10908 patents
Page 55 of 546
Utility
Rectilinear viewport extraction from a region of a wide field of view using messaging in video transmission
11 Jul 23
Rectilinear viewport extraction from a region of a wide field of view is described using messaging in the video transmission field.
Jill M. Boyce
Filed: 28 Jun 21
Utility
Apparatus, system and method of communicating a next generation vehicular (NGV) physical layer (PHY) protocol data unit (PPDU)
11 Jul 23
For example, a Next Generation Vehicular (NGV) wireless communication station (STA) may be configured to generate an NGV Physical Layer (PHY) Protocol Data Unit (PPDU) including an NGV preamble, the NGV preamble comprising a non High-Throughput (non-HT) Short Training Field (L-STF), a non-HT Long Training Field (L-LTF) after the L-STF, a non-HT Signal (L-SIG) field after the L-LTF, a Repeated L-SIG (RL-SIG) field after the L-SIG field, and an NGV Signal (NGV-SIG) field after the RL-SIG field, the NGV-SIG field including a version field configured to identify a version of the NGV PPDU; and to transmit the NGV PPDU over an NGV channel in an NGV wireless communication frequency band; and a memory to store information processed by the processor.
Thomas J. Kenney, Xiaogang Chen, Qinghua Li, Feng Jiang, Laurent Cariou, Bahareh Sadeghi
Filed: 14 Jul 20
Utility
Systems, methods, and devices for PUSCH default beam in multi-panel operation
11 Jul 23
Systems and methods determine a PUSCH default beam in NR with multiple UE antenna panel operation and multiple TRP operation.
Guotong Wang, Yushu Zhang, Alexei Davydov, Bishwarup Mondal, Gang Xiong
Filed: 26 Sep 19
Utility
Multi-slice support for MEC-enabled 5G deployments
11 Jul 23
A system configured to track network slicing operations within a 5G communication network includes processing circuitry configured to determine a network slice instance (NSI) associated with a QoS flow of a UE.
Dario Sabella, Miltiadis Filippou
Filed: 10 Mar 20
Utility
Per-span PDCCH monitoring enhancements
11 Jul 23
Systems and methods for PDCCH monitoring in NR systems.
Fatemeh Hamidi-Sepehr, Debdeep Chatterjee, Sergey Panteleev, Toufiqul Islam
Filed: 6 Oct 20
Utility
Buried electrical debug access port
11 Jul 23
Embodiments are generally directed to a buried electrical debug access port.
Florence R. Neumann, Bilal Khalaf, Saeed S. Shojaie
Filed: 3 Jun 21
Utility
Quantum dot devices with fins
11 Jul 23
Disclosed herein are quantum dot devices, as well as related computing devices and methods.
Jeanette M. Roberts, Ravi Pillarisetty, David J. Michalak, Zachary R. Yoscovits, James S. Clarke, Van H. Le
Filed: 4 Feb 22
Utility
Timestamp alignment across multiple computing nodes
4 Jul 23
Examples described herein relate to multiple processor nodes which are physically separate with interfaces to a common network interface.
Mark Bordogna, Jonathan A. Robinson
Filed: 24 Dec 19
Utility
Hybrid computing device, apparatus and system
4 Jul 23
Embodiments of an apparatus and system are described for a hybrid computing device.
Sameer Sharma, Gadi Amit, Yoshikuzu Hoshino, Chadwick Harber, Daniel Clifton, Kenneth Jasinski
Filed: 4 Sep 20
Utility
Annular silicon-embedded thermoelectric cooling devices for localized on-die thermal management
4 Jul 23
An integrated circuit (IC) package comprising an IC die, the IC die having a first surface and an opposing second surface.
Kelly Lofgreen, Chandra Mohan Jha, Krishna Vasanth Valavala
Filed: 23 Oct 18
Utility
Zero-misalignment two-via structures
4 Jul 23
A device package and a method of forming a device package are described.
Veronica Strong, Aleksandar Aleksov, Brandon Rawlings, Johanna Swan
Filed: 29 Nov 21
Utility
Horizontal pitch translation using embedded bridge dies
4 Jul 23
Methods/structures of joining package structures are described.
Sujit Sharan, Kemal Aygun, Zhiguo Qian, Yidnekachew Mekonnen, Zhichao Zhang, Jianyong Xie
Filed: 4 Feb 22
Utility
Multi-die ultrafine pitch patch architecture and method of making
4 Jul 23
Embodiments include semiconductor packages and methods to form the semiconductor packages.
Sanka Ganesan, Kevin McCarthy, Leigh M. Tribolet, Debendra Mallik, Ravindranath V. Mahajan, Robert L. Sankman
Filed: 29 Jul 19
Utility
Bridge interconnection with layered interconnect structures
4 Jul 23
Embodiments of the present disclosure are directed towards techniques and configurations for layered interconnect structures for bridge interconnection in integrated circuit assemblies.
Yueli Liu, Qinglei Zhang, Amanda E. Schuckman, Rui Zhang
Filed: 24 Aug 21
Utility
Microelectronic package with mold-integrated components
4 Jul 23
Embodiments may relate to a microelectronic package that includes an overmold material, a redistribution layer (RDL) in the overmold material, and a die in the overmold material electrically coupled with the RDL on an active side of the die.
Georgios Dogiamis, Aleksandar Aleksov, Feras Eid, Telesphor Kamgaing, Johanna M. Swan
Filed: 14 Apr 21
Utility
Bowl shaped pad
4 Jul 23
Embodiments described herein provide techniques for forming an interconnect structure that includes a bowl shaped pad.
Yuhong Cai, Sireesha Gogineni, Yi Xu
Filed: 11 Oct 18
Utility
Vias in composite IC chip structures
4 Jul 23
A composite integrated circuit (IC) device structure comprising a host chip and a chiplet.
Adel Elsherbini, Patrick Morrow, Johanna Swan, Shawna Liff, Mauro Kobrinksy, Van Le, Gerald Pasdast
Filed: 13 Oct 21
Utility
Active package substrate having anisotropic conductive layer
4 Jul 23
Semiconductor packages including active package substrates are described.
Juan Eduardo Dominguez, Hyoung Il Kim
Filed: 21 Aug 20
Utility
Methods of integrating multiple gate dielectric transistors on a tri-gate (FINFET) process
4 Jul 23
Two or more types of fin-based transistors having different gate structures and formed on a single integrated circuit are described.
Curtis Tsai, Chia-Hong Jan, Jeng-Ya David Yeh, Joodong Park, Walid M. Hafez
Filed: 13 Apr 20
Utility
Gate stacks for FinFET transistors
4 Jul 23
Embodiments herein describe techniques for a semiconductor device including a substrate and a FinFET transistor on the substrate.
Ashish Penumatcha, Seung Hoon Sung, Scott Clendenning, Uygar Avci, Ian A. Young, Jack T. Kavalieros
Filed: 29 Mar 19