12 patents
Utility
Method for forming hermetic package for a power semiconductor
8 Aug 23
A method for fabricating a hermetic electronic package includes providing a package body; hermetically coupling a package base plate to the package body; thermally coupling a substrate to the base plate; thermally mounting a semiconductor device to the substrate; bonding at least one high-current input/output (I/O) terminal to the first metalized region of the substrate by a strap terminal that is an integral high current heatsink terminal.
Saeed Shafiyan-Rad, Manuel Medeiros, III, David Scott Doiron
Filed: 21 Dec 20
Utility
Multi cycle dual redundant angular position sensing mechanism and associated method of use for precise angular displacement measurement
16 Feb 21
An apparatus can include a first planar inductive sensor including two oscillator coils and two sensing coils.
Ganesh Shaga, Bala Sundaram Nauduri
Filed: 29 Nov 18
Utility
Hermetic package for power semiconductor
26 Jan 21
A hermetic high-current electronic package includes a package body and a base plate hermetically coupled to the package body.
Saeed Shafiyan-Rad, Manuel Medeiros, III, David Scott Doiron
Filed: 3 Apr 19
Utility
Angular rotation sensor
16 Nov 20
An angular rotation sensor system constituted of: a first target with a member radially extending from, and rotating about a longitudinal axis of the first target; a second target with a member radially extending from, and rotating about a longitudinal axis of the second target; a first receive coil comprising a plurality of loops laid out such that adjacent loops exhibit opposing magnetic polarities responsive to a radio frequency current injected into the transmit coil; a second receive coil comprising a plurality of loops laid out such that adjacent loops exhibit opposing magnetic polarities responsive to a radio frequency current injected into the transmit coil; and an output coupled to each of the first and second receive coils, wherein each of the members is shaped and sized to generally match a shape and size of a pair of loops.
Kevin Mark Smith, Jr.
Filed: 4 Oct 18
Utility
Over-current protection apparatus and method
26 Oct 20
An over-current protection apparatus constituted of: a transistor disposed on a substrate; a first thermal sense device arranged to sense a temperature reflective of a junction temperature of the transistor; a second thermal sense device arranged to sense a temperature reflective of a temperature of a casing surrounding the substrate; and a control circuitry, arranged to alternately: responsive to the sensed temperature by the first thermal sense device and the sensed temperature of the second thermal sense device being indicative that the temperature difference between the transistor junction and the substrate casing is greater than a predetermined value, switch off the transistor; and responsive to the sensed temperature by the first thermal sense device and the sensed temperature by the second thermal sense device being indicative that the temperature difference between the transistor junction and the substrate casing is not greater than the predetermined value, switch on the transistor.
Pierre Irissou, Etienne Colmet-Daage
Filed: 9 Jan 18
Utility
Method and assembly for mitigating short channel effects in silicon carbide MOSFET devices
19 Oct 20
A power transistor assembly and method of mitigating short channel effects in a power transistor assembly are provided.
Dumitru Gheorge Sdrulla, Avinash Srikrishnan Kashyap
Filed: 4 Nov 18
Utility
Voltage sensing mechanism to minimize short-to-ground current for low drop-out and bypass mode regulators
31 Aug 20
Various electronics systems may benefit from appropriate limitation of short-to-ground current.
Subhasis Sasmal, Jebas Paul Daniel T, Naveen Cannankurichi, Bernard Drexler
Filed: 9 Jan 18
Utility
Planar linear inductive position sensor having edge effect compensation
31 Aug 20
A planar linear inductive position sensor is formed on a substrate and includes at least one oscillating coil, a first sensing coil having opposing edges extending beyond opposing edges of the oscillating coil along a linear axis along which a linear position of a conductive target is to be sensed, and a second sensing coil having opposing edges extending beyond opposing edges of the oscillating coil along the linear axis.
Ganesh Shaga, Bala Sundaram Nauduri, Sudheer Puttapudi
Filed: 20 Feb 19
Utility
Method and assembly for ohmic contact in thinned silicon carbide devices
25 May 20
A silicon carbide semiconductor assembly and a method of forming a silicon carbide (SiC) semiconductor assembly are provided.
Bruce Odekirk, Jacob Alexander Soto
Filed: 13 Nov 18
Utility
Distributed amplifier
13 Apr 20
A distributed amplifier system constituted of: an input transmission line exhibit a plurality of sections; an output transmission line; an amplifier stage, an output of the amplifier stage coupled to the output transmission line and an input of the amplifier stage coupled to the input transmission line between a respective pair of the plurality of sections; a PIN diode coupled between a first end of the input transmission line and a common potential; and a circuitry coupled between a second end of the input transmission line and the common potential, the second end opposing the first end, such that there is a direct current (DC) flow through the first unidirectional electronic valve, the input transmission line and the circuitry.
Peter Shveshkeyev
Filed: 6 Jun 18
Utility
Semiconductor device with improved field layer
17 Feb 20
A semiconductor device constituted of: a semiconductor layer; and a field layer patterned on said semiconductor layer, said field layer constituted of material having characteristics which block diffusion of mobile ions and maintain structural integrity at activation temperatures of up to 1200 degrees centigrade.
Amaury Gendron-Hansen, Bruce Odekirk, Nathaniel Berliner, Dumitru Sdrulla
Filed: 14 Aug 18
Utility
Lid cover spring design
30 Dec 19
A module package can include a substrate; at least one device component configured to be positioned on the substrate; a module package lid configured to be positioned over the at least one device component and on the substrate, the module package lid exhibiting a plateau portion; and at least one mounting spring configured to be positioned on the module package lid, wherein the at least one mounting spring is configured to be mechanically coupled with a mounting surface and further positionally secure the module package lid and the at least one device component.
Benjamin A. Samples, John Fredrick May
Filed: 30 Apr 18
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