10908 patents
Page 39 of 546
Utility
Apparatus, system and method of concurrent multiple band (CMB) network access
5 Sep 23
For example, a wireless communication device may be configured to, while communicating via a first radio of the wireless communication device over a first network connection in a first WLAN over a first wireless communication frequency band, identify a second WLAN over a second wireless communication frequency band for Concurrent Multiple Band (CMB) network access, the second wireless communication frequency band different from the first wireless communication frequency band; based on identifying the second WLAN, to automatically transmit from a second radio of the wireless communication device user credentials to establish a second network connection with the second WLAN over the second wireless communication frequency band, the second network connection concurrent with the first network connection; and to concurrently communicate over the first and second network connections by routing to the first and second radios a plurality of application streams corresponding to one or more applications.
Ofer Hareuveni, Daniel Cohn, David Birnbaum, Ehud Reshef, Dor Chay, Sivan Koffler
Filed: 13 Sep 21
Utility
Microelectronic package electrostatic discharge (ESD) protection
5 Sep 23
Embodiments may relate to a microelectronic package comprising: a die and a package substrate coupled to the die with a first interconnect on a first face.
Veronica Aleman Strong, Johanna M. Swan, Aleksandar Aleksov, Adel A. Elsherbini, Feras Eid
Filed: 7 Sep 21
Utility
Ferroelectric capacitors with backend transistors
5 Sep 23
An integrated circuit includes a backend thin-film transistor (TFT) a ferroelectric capacitor electrically connected to the backend TFT.
Abhishek A. Sharma
Filed: 29 Sep 17
Utility
FinFET transistor based resistive random access memory
5 Sep 23
Embodiments herein describe techniques for a semiconductor device including a RRAM memory cell.
Abhishek Sharma, Gregory Chen, Phil Knag, Ram Krishnamurthy, Raghavan Kumar, Sasikanth Manipatruni, Amrita Mathuriya, Huseyin Sumbul, Ian A. Young
Filed: 25 Sep 18
Utility
Computing devices with secure boot operations
5 Sep 23
Disclosed herein are embodiments related to security in cloudlet environments.
Yeluri Raghuram, Susanne M. Balle, Nigel Thomas Cook, Kapil Sood
Filed: 7 Oct 21
Utility
Dynamic precision for neural network compute operations
5 Sep 23
In an example, an apparatus comprises a compute engine comprising a high precision component and a low precision component; and logic, at least partially including hardware logic, to receive instructions in the compute engine; select at least one of the high precision component or the low precision component to execute the instructions; and apply a gate to at least one of the high precision component or the low precision component to execute the instructions.
Kamal Sinha, Balaji Vembu, Eriko Nurvitadhi, Nicolas C. Galoppo Von Borries, Rajkishore Barik, Tsung-Han Lin, Joydeep Ray, Ping T. Tang, Michael S. Strickland, Xiaoming Chen, Anbang Yao, Tatiana Shpeisman, Abhishek R. Appu, Altug Koker, Farshad Akhbari, Narayan Srinivasa, Feng Chen, Dukhwan Kim, Nadathur Rajagopalan Satish, John C. Weast, Mike B. MacPherson, Linda L. Hurd, Vasanth Ranganathan, Sanjeev S. Jahagirdar
Filed: 11 May 21
Utility
Distributed convolution for neural networks
5 Sep 23
In one embodiment, a matrix operation may be performed using a plurality of input matrices, wherein the matrix operation is associated with one or more convolution operations.
Vijay Anand R. Korthikanti, Aravind Kalaiah, Tony L. Werner, Carey K. Kloss, Amir Khosrowshahi
Filed: 30 Dec 16
Utility
Apparatus and method for specifying quantum operation parallelism for a quantum control processor
5 Sep 23
Apparatus and method for specifying quantum operation parallelism.
Xiang Zou, Justin Hogaboam, Adam Holmes, Sonika Johri
Filed: 13 Dec 19
Utility
Apparatus and method for scalable qubit addressing
5 Sep 23
An apparatus and method for scalable qubit addressing.
Xiang Zou
Filed: 17 Nov 22
Utility
Coordination and increased utilization of graphics processors during inference
5 Sep 23
A mechanism is described for facilitating inference coordination and processing utilization for machine learning.
Abhishek R. Appu, Altug Koker, John C. Weast, Mike B. Macpherson, Linda L. Hurd, Sara S. Baghsorkhi, Justin E. Gottschlich, Prasoonkumar Surti, Chandrasekaran Sakthivel, Liwei Ma, Elmoustapha Ould-Ahmed-Vall, Kamal Sinha, Joydeep Ray, Balaji Vembu, Sanjeev Jahagirdar, Vasanth Ranganathan, Dukhwan Kim
Filed: 22 Jul 22
Utility
Apparatus and method for non-uniform frame buffer rasterization
5 Sep 23
An apparatus and method are described for a non-uniform rasterizer.
Tomas G. Akenine-Moller, Robert M. Toth, Bjorn Johnsson, Jon N. Hasselgren
Filed: 22 Feb 22
Utility
Distortion meshes against chromatic aberrations
5 Sep 23
Described herein is a technique in which a plurality of distortion meshes compensate for radial and chromatic aberrations created by optical lenses.
Daniel Pohl
Filed: 4 Aug 22
Utility
Image-based overlay targets incorporating features for pattern recognition and moire fringe patterns for measurement
5 Sep 23
Embodiments disclosed herein include a lithography reticle set and methods of using such reticle sets.
Martin Weiss, Apratim Dhar, Aaron M. White
Filed: 8 Jul 19
Utility
Video quality measurement for virtual cameras in volumetric immersive media
5 Sep 23
Apparatus and method for determining a quality score for virtual video cameras.
Debashish Barua, Fai Yeung
Filed: 27 Sep 19
Utility
Apparatus and method for optimized image stitching based on optical flow
5 Sep 23
An apparatus and method for efficient image optimized image stitching.
Feng Yuan, Wei Zong, Juan Zhao, Junkai Wu
Filed: 27 Sep 17
Utility
Quick configurable universal register for a configurable integrated circuit die
5 Sep 23
An FPGA includes a number of logic elements in a core fabric.
Bee Yee Ng, Dana How
Filed: 27 Dec 19
Utility
Cladded metal interconnects
5 Sep 23
Techniques are disclosed for providing cladded metal interconnects.
Thomas Marieb, Zhiyong Ma, Miriam R. Reshotko, Christopher Jezewski, Flavio Griggio, Rahim Kasim, Nikholas G. Toledo
Filed: 25 Sep 18
Utility
IC package including multi-chip unit with bonded integrated heat spreader
5 Sep 23
A multi-chip unit suitable for chip-level packaging may include multiple IC chips that are interconnected through a metal redistribution structure, and that are directly bonded to an integrated heat spreader.
Debendra Mallik, Ravindranath Mahajan, Digvijay Raorane
Filed: 27 Dec 22
Utility
High thermal conductivity, high modulus structure within a mold material layer of an integrated circuit package
5 Sep 23
An integrated circuit assembly may be formed comprising an electronic substrate, at least one integrated circuit device electrically attached to the electronic substrate, a mold material layer abutting electronic substrate and substantially surrounding the at least one integrated circuit, and at least one structure within the mold material layer, wherein the at least one structure comprises a material having a modulus of greater than about 20 gigapascals and a thermal conductivity of greater than about 10 watts per meter-Kelvin.
Yiqun Bai, Vipul Mehta, John Decker, Ziyin Lin
Filed: 28 Feb 20
Utility
Embedded bridge substrate having an integral device
5 Sep 23
Microelectronic assemblies, related devices, and methods are disclosed herein.
Amit Kumar Jain, Sameer Shekhar, Chin Lee Kuan, Kevin Joseph Doran, Dong-Ho Han
Filed: 9 Jul 21