7578 patents
Page 22 of 379
Utility
Systems and Methods for Analyzing Defects In CVD Films
2 Nov 23
Embodiments of the present technology may include semiconductor processing methods that include depositing a film of semiconductor material on a substrate in a substrate processing chamber.
Mandar B. Pandit, Man-Ping Cai, Wenhui Li, Michael Wenyoung Tsiang, Praket Prakash Jha, Jingmin Leng
Filed: 10 Jul 23
Utility
Wafer Processing Tools and Methods Thereof
2 Nov 23
A wafer processing device may include a wafer exchanger including two or more blades, each of the two or more blades may be configured to receive a wafer, the two or more blades may be rotatable about an axis on a single horizontal plane, and the two or more blades may be movable between at least a load cup and a robot access location; wherein the load cup may include a wafer station that is vertically moveable relative a blade located in the load cup and may be configured to remove a wafer from a blade located in the load cup and place a wafer on a blade located in the load cup.
Jagan Rangarajan, Edward Golubovsky, Shaun Van Der Veen, Justin Ho Kuen Wong, Steven M. Zuniga
Filed: 6 Jul 23
Utility
Fan-out Interconnect Integration Processes and Structures
2 Nov 23
Processing methods may be performed to form a fan-out interconnect structure.
Richard W. Plavidal, Albert Lan
Filed: 10 Jul 23
Utility
Assembly of Display with Color Conversion Layer and Isolation Walls
2 Nov 23
A multi-color display includes a backplane having backplane circuitry, an array of micro-LEDs electrically integrated with backplane circuitry of the backplane, a color conversion layer over each of a plurality of light emitting diodes, and a plurality of isolation walls separating adjacent micro-LEDs of the array.
Daihua Zhang, Yingdong Luo, Mingwei Zhu, Hou T. Ng, Sivapackia Ganapathiappan, Nag B. Patibandla
Filed: 7 Jul 23
Utility
Edge Inspection of Silicon Wafers by Image Stacking
2 Nov 23
Embodiments described herein provide for a defect detection system and method suitable for detecting defects on an edge of a wafer.
Asaf SCHLEZINGER
Filed: 29 Apr 22
Utility
Run-to-run Control at a Manufacturing System Using Machine Learning
2 Nov 23
First data associated with a first process performed for a first layer of a substrate is identified.
Pratik Champalal Kotcher
Filed: 27 Apr 22
Utility
Increasing the Gas Efficiency for an Electrostatic Chuck
2 Nov 23
A gas is received through an inlet.
Vijay D. Parkhe
Filed: 11 Jul 23
Utility
Oled Panel with Trench Overhang Structures
2 Nov 23
Embodiments described herein generally relate to sub-pixel circuits that may be utilized in a display such as an organic light-emitting diode (OLED) display.
Ji-young CHOUNG, Jungmin LEE, Chung-chia CHEN, Yusin LIN, Dieter HAAS, Si Kyoung KIM
Filed: 13 Dec 22
Utility
Die-to-multi-die wafer inspection
31 Oct 23
Disclosed herein is s computer-based method for obtaining and analyzing multi-die scan data of a patterned wafer.
Ron Naftali, Yariv Simovitch, Guy Shwartz, Ido Almog
Filed: 6 Oct 21
Utility
Chamber components for gas delivery modulation
31 Oct 23
Exemplary semiconductor processing chambers may include an inlet manifold defining a central aperture.
Fang Ruan, Diwakar Kedlaya, Truong Van Nguyen, Mingle Tong, Sherry L. Mings, Venkata Sharat Chandra Parimi
Filed: 4 Nov 20
Utility
CD dependent gap fill and conformal films
31 Oct 23
A method of depositing a silicon-containing material is disclosed.
Jung Chan Lee, Praket P. Jha, Jingmei Liang, Jinrui Guo, Wenhui Li
Filed: 9 Nov 21
Utility
Channeled implants for SiC MOSFET fabrication
31 Oct 23
Methods for fabricating SiC MOSFETs using channeled ion implants are disclosed.
Qintao Zhang, Samphy Hong, Wei Zou, Hans-Joachim L. Gossmann
Filed: 4 May 21
Utility
Ferroelectric-assisted tunneling selector device
31 Oct 23
A selector device may include a first electrode, a tunneling layer, and a ferroelectric layer.
Milan Pe{hacek over (s)}ić
Filed: 9 Aug 22
Utility
Control of steam generation for chemical mechanical polishing
31 Oct 23
A chemical mechanical polishing system includes a steam generator with a heating element to apply heat to a vessel to generate steam, an opening to deliver steam onto a polishing pad, a first valve in a fluid line between the opening and the vessel, a sensor to monitor a steam parameter, and a control system.
Hari Soundararajan, Shou-Sung Chang, Calvin Lee, Jonathan P. Domin, Shuchivrat Datar, Dmitry Sklyar, Paul D. Butterfield, Chad Pollard, Haosheng Wu
Filed: 28 Jun 21
Utility
UHV in-situ cryo-cool chamber
31 Oct 23
A cooling chamber comprising a support plate connected to a cryo pump and turbo pump, a clamp ring with a plurality of clamp pads on the bottom thereof where each clamp pad has a beveled surface directed downward and a lift plate to move the clamp ring from a clamp position to a loading position are described.
Bharath Swaminathan, John Mazzocco, Hanbing Wu, Ashish Goel, Anantha K. Subramani
Filed: 12 Dec 17
Utility
Method for depositing high quality PVD films
31 Oct 23
Embodiments described herein include a method for depositing a material layer on a substrate while controlling a bow of the substrate and a surface roughness of the material layer.
Zihao Yang, Mingwei Zhu, Nag B. Patibandla, Yong Cao, Shumao Zhang, Zhebo Chen, Jean Lu, Daniel Lee Diehl, Xianmin Tang
Filed: 10 Sep 20
Utility
Optical device metrology systems and related methods
31 Oct 23
A method of optical device metrology is provided.
Jinxin Fu, Kazuya Daito, Ludovic Godet
Filed: 24 Nov 21
Utility
Methods and apparatus for photomask processing
31 Oct 23
Methods and apparatus leverage dielectric barrier discharge (DBD) plasma to treat samples for surface modification prior to photomask application and for photomask cleaning.
Banqiu Wu, Khalid Makhamreh, Eliyahu Shlomo Dagan
Filed: 12 Apr 21
Utility
Reduced Charging by Low Negative Voltage In Fib Systems
26 Oct 23
A method of processing a region of a sample, the method comprising: positioning a sample within a vacuum chamber; generating an ion beam with a focused ion beam (FIB) column; focusing the ion beam on the sample and scanning the focused ion beam across the region of the sample thereby generating secondary electrons that are ejected from a surface of the sample within the region; and during the scanning, applying a negative bias voltage to an electrically conductive structure proximate the region to alter a trajectory of the secondary electrons and repel the secondary electrons back to the sample surface, wherein the electrically conductive structure is one of a gas injection nozzle, a voltage pin or a nano-manipulator.
Yehuda Zur
Filed: 20 Apr 22
Utility
Smart Camera Substrate
26 Oct 23
Embodiments disclosed herein include a diagnostic substrate, comprising a baseplate, and a first plurality of image sensors on the baseplate, where the first plurality of image sensors are oriented horizontal to the baseplate.
Upendra Ummethala, Philip Kraus, Keith Berding, Blake Erickson, Patrick Tae, Devendra Channappa Holeyannavar, Shivaraj Manjunath Nara, Anandakumar Parameshwarappa, Sivasankar Nagarajan, Dhirendra Kumar
Filed: 26 Jun 23