72 patents
Utility
Periodic-pattern Background Removal
18 Jan 24
Various examples described herein include various mechanisms, techniques, and methods to subtract collected signals caused by a periodic pattern formed on substrates to enable a higher level of defect detection on substrates.
Roman S. Basistyy, Jin Ju, Jian Ding, Jatinder Dhaliwal
Filed: 11 Jul 23
Utility
Apparatus and method for multiple source excitation Raman spectroscopy
16 Jan 24
An optical metrology device performs multi-wavelength polarized confocal Raman spectroscopy.
George Andrew Antonelli
Filed: 7 Apr 22
Utility
Mitigation of Undesired Spectral Effects In Optical Metrology
11 Jan 24
Optical measurement of a sample that includes a structure-of-interest (SOI) optically coupled to an unknown structure is optically measured by extracting from the resulting spectral signal the spectral variation that is correlated to key parameters associated with the SOI and removing the spectral variation from unknown structure that is irrelevant to the key parameters.
Petar Zuvela, Jingsheng Shi, Wei Ming Chiew, Jie Li
Filed: 8 Jul 22
Utility
a System and Method for Performing Alignment and Overlay Measurement Through an Opaque Layer
4 Jan 24
An alignment or overlay target that has an optically opaque layer disposed between the top and bottom target structure is measured using opto-acoustic metrology.
Manjusha Mehendale, George Andrew Antonelli, Priya Mukundhan, Robin A. Mair, Francis C. Vozzo
Filed: 22 Nov 21
Utility
Metrology Solutions for Complex Structures of Interest
28 Dec 23
Complex structures, such as gate-all-around (GAA) field effect transistor or high-aspect ratio (HAR) Channel hole etch, etc., in semiconductor devices are measured using a combination of physical modeling and machine learning modeling.
Jingsheng SHI, Pei Fen TEH, Jie LI, Youxian WEN, Wei Ming CHIEW
Filed: 22 Jun 23
Utility
Multiple Sources of Signals for Hybrid Metrology Using Physical Modeling and Machine Learning
28 Dec 23
Physical modeling and machine learning modeling are combined to analyze signals from multiple data sources, including metrology data acquired from different tool sets or at different process steps, and data related to processing equipment, such as sensor data, process parameters, Advanced Process Control (APC) parameters, context data, etc.
Jie Li, Wei Ming Chiew, Pei Fen Teh, Jingsheng Shi
Filed: 22 Jun 23
Utility
Optical Metrology with Nuisance Feature Mitigation
14 Dec 23
A sample that includes a target structure with a structure-of-interest (SOI) having a set of known parameters optically coupled to an unknown structure, e.g., having unknown parameters, is optically measured using light that is incident on the target structure.
Jonathan Andrew Miller
Filed: 9 Jun 22
Utility
Target for optical measurement of trenches
7 Nov 23
A metrology target is designed for measuring a feature at the bottom of a trench in a device under test, such as a tungsten recess vertical profile in a wordline in a three-dimensional (3D) NAND.
Nicholas James Keller, George Andrew Antonelli
Filed: 15 Apr 21
Utility
Wafer-level package assembly handling
7 Nov 23
A chuck assembly includes an upper surface configured to support a wafer-level package assembly and a clamping mechanism securing the wafer-level package assembly to the upper surface.
Kevin Barr, Edward Andrew Condon
Filed: 28 Sep 18
Utility
Apparatus and Method for Multiple Source Excitation Raman Spectroscopy
12 Oct 23
An optical metrology device performs multi-wavelength polarized confocal Raman spectroscopy.
George Andrew ANTONELLI
Filed: 7 Apr 22
Utility
Low Numerical Aperture Alignment
5 Oct 23
Disclosed herein are examples of a photolithography machine with fast alignment.
J. Casey Donaher
Filed: 5 Dec 22
Utility
Area Camera Substrate Pre-aligner
5 Oct 23
Various examples include a substrate pre-aligner system that can align substrates by detecting a fiducial on the substrate, determine an amount of bow in the substrate, and determine other characteristics of the substrate.
Jason Paul Remillard, Neil Casa, Stephen W. Into
Filed: 14 Jun 22
Utility
Dynamic Phase-shift Interferometer Utilizing a Synchronous Optical Frequency-shift
27 Jul 23
An optical metrology device characterizes a test object using a phase shift interferometer with synchronous time varying optical frequency shifts.
James MILLERD
Filed: 21 Jan 22
Utility
System and method for correcting overlay errors in a lithographic process
27 Jun 23
As feature sizes of semiconductor chips shrink there is a need for tighter overlay between layers in a lithography process.
Zhiyang Li, Tong Yang
Filed: 19 Feb 21
Utility
Semiconductor Substrate Yield Prediction Based on Spectra Data from Multiple Substrate Dies
25 May 23
Systems and methods for improving substrate fabrication are provided.
Xin Song, Jian Lu
Filed: 22 Nov 21
Utility
Simultaneous Back And/or Front And/or Bulk Defect Detection
18 May 23
An inspection system for inspecting multiple surfaces of a substrate includes at least one illuminator that produces light at a first wavelength that is incident on the substrate at a first angle (e.g., normal) and light at a second wavelength directed that is obliquely incident on the substrate.
Felix Moellmann, Mark Varner, Andrew Phillip Frazier
Filed: 3 Nov 22
Utility
Deep Learning Model In High-mix Semiconductor Manufacturing
30 Mar 23
Disclosed techniques for applying a neural network deep learning model in a fabrication strategy for high-mix semiconductor manufacturing, such as deposition, chemical-mechanical polishing (CMP), etching, photolithography, plating, etc.
Yulei Sun, Shelby Crain, Stephen McWilliams
Filed: 23 Sep 22
Utility
Substrate Mapping Using Deep Neural-networks
16 Mar 23
Various examples include a system and network to map of substrates within a substrate carrier (e.g., such as silicon wafers within a wafer cassette), and a classification of a state of each substrate, as well as the carrier in which the substrates are placed.
Jason Paul Remillard, John D. Nevin, IV, Stephen W. Into
Filed: 15 Sep 21
Utility
High Resolution Multispectral Multi-field-of-view Imaging System for Wafer Inspection
9 Mar 23
An optical system and design can image objects under inspection in the ultraviolet (UV) and visible spectrums.
John A. Tejada
Filed: 8 Sep 22
Utility
High Resolution Multi-field-of-view Imaging System
23 Feb 23
A multichannel tunable lens system may include a review channel with a fluidic focusing device, which can adjust the focus of the channel rapidly to mitigate environmental vibrations.
John A. Tejada, Ju Jin, Jian Ding
Filed: 17 Aug 22