1538 patents
Utility
Methods and Apparatus for Controlling Plasma In a Plasma Processing System
18 Jan 24
Methods and apparatus for processing a substrate in a multi-frequency plasma processing chamber are disclosed.
John C. Valcore, JR., Bradford J. Lyndaker
Filed: 26 Sep 23
Utility
Metal Etch
18 Jan 24
A method for etching a metal containing material is provided.
Yiwen FAN, Wenbing YANG, Ran LIN, Samantha SiamHwa TAN, Timothy William WEIDMAN, Tamal MUKHERJEE
Filed: 6 Dec 21
Utility
Coated Conductor for Heater Embedded In Ceramic
18 Jan 24
Various embodiments herein relate to techniques for fabricating a platen for use in a semiconductor processing apparatus, as well as the platens and intermediate structures produced by such techniques.
Joel Hollingsworth, Ramkishan Rao Lingampalli, Pankaj Hazarika
Filed: 28 Sep 21
Utility
Collaborative Robot System on a Mobile Cart with a Chamber Docking System
11 Jan 24
A robot system for servicing a semiconductor tool includes a cart frame.
Vitali Brand, Kamesh Venkata Gadepally, Jiawei Zhao, Dan Marohl, Niraj Vaghela, Heng Liu, Alexander James Walker, Zachary Jake Blum, Matthew Christopher Clark, Jessica Jeana Kim
Filed: 2 Mar 21
Utility
Distribution System for a Process Fluid and an Electric Current for a Chemical And/or Electrolytic Surface Treatment of a Substrate
11 Jan 24
The disclosure relates to a distribution system (1) for a process fluid (18) and an electric current for an electrolytic surface treatment of a substrate (9), comprising a distribution body (2), a primary cathode (30), and a secondary cathode (3), wherein the distribution body (2) comprises several openings (4) for the process fluid (18) and the electric current, wherein the several openings (4) are arranged at a front face (10) of the distribution body (2), wherein the front face (10) is directed to the primary cathode (30), wherein the primary cathode (30) and the secondary cathode (3) are arranged to attract the electric current and to guide the electric current to the substrate (9) to be treated, wherein the secondary cathode (3) comprises several cathode pixels (13), wherein the several cathode pixels (13) are distributed in an array to be aligned with at least an area of the substrate (9) to be treated, and wherein the several cathode pixels (13) are individually controllable for adjusting a distribution of the electric current at the substrate (9).
Andreas Gleissner, Herbert Ă–tzlinger
Filed: 11 Nov 21
Utility
C-shroud Modification For Plasma Uniformity Without Impacting Mechanical Strength Or Lifetime Of The C-shroud
11 Jan 24
A confinement ring for use in a plasma processing chamber includes an upper horizontal section, a vertical section, and a lower horizontal section.
Pratik Mankidy, Jaewon Kim, Harmeet Singh, Ming Li
Filed: 14 Jan 22
Utility
Selective deposition of etch-stop layer for enhanced patterning
9 Jan 24
Methods, systems, and computer programs are presented for selective deposition of etch-stop layers for enhanced patterning during semiconductor manufacturing.
Nagraj Shankar, Kapu Sirish Reddy, Jon Henri, Pengyi Zhang, Elham Mohimi, Bhavin Jariwala, Arpan Pravin Mahorowala
Filed: 29 Jul 21
Utility
Long-life extended temperature range embedded diode design for electrostatic chuck with multiplexed heaters array
9 Jan 24
A substrate support for a plasma chamber includes a base plate arranged along a plane, a first layer of an electrically insulating material arranged on the base plate along the plane, a plurality of heating elements arranged in the first layer along the plane, and a plurality of diodes arranged in respective cavities in the first layer.
Siyuan Tian
Filed: 4 Dec 19
Utility
Precursor Dispensing Systems with Line Charge Volume Containers for Atomic Layer Deposition
4 Jan 24
A precursor dispensing system includes a source, an ampoule, a first valve, a second valve, a line charge volume container and a controller.
Saangrut SANGPLUG, Aaron DURBIN, Murthi MURUGAIYAN, Aaron Blake MILLER, Huatan QIU, Gopinath BHIMARASETTI, Vikrant RAI, Vincent WILSON
Filed: 1 Dec 21
Utility
Backside Deposition and Local Stress Modulation for Wafer Bow Compensation
4 Jan 24
In A bow compensation layer deposited on a backside of a bowed semiconductor substrate may modulate stress to mitigate asymmetric bowing.
Yanhui Huang, Vignesh Chandrasekar, Shriram Vasant Bapat, Adriana Vintila
Filed: 19 Nov 21
Utility
Low Resistance Pulsed CVD Tungsten
4 Jan 24
Provided herein are methods of depositing tungsten (W) films without depositing a nucleation layer.
Yu PAN, Yao-Tsung HSIEH, Xiaolan BA, Juwen GAO
Filed: 16 Nov 21
Utility
Manifold valve for controlling multiple gases
2 Jan 24
Various embodiments include an apparatus to supply gases to a tool.
Damodar Rajaram Shanbhag, Nagraj Shankar
Filed: 26 Jul 22
Utility
Controlling plating electrolyte concentration on an electrochemical plating apparatus
2 Jan 24
Methods and electroplating systems for controlling plating electrolyte concentration on an electrochemical plating apparatus for substrates are disclosed.
Zhian He, Shantinath Ghongadi, Quan Ma, Hyungjun Hur, Cian Sweeney, Quang Nguyen, Rezaul Karim, Jingbin Feng
Filed: 27 Jun 22
Utility
MEMS-based Coriolis mass flow controller
2 Jan 24
A mass flow controller assembly includes a housing defining a cavity, a plurality of internal passages, a first inlet, a first outlet, a second inlet, and a second outlet.
Dennis Smith, Peter Reimer, Sudhakar Gopalakrishnan
Filed: 28 Mar 19
Utility
Line bending control for memory applications
2 Jan 24
A method for reducing bending of word lines in a memory cell includes a) providing a substrate including a plurality of word lines arranged adjacent to one another and above a plurality of transistors; b) depositing a layer of film on the plurality of word lines using a deposition process; c) after depositing the layer of film, measuring word line bending; d) comparing the word line bending to a predetermined range; e) based on the word line bending, adjusting at least one of nucleation delay and grain size of the deposition process; and f) repeating b) to e) one or more times using one or more substrates, respectively, until the word line bending is within the predetermined range.
Gorun Butail, Shruti Thombare, Ishtak Karim, Patrick Van Cleemput
Filed: 25 Nov 19
Utility
Mechanical suppression of parasitic plasma in substrate processing chamber
2 Jan 24
A system includes an electrode.
Douglas Keil, Edward J. Augustyniak, Karl Frederick Leeser, Mohamed Sabri
Filed: 31 Mar 23
Utility
Controlled degradation of a stimuli-responsive polymer film
2 Jan 24
Removing a stimuli responsive polymer (SRP) from a substrate includes controlled degradation.
Stephen M. Sirard, Gregory Blachut, Diane Hymes
Filed: 10 May 21
Utility
Photoresist Development with Organic Vapor
28 Dec 23
Development of resists are useful, for example, to form a patterning mask in the context of high-resolution patterning.
Dries DICTUS, Chenghao WU, Eric Calvin HANSEN, Timothy William WEIDMAN
Filed: 3 Dec 21
Utility
Pedestal Including Seal
28 Dec 23
A pedestal assembly for a substrate processing system includes a pedestal including a pedestal plate with a plurality of gas through holes and a stem extending downwardly from the pedestal plate.
Christopher GAGE
Filed: 9 Nov 21
Utility
Tool for Preventing or Suppressing Arcing
28 Dec 23
A tool that suppresses or altogether eliminates arcing between a substrate pedestal and substrate is disclosed.
Yukinori SAKIYAMA, Karl Frederick LEESER, Vincent BURKHART
Filed: 8 Sep 23