55 patents
Page 2 of 3
Utility
Method and apparatus for cleaning semiconductor wafer
17 May 22
Provided are an apparatus and a method which ensure the wafers immersing in the chemical solution from one cleaning tank to the other cleaning tanks.
Hui Wang, Xi Wang, Fuping Chen
Filed: 8 Sep 17
Utility
Methods and Apparatus for Cleaning Semiconductor Wafers
5 May 22
A method for cleaning semiconductor substrate without damaging patterned structure on the semiconductor substrate using ultra/mega sonic device comprises applying liquid into a space between a substrate and an ultra/mega sonic device; setting an ultra/mega sonic power supply at frequency f1 and power P1 to drive the ultra/mega sonic device; before bubble cavitation in the liquid damaging patterned structure on the substrate, setting the ultra/mega sonic power supply at zero output; after temperature inside bubble cooling down to a set temperature, setting the ultra/mega sonic power supply at frequency f1 and power P1 again; detecting power on time at power P1 and frequency f1 and power off time separately or detecting amplitude of each waveform output by the ultra/mega sonic power supply; comparing the detected power on time with a preset time τ1, or comparing the detected power off time with a preset time τ2, or comparing detected amplitude of each waveform with a preset value, if the detected power on time is longer than the preset time τ1, or the detected power off time is shorter than the preset time τ2, or the detected amplitude of any waveform is larger than the preset value, shut down the ultra/mega sonic power supply and send out an alarm signal.
Jun WANG, Hui WANG, Fufa CHEN, Fuping CHEN, Jian WANG, Xi WANG, Xiaoyan ZHANG, Yinuo JIN, Zhaowei JIA, Liangzhi XIE, Xuejun LI
Filed: 13 Jan 22
Utility
Plating Apparatus and Plating Method
17 Mar 22
A plating apparatus and plating methods for plating metal layers on a substrate.
Yinuo Jin, Hongchao Yang, Jian Wang, Hui Wang
Filed: 28 Dec 18
Utility
Methods and apparatus for cleaning semiconductor wafers
22 Feb 22
A method for cleaning a semiconductor substrate without damaging its patterned structure via an ultra/mega sonic device comprises applying liquid into a space between the substrate and the sonic device; setting an ultra/mega sonic device power supply at a frequency f1 and power P1; and at zero output before bubble cavitation occurs; followed by at f1 and P1 again after bubble temperature is lowered; detecting power on time (at P1, f1), power off time or amplitude of each waveform output by the power supply; comparing the detected power on time with a preset time T1, power off time with a preset time τ2, amplitude of each waveform with a preset value, if the detected power on time is longer than τ1, or power off time is shorter than τ2, or amplitude of any waveform is larger than the preset value, shut down the power supply and send out an alarm.
Jun Wang, Hui Wang, Fufa Chen, Fuping Chen, Jian Wang, Xi Wang, Xiaoyan Zhang, Yinuo Jin, Zhaowei Jia, Liangzhi Xie, Xuejun Li
Filed: 6 Apr 16
Utility
Methods and Apparatus for Cleaning Substrates
3 Feb 22
A method for effectively cleaning vias (20034), trenches (20036) or recessed areas on a substrate (20010) using an ultra/mega sonic device (1003, 3003, 16062, 17072), comprising: applying liquid (1032) into a space between a substrate (20010) and an ultra/mega sonic device (1003, 3003, 16062, 17072); setting an ultra/mega sonic power supply at frequency f1 and power P1 to drive said ultra/mega sonic device (1003, 3003, 16062, 17072); after the ratio of total bubbles volume to volume inside vias (20034), trenches (20036) or recessed areas on the substrate (20010) increasing to a first set value, setting said ultra/mega sonic power supply at frequency f2 and power P2 to drive said ultra/mega sonic device (1003, 3003, 16062, 17072); after the ratio of total bubbles volume to volume inside the vias (20034), trenches (20036) or recessed areas reducing to a second set value, setting said ultra/mega sonic power supply at frequency f1 and power P1 again; repeating above steps till the substrate (20010) being cleaned.
Hui WANG, Xi WANG, Fuping CHEN, Fufa CHEN, Jian WANG, Xiaoyan ZHANG, Yinuo JIN, Zhaowei JIA, Jun WANG, Xuejun LI
Filed: 16 Jul 21
Utility
Methods and Apparatus for Cleaning Substrates
3 Feb 22
The present invention discloses a method for cleaning substrate without damaging patterned structure on the substrate using ultra/mega sonic device, comprising: applying liquid into a space between a substrate and an ultra/mega sonic device; setting an ultra/mega sonic power supply at frequency f1 and power P1 to drive said ultra/mega sonic device; after micro jet generated by bubble implosion and before said micro jet generated by bubble implosion damaging patterned structure on the substrate, setting said ultra/mega sonic power supply at frequency f2 and power P2 to drive said ultra/mega sonic device; after temperature inside bubble cooling down to a set temperature, setting said ultra/mega sonic power supply at frequency f1 and power P1 again; repeating above steps till the substrate being cleaned.
Hui WANG, Xi WANG, Fuping CHEN, Fufa CHEN, Jian WANG, Xiaoyan ZHANG, Yinuo JIN, Zhaowei JIA, Jun WANG, Xuejun LI
Filed: 14 Jun 21
Utility
System for Cleaning Semiconductor Wafers
30 Dec 21
A system for controlling damages in cleaning a semiconductor wafer comprising features of patterned structures, the system comprising: a wafer holder for temporary restraining a semiconductor wafer during a cleaning process; an inlet for delivering a cleaning liquid over a surface of the semiconductor wafer; a sonic generator configured to alternately operate at a first frequency and a first power level for a first predetermined period of time and at a second frequency and a second power level for a second predetermined period of time, to impart sonic energy to the cleaning liquid, the first predetermined period of time and the second predetermined period of time consecutively following one another; and a controller programmed to provide the cleaning parameters, wherein at least one of the cleaning parameters is determined such that a percentage of damaged features as a result of the imparting sonic energy is lower than a predetermined threshold.
Hui WANG, Fufa CHEN, Fuping CHEN, Jian WANG, Xi WANG, Xiaoyan ZHANG, Yinuo JIN, Zhaowei JIA, Liangzhi XIE, Jun WANG, Xuejun LI
Filed: 9 Sep 21
Utility
Method and Apparatus for Cleaning Substrates
23 Dec 21
The present invention provides a method for cleaning substrates comprising the steps of: placing a substrate on a substrate holder; implementing a bubble less or bubble-free pre-wetting process for the substrate; and implementing an ultra/mega sonic cleaning process for cleaning the substrate.
Hui Wang, Xi Wang, Fuping Chen, Xiaoyan Zhang, Fufa Chen
Filed: 7 Feb 18
Utility
System for cleaning semiconductor wafers
12 Oct 21
A system for controlling damages in cleaning a semiconductor wafer comprising features of patterned structures, the system comprising: a wafer holder for temporary restraining a semiconductor wafer during a cleaning process; an inlet for delivering a cleaning liquid over a surface of the semiconductor wafer; a sonic generator configured to alternately operate at a first frequency and a first power level for a first predetermined period of time and at a second frequency and a second power level for a second predetermined period of time, to impart sonic energy to the cleaning liquid, the first predetermined period of time and the second predetermined period of time consecutively following one another; and a controller programmed to provide the cleaning parameters, wherein at least one of the cleaning parameters is determined such that a percentage of damaged features as a result of the imparting sonic energy is lower than a predetermined threshold.
Hui Wang, Fufa Chen, Fuping Chen, Jian Wang, Xi Wang, Xiaoyan Zhang, Yinuo Jin, Zhaowei Jia, Liangzhi Xie, Jun Wang, Xuejun Li
Filed: 15 Nov 17
Utility
Electroplating Apparatus and Electroplating Method
30 Sep 21
Embodiments of the present invention provide an electroplating apparatus for electroplating on a surface of a wafer, the electroplating apparatus comprising a plurality of electrodes, the plurality of electrodes forming electric fields on the surface of the wafer, wherein an independent electric field is formed in a designated area, the intensity of the independent electric field is independently controlled, when a notch of the wafer is positioned within the designated area, a total amount of power received by the notch within the designated area is reduced.
Zhaowei JIA, Jian WANG, Hui WANG, Hongchao YANG
Filed: 29 Apr 19
Utility
Methods and apparatus for cleaning substrates
31 Aug 21
The present invention discloses a method for effectively cleaning vias, trenches or recessed areas on a substrate using an ultra/mega sonic device, comprising: applying liquid into a space between a substrate and an ultra/mega sonic device; setting an ultra/mega sonic power supply at frequency f1 and power P1 to drive said ultra/mega sonic device; after the ratio of total bubbles volume to volume inside vias, trenches or recessed areas on the substrate increasing to a first set value, setting said ultra/mega sonic power supply at frequency f2 and power P2 to drive said ultra/mega sonic device; after the ratio of total bubbles volume to volume inside the vias, trenches or recessed areas reducing to a second set value, setting said ultra/mega sonic power supply at frequency f1 and power P1 again; repeating above steps till the substrate being cleaned.
Hui Wang, Xi Wang, Fuping Chen, Fufa Chen, Jian Wang, Xiaoyan Zhang, Yinuo Jin, Zhaowei Jia, Jun Wang, Xuejun Li
Filed: 19 Sep 16
Utility
Apparatus and Method for Cleaning Semiconductor Wafers
12 Aug 21
Methods and apparatuses for cleaning semiconductor wafers(202).
Hui Wang, Zhiyou Fang, Jun Wu, Guanzhong Lu, Fuping Chen, Jian Wang, Jun Wang, Deyun Wang
Filed: 7 Jun 18
Utility
Method and Apparatus for Cleaning Substrates Using High Temperature Chemicals and Ultrasonic Device
5 Aug 21
The present invention provides a high temperature chemical solution supply system for cleaning substrates.
Fuping Chen, Hui Wang, Xi Wang, Shena Jia, Danying Wang, Chaowei Jiang, Yingwei Dai, Jian Wang
Filed: 19 Apr 21
Utility
Methods and Apparatus for Cleaning Semiconductor Wafers
29 Jul 21
Embodiments of the present disclosure relate to a method for cleaning an in-process wafer.
Fuping CHEN, Xiaoyan ZHANG, Hui WANG
Filed: 27 Apr 18
Utility
Substrate Cleaning Apparatus
24 Jun 21
A substrate cleaning apparatus, including a chuck assembly, at least one first nozzle (107,207), and an ultra or mega sonic device (206,306).
Hui Wang, Jun Wu, Cheng Cheng, Xi Wang, Zhenming Chu
Filed: 30 Mar 17
Utility
Methods and apparatus for cleaning substrates
15 Jun 21
The present invention discloses a method for cleaning substrate without damaging patterned structure on the substrate using ultra/mega sonic device, comprising: applying liquid into a space between a substrate and an ultra/mega sonic device; setting an ultra/mega sonic power supply at frequency f1 and power P1 to drive said ultra/mega sonic device; after micro jet generated by bubble implosion and before said micro jet generated by bubble implosion damaging patterned structure on the substrate, setting said ultra/mega sonic power supply at frequency f2 and power P2 to drive said ultra/mega sonic device; after temperature inside bubble cooling down to a set temperature, setting said ultra/mega sonic power supply at frequency f1 and power P1 again; repeating above steps till the substrate being cleaned.
Hui Wang, Xi Wang, Fuping Chen, Fufa Chen, Jian Wang, Xiaoyan Zhang, Yinuo Jin, Zhaowei Jia, Jun Wang, Xuejun Li
Filed: 20 Sep 16
Utility
Method and Apparatus for Cleaning Semiconductor Wafer
3 Jun 21
Provided are an apparatus and a method which ensure the wafers immersing in the chemical solution from one cleaning tank to the other cleaning tanks.
Hui Wang, Xi Wang, Fuping Chen
Filed: 8 Sep 17
Utility
Method and Apparatus for Uniformly Metallization on Substrate
27 May 21
The present invention relates to applying at least one ultra/mega sonic device and its reflection plate for forming standing wave in a metallization apparatus to achieve highly uniform metallic film deposition at a rate far greater than conventional film growth rate in electrolyte.
Hui Wang, Fuping Chen, Xi Wang
Filed: 1 Feb 21
Utility
Apparatus for holding a substrate
18 May 21
An apparatus for holding a substrate (113) has a chuck cup (101), a seal shell (111), a chuck plate (102) and a vertical driving device (103).
Hui Wang, Zhaowei Jia, Hongchao Yang, Jun Wu, Jian Wang
Filed: 4 Dec 15
Utility
Apparatus for Cleaning Semiconductor Substrates
13 May 21
An apparatus for cleaning semiconductor substrates includes a chamber (101), a chuck (102), a liquid collector (104), an enclosing wall (105), at least one driving mechanism (106), at least one internal dispenser (111), and at least one external dispenser (118).
Hui Wang, Xiaofeng Tao, Fuping Chen, Shena Jia, Xi Wang, Xiaoyan Zhang, Xuejun Li
Filed: 6 Mar 17