10908 patents
Page 46 of 546
Utility
Technologies for secure authentication and programming of accelerator devices
8 Aug 23
Technologies for secure authentication and programming of an accelerator device are described.
Vincent Scarlata, Reshma Lal, Alpa Narendra Trivedi, Eric Innis
Filed: 20 Apr 22
Utility
Lightweight electronic control unit fingerprinting
8 Aug 23
Systems, apparatuses, and methods to identify an electronic control unit transmitting a message on a communication bus, such as an in-vehicle network bus, are provided.
Eduardo Alban, Shabbir Ahmed, Marcio Juliato, Christopher Gutierrez, Qian Wang, Vuk Lesi, Manoj Sastry
Filed: 14 Aug 20
Utility
Method, system and apparatus for error correction coding embedded in physically unclonable function arrays
8 Aug 23
The disclosure generally provides methods, systems and apparatus for an improved a Physically Unclonable Function (PUF).
Kuan-Yueh Shen, David Johnston, Rachael J. Parker, Javier Dacuna Santos
Filed: 25 Apr 22
Utility
Real-time mask quality predictor
8 Aug 23
An embodiment of an image processing apparatus may comprise one or more processors, memory coupled to the one or more processor to store image and mask data, and logic coupled to the one or more processors and the memory, the logic to capture a volumetric broadcast video signal in real-time and generate a sequence of frame images from the captured real-time volumetric broadcast video signal, segment an input image, which corresponds to a single frame of the sequence of frame images, to generate a mask image associated with the input image, and determine a mask quality score based on the input image and the associated mask image in real-time.
Fahim Mohammad, Joseph Batz, Nathan Segerlind, Itay Benou, Tzachi Hershkovich
Filed: 29 Sep 21
Utility
Apparatus and method for cross-instance front-to-back traversal for ray tracing heavily-instanced scenes
8 Aug 23
Apparatus and method for programmable ray tracing with hardware acceleration on a graphics processor.
Ingo Wald, Carsten Benthin, Sven Woop
Filed: 13 Sep 21
Utility
Optimized display image rendering
8 Aug 23
In one example, a head mounted display system includes at least one memory; and at least one processor to execute instructions to: detect a first position and a first view direction of a head of a user based on sensor data generated by at least one of an accelerometer, at least one camera, or a gyroscope at a first point in time; determine a latency associated with a time to cause an image to be presented on the display; determine a predicted position and a predicted view direction of the head of the user at a second point in time based on the latency; render, prior to the second point in time, the image for presentation on the display based on the predicted position and the predicted view direction of the head of the user; and cause the display to present the rendered image.
Atsuo Kuwahara, Deepak S. Vembar, Paul S. Diefenbaugh, Vallabhajosyula S. Somayazulu, Kofi C. Whitney
Filed: 23 Nov 22
Utility
Stress compensation for wafer to wafer bonding
8 Aug 23
Embodiments herein describe techniques for bonded wafers that includes a first wafer bonded with a second wafer, and a stress compensation layer in contact with the first wafer or the second wafer.
Anant Jahagirdar, Chytra Pawashe, Aaron Lilak, Myra McDonnell, Brennen Mueller, Mauro Kobrinsky
Filed: 18 Mar 19
Utility
1D vertical edge blocking (VEB) via and plug
8 Aug 23
Embodiments disclosed herein include semiconductor devices and methods of forming such devices.
Leonard P. Guler, Michael Harper, Suzanne S. Rich, Charles H. Wallace, Curtis Ward, Richard E. Schenker, Paul Nyhus, Mohit K. Haran, Reken Patel, Swaminathan Sivakumar
Filed: 10 Jun 19
Utility
Integrated circuit assemblies having metal foam structures
8 Aug 23
An integrated circuit assembly may be formed comprising an electronic substrate, at least one integrated circuit device electrically attached to the electronic substrate, a heat dissipation device, a thermal interface material between the at least one integrated circuit device and the heat dissipation device, and a metal foam surrounding the at least one integrated circuit device and contacting the thermal interface material.
Aastha Uppal, Je-Young Chang
Filed: 23 Jan 20
Utility
Method of forming stacked trench contacts and structures formed thereby
8 Aug 23
Methods and associated structures of forming a microelectronic device are described.
Bernhard Sell, Oleg Golonzka
Filed: 18 Apr 22
Utility
Via structures having tapered profiles for embedded interconnect bridge substrates
8 Aug 23
Embodiments include a package structure with one or more layers of dielectric material, where an interconnect bridge substrate is embedded within the dielectric material.
Jeremy D. Ecton, Hiroki Tanaka, Oscar Ojeda, Arnab Roy, Vahidreza Parichehreh, Leonel R. Arana, Chung Kwang Tan, Robert A. May
Filed: 24 May 22
Utility
Hybrid core substrate architecture for high speed signaling and FLI/SLI reliability and its making
8 Aug 23
Embodiments include a package substrate, a semiconductor package, and a method of forming the package substrate.
Sri Chaitra Jyotsna Chavali
Filed: 28 Oct 19
Utility
Microelectronic assemblies
8 Aug 23
Microelectronic assemblies, and related devices and methods, are disclosed herein.
Adel A. Elsherbini, Patrick Morrow, Henning Braunisch, Kimin Jun, Brennen Mueller, Shawna M. Liff, Johanna M. Swan, Paul B. Fischer
Filed: 19 May 22
Utility
Method for fabricating multiplexed hollow waveguides of variable type on a semiconductor package
8 Aug 23
Embodiments include semiconductor packages and method of forming the semiconductor packages.
Brandon C. Marin, Aleksandar Aleksov, Georgios Dogiamis, Jeremy D. Ecton, Suddhasattwa Nad, Mohammad Mamunur Rahman
Filed: 11 Jun 19
Utility
Microelectronic assemblies having an integrated capacitor
8 Aug 23
Microelectronic assemblies, related devices, and methods are disclosed herein.
Chong Zhang, Cheng Xu, Junnan Zhao, Ying Wang, Meizi Jiao
Filed: 27 Dec 18
Utility
Quantum dot devices
8 Aug 23
Quantum dot devices, and related systems and methods, are disclosed herein.
Kanwaljit Singh, James S. Clarke, Menno Veldhorst, Lieven Mark Koenraad Vandersypen
Filed: 14 May 21
Utility
Quantum well stacks for quantum dot devices
8 Aug 23
Disclosed herein are quantum dot devices, as well as related computing devices and methods.
Nicole K. Thomas, James S. Clarke, Jessica M. Torres, Ravi Pillarisetty, Kanwaljit Singh, Payam Amin, Hubert C. George, Jeanette M. Roberts, Roman Caudillo, David J. Michalak, Zachary R. Yoscovits, Lester Lampert
Filed: 1 Jul 21
Utility
Quantum dot devices
8 Aug 23
Quantum dot devices, and related systems and methods, are disclosed herein.
Kanwaljit Singh, James S. Clarke, Menno Veldhorst, Lieven Mark Koenraad Vandersypen
Filed: 24 Feb 22
Utility
Thin film transistors having U-shaped features
8 Aug 23
Thin film transistors having U-shaped features are described.
Gilbert Dewey, Aaron Lilak, Van H. Le, Abhishek A. Sharma, Tahir Ghani, Willy Rachmady, Rishabh Mehandru, Nazila Haratipour, Jack T. Kavalieros, Benjamin Chu-Kung, Seung Hoon Sung, Shriram Shivaraman
Filed: 20 Jan 22
Utility
Quantum dot devices with trenched substrates
8 Aug 23
Disclosed herein are quantum dot devices with trenched substrates, as well as related computing devices and methods.
Ravi Pillarisetty, Van H. Le, Jeanette M. Roberts, David J. Michalak, James S. Clarke, Zachary R. Yoscovits
Filed: 13 Aug 21