and wet chemical compositions for diffusion barrier formation
19 Dec 23
A method of forming a diffusion barrier layer on a dielectric or semiconductor substrate by a wet process.
Richard W. Hurtubise, Eric Yakobson, Shaopeng Sun, Taylor L. Wilkins, Elie H. Najjar, Wenbo Shao
Filed: 7 Feb 22
Utility
Solder material and method for die attachment
12 Dec 23
A solder material comprising a solder alloy and a thermal conductivity modifying component.
Angelo Gulino, Bogdan Bankiewicz, Oscar Khaselev, Anna Lifton, Michael T. Marczi, Girard Sidone, Paul Salerno, Paul J. Koep
Filed: 11 May 18
Utility
Stretchable interconnects for flexible electronic surfaces
28 Nov 23
A conductive paste and method of manufacturing thereof.
Narahari Pujari, Bawa Singh, Ravi Bhatkal, Siuli Sarkar, Anubhav Rustogi
Filed: 22 Jul 21
Utility
Composition for Use In the Manufacture of an In-mould Electronic (Ime) Component
23 Nov 23
A composition for use in the manufacture of an in-mould electronic (IME) component, the composition containing a binder comprising: a cross-linking agent comprising melamine formaldehyde, a thermoplastic resin comprising a hydroxyl group, and a solvent.
Nirmalya Kumar CHAKI, Chetan Pravinchandra SHAH, Bawa SINGH, Rahul RAUT, Vasuki Srinivas KAUSHIK, Ranjit PANDHER, Niveditha NAGARAJAN, Sandeesh M KUMAR, Anubhav RUSTOGI
Filed: 7 Oct 21
Utility
Cost-effective Lead-free Solder Alloy for Electronic Applications
9 Nov 23
A lead-free silver-free solder alloy may comprise tin, copper, bismuth, cobalt, and antimony.
Md Hasnine, Lik Wai Kho
Filed: 30 Jun 23
Utility
Cobalt chemistry for smooth topology
7 Nov 23
An electroplated cobalt deposit and a method of electrodepositing cobalt on a surface to produce a level deposit across the surface of the substrate.
Shaopeng Sun, Kyle Whitten, Stephan Braye, Elie Najjar
Filed: 11 Nov 21
Utility
High Reliability Lead-free Solder Alloy for Electronic Applications In Extreme Environments
26 Oct 23
A lead-free solder alloy may comprise tin, silver, copper, bismuth, cobalt, titanium, and antimony.
Md Hasnine, Lik Wai Kho
Filed: 29 Jun 23
Utility
Lead-free and Antimony-free Tin Solder Reliable at High Temperatures
19 Oct 23
A lead-free, antimony-free tin solder which is reliable at high temperatures and comprises from 3.5 to 4.5 wt.% of silver, 2.5 to 4 wt.% of bismuth, 0.3 to 0.8 wt.% of copper, 0.03 to 1 wt.% nickel, 0.005 to 1 wt.% germanium, and a balance of tin, together with any unavoidable impurities.
Pritha Choudhury, Morgana De Avila Ribas, Sutapa Mukherjee, Anil Kumar, Siuli Sarkar, Ranjit Pandher, Ravi Bhatkal, Bawa Singh
Filed: 5 Jun 23
Utility
Process for Fabricating a 3D-NAND Flash Memory
19 Oct 23
The invention relates to a process for fabricating a 3D-NAND flash memory comprising a first step of electrodepositing an alloy of copper and of a dopant metal selected from manganese and zinc followed by a second step of annealing the alloy to form a first layer of copper and a second layer comprising zinc or manganese, by demixing the alloy.
Frédéric RAYNAL, Vincent MEVELLEC, Mikailou THIAM, Amine LAKHDARI
Filed: 8 Oct 21
Utility
Electrochemical Oxidation of Amine Complexants in Waste Streams from Electroplating Processes
12 Oct 23
A process of treating a waste stream comprising organic amine compounds complexed with heavy metal ions.
Trevor Pearson
Filed: 8 Apr 22
Utility
Graphene Enhanced and Engineered Materials for Membrane Touch Switch and Other Flexible Electronic Structures
14 Sep 23
This invention discloses formulations of mutually compatible sets of graphene, graphene-carbon, metal and dielectric inks for the fabrication of high performance membrane touch switches (MTS).
Nirmalya Kumar CHAKI, Chetan Pravinchandra SHAH, Barun DAS, Supriya DEVARAJAN, Siuli SARKAR, Rahul RAUT, Bawa SINGH, Anubhav RUSTOGI, Anna Jane HARRIS, Keith Paul PARSONS, Jeffrey William BRAHAM
Filed: 24 Feb 23
Utility
Single step electrolytic method of filling through holes in printed circuit boards and other substrates
5 Sep 23
A method of copper electroplating in the manufacture of printed circuit boards.
Donald Desalvo, Ron Blake, Carmichael Gugliotti, William J. Decesare, Richard Bellemare
Filed: 5 Nov 19
Utility
High reliability lead-free solder alloy for electronic applications in extreme environments
22 Aug 23
A lead-free solder alloy may comprise tin, silver, copper, bismuth, cobalt, titanium, and antimony.
Md Hasnine, Lik Wai Kho
Filed: 28 Jun 18
Utility
Cost-effective lead-free solder alloy for electronic applications
15 Aug 23
A lead-free silver-free solder alloy may comprise tin, copper, bismuth, cobalt, and antimony.
Md Hasnine, Lik Wai Kho
Filed: 31 Aug 21
Utility
Copper deposition in wafer level packaging of integrated circuits
11 Jul 23
An electrodeposition composition comprising: (a) a source of copper ions; (b) an acid; (c) a suppressor; and (d) a leveler, wherein the leveler comprises a quaternized dipyridyl compound prepared by reacting a dipyridyl compound with a difunctional alkylating agent or a quaternized poly(epihalohydrin).
Thomas Richardson, Kyle Whitten, Vincent Paneccasio, Jr., John Commander, Richard Hurtubise
Filed: 12 Aug 21