25 results
6-K
IMOS
Chipmos Technologies Inc
30 May 24
Current report (foreign)
6:06am
and compound semiconductor integrated circuit manufacturing, BGA, CSP, MCM and other advanced packaging and testing; and
- ChipMOS Shanghai: Marketing
SD
IMOS
Chipmos Technologies Inc
23 May 24
Conflict minerals disclosure
6:10am
certifies that all products and packaging supplied by the conflict minerals supplier do not contain conflict minerals that are originated from the DRC
6-K
EX-99.4
IMOS
Chipmos Technologies Inc
29 Apr 24
Current report (foreign)
6:10am
& small foot print requirements are driving the packaging technology development with the rising of emerging applications such as AI and 5G … 100um development;
(2)New structure of 2P2M Cu Pillar process;
(3)High-density (>4000 Chs) multilayer COF bonding packaging technology services;
(4
SD
gsyiuxjqnpgr0wke77s
18 May 23
Conflict minerals disclosure
6:11am
6-K
EX-99.4
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28 Apr 23
Current report (foreign)
6:10am
SD
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19 May 22
Conflict minerals disclosure
6:11am
6-K
EX-99.4
6y8wnj0hysdg4j6l256a
25 Apr 22
Current report (foreign)
6:11am
SD
bmol6eeeingwhjmtmg
20 May 21
Conflict minerals disclosure
6:10am
6-K
EX-99.4
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29 Apr 21
Current report (foreign)
4:36pm
SD
i1idduptdbpizw cjf
22 May 20
Conflict minerals disclosure
6:10am
6-K
EX-99.4
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8 May 20
Current report (foreign)
6:10am
SD
xuz1xghzyc0ao y2ca
28 May 19
Conflict minerals disclosure
6:07am
6-K
EX-99.5
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10 May 19
Current report (foreign)
6:11am