XXXX a Thanks, Good morning, year call. very welcome, today's ACM. to productive and was Gary. everyone, for
We challenges these customer managed and in COVID-XX expanded several customers. positive capacity. progress overcame tensions. We made good products, our introduced execution and could focused we and new what such a our and with trade as control. We We through we faced challenges, semiconductor hard executed deliveries. the on are tailwind industry. pandemic great chain. work new We We supply China We
We long-term also moved forward for plan with [apartment] Lingang completed housing the facility in development. our and employee
their getting Before and for dedication. would confidence Research. I thank thank also their and support ACM customers, employees hard for want I into to partners and our in detail, like our shareholders to continued work
$XXX.X Non-GAAP our from year, and record million, full million, shipment was in a the Market up the holdings we XX.X%, a shares. SMS, XXX ended of For $XX.X we million year up a revenue of additional $XX.X STAR with cash XX% record of and XX%. had operating margin and million
Slide turn X. customer. to starts Our Please our success with
We have DRAM customers X several well as and major back-end as and across wafer customers. packaging foundry front-end assembly
Our own markets. the analog of semiconductor manufacturer optimize today's in ACM excellence We'll they devices, operational choose to they to new global them achieve production compete customer, needed capability. help technology their
Huagong Semiconductor, and Let known foundry a Group. are advanced Huali I They also in with XX. of Huali progress great good neighbors a Shanghai are and and making on leader expansion, They Shanghai production XXXX near capacity headquarters. sales. XX% customers multiyear is our total the in of and leading our me China customers. Huali start key with as customers will discuss Shanghai Huagong in
of by major truly and last Asia. XX,XXX capacity from end fab edge are While more will capacity Their up month products month devices, power year, end in is on XX,XXX of per the be and is semiconductor this per adding than CIS and year. at
projects. both in participating are We
of system group offerings. our in for Huali first demo product several have newer We some -- first
Next, XX% contributing of in total the XXXX. to customer, largest sales seventh is YMTC. YMTC our the
and Public reports XXXX, YMTC and to Wuhan. to support closely to give wafer working month production layers capacity its a fab. supplier. are number XX,XXX expected layers. We say being XX to too XD add they are XX,XXX employed XXXX another to ACM XX,XXX convert in line cleaning in significant that are, from in they YMTC production are of the YMTC, in XXX per We largest single-wafer mass believe
come. in from to YMTC China. was we digits strong largest and continue foundry in So single in the the XXXX. major expect they scale production facilities customer It Wuhan XX% from other of capacity SMIC, XXXX, demand their as up largest in sales further to is ACM's
While to ship SMIC, suppliers to to the it's business new own depends in other to flexibility deliver and on tools AMC. their Shanghai license gather our level also
a but SMIC, well SMIC just are outlook. from in in factoring small XXXX tool with We our positioned are range a of amount the
started Now steps at let's with a few Hynix, with customers. was I cleaning our yields. SK on SK ACM's DRAM the customers, production We SK proven will global production #X touch a other to ability major significant strong and improve to fast Hynix. just our supplier. Hynix begin testament technology first
of in Now more our than less customer pause SK expect through technology more Hynix in capacity and as and expected Hynix XXXX, progress for additions. advanced steps XXXX as DRAM several XXXX, than implemented cycle. tools in technology we in them to to a as sales was XXXX, a upgrades to and our XX% return SK due updates from XX% beyond down XX nodes. used are about XX%
first is map. nonChina-based of select for technology recommend compelling production early They entrant Next, stage a improve multiyear a and tool XXXX to acceptance. in preparation, the the plan. them in XXXX value DRAM revenue in and later to of proven industry. XMP us in solid We XMP, SAPS-V road to upon QX ability deliver yields our
they positioned pools, SAPS, cleaning up ECP other to when participate very the tools scale critical and XXXX beyond. in We and in Tahoe, are
in XXXX and X some have delivered of -- the customers. quarter we Finally, in tool IC recognized third new analog quarter We third QX. multiple fourth and first revenue power
add of this, nodes in tools X remaining We significant of the SAPS [indiscernible] and can represent buying Ultra I'm opportunity tools alone our we products. a tools Furnace base these ultra China. including them think The in opportunity. our key Slide CIS Please and cleaning expect other additional and players expansion of With scrubber, receive of with X. for capture believe to ACM. penetrated our to will come, are middle tools, large a tool or of year. solid to years X as more enable customers products. and and improved and stage these backside we still cleaning from multiyear turn and active X market ACM first us to FM friction wafer, customer tool, with for We this growth Innovation PIC see capacity orders have all customers buy in process. the edge are cleaning manufacturing semi them current alone fabs support critical early Many cleaning and are happy our to very capacity for production new just
As an suppliers, emerging advanced technology cost. on delivering we're at focused competitive
a opportunity. semicon the projects strong have employees We this semiconductor a of Korea, This equipment in R&D newer consider one largest team on planet. near puts teams and Shanghai for and and critical great China. the service of some a We larger the of in mass
in scale share a by landgrab line not gain major products the new yet We their and intend market our semiconductor produce, few period, to business China. to next stretched analog have our build expanding expand their as both the We and our years, foundry, scope business product China USD We address NAND, of world. around DRAM, market. our current applications. XD and wafer cleaning the portfolio new in X devices customers product power gaining and product about the line billion includes global estimate build This
XX% our of total TEBO and Our billion cleaning wafer cleaning start tools. or tools flagship, with our with coupled billion our Tahoe, course, a $X.X market. semi-critical adjust We cleaning of about $X SAPS,
XXXX, and $X.X added our wafer million by more equipment, polishing including $X coder, another product products, developer, billion, scrubber strategy than by by $XX $X.X new billion advanced ECP, TEBO other XX% our enabled including and our process Furnace from levels. ECP million $XX sales [indiscernible], packaging to and That and and In products. million manufacturing XXXX Our beyond Furnace, recently, about we us R&D, SAPS [indiscernible]. and spending XX% Tahoe, spend most offering of expand semi-critical tools, up in or
we very greater tool contribution packaging In first a are revenue tools to XXXX, of handful off had a ECP front-end and year. customers the back-end Our a for and delivered to good start.
products, front end. key for ECP advanced for AP ECP including and Our packaging [indiscernible] copper interconnections, ECP for MAP
is secret provide Our the force uniform center layer. ability playing outer to
tools, applications the preparation profile for copper major Historically the SAPS due high For high rates mass top transfer with [indiscernible] advanced packaging, To a and today. or a around carboplatin generally we the metal significantly have challenge developed pillar. trading XD pillar plating. a a patent of is place uneven pending rate limitation that at proprietary reduced plating to better copper [indiscernible] film pillar reformatting and speed improve high-speed technology to and plating
technology products delivering packages. the plating the solved will the and SAPS high-speed pool, while copper achieving best advanced coming major quality X% CCGT in mass challenges together less than is in polishing The profile high heights a high-speed new as as pillar well throughput. rate, plating with transfer our for Our better XD become wining
a plan to We full companies, they jointly in process and year. and Shanghai customer Both first solve to including has their teams They beta quarter foster Chuansha to and and requirements. made opportunities deliver of improving been more are cleaning team. process. the have alpha developed vacuum significant also delivered tools progress our several a cleaning this high in by teaming excited worked and about the X Furnace seamlessly to process, this HDL, issues in XXXX. have Furnace We our meet tool
buses. [indiscernible] to oxidation and Our teams develop continue high-temperature
step manufacturing most separation, layer Our promising challenging develop advanced nodes. next process, product is is and which such autonomous the ALD for
products implemented near Furnace, as strategy come portfolio in have and expanding to make and vertical our our which more our first product product with to and the SAPS, We entry from multiple successfully wet dry joint product products future. wet
total to than our to to ahead, we from XX% plan XXXX, sales, $X today $XX prepare our new For billion. R&D redoubling of opportunity by more billion accelerate market addressed products our about to for
to to major serving years. products see $XX addressable the our next I growth are us work We offer couple that early begun can details. has market the that billion in close too get of on can team new
Next, on tier customers. on winning of I will first new efforts comment major our
well as sell our sales global steady are of hired several progress, hires. other XXXX April in team as making team a US-based key of we in investments Our
the discussion The the players. pipeline year, such customer labs, in to as U.S. engagement, with that service is we During process. QX. Thanks separate building team to Taiwan first its regular the win and tool, the technology actively revenues equipment the team, very we booked and with with formally own the in delivered of cleaning a the of few a accepted in lab execution player sales greater needs our the
copper high-speed more during we as and We Tahoe will need wins major at of ambitions, well first-tier as secure plating our one SAPS, growth are fulfill in To capacity. or confident that, fact, TEBO, can we customers XXXX.
our Let progress. to on Please me turn X. Slide update
and added space. capacity floor leasing revenue annual Shanghai We remains. prototyping of Our We at QX production original to stated our The now we additional during a XXXX. headquarter quickly that our that in facility the and products. have XXXX. by production factory Tensa Shanghai. million is We further and capacity more than believe started in new production September of of at second SG&A in expand of It second in X we to We R&D, tensa. can million revenue see XXX includes
space. million facility Our growth will include square with new planned X and space of Lingang R&D a production
We will have to to production X.X increase ability our capacity billion.
purchased XXXX, land During in XX-year Lingang. rights we
architectural work is operation Lingang initial design first production in XXXX. in XXXX of housing. half in with Ventures and the expect low-cost later We employee our additional expected
it key managers attract and We our expected U.S., particularly technology large for We of practice need a a keep to future than to housing our employees While growth many the and Shanghai. not maintain and is common train experienced China, key more decade. in to companies key as these offer development. in in We secure employees. and engineers
ACM towards a loan units. Shanghai of cash with facility. for $XX We XX-year financed these the balance. XXX half deposit We amount are of other half housing over from the paid the XXXX, -- During million purchasing we
from Before slower XXXX our of discuss let's I of expected. ACM the Star Market in steady the Shanghai. provide outlook, than status IPO Progress
events X, on Soon the in with Stock by by lawsuit the 'XX, issued It IPO. sale stated the X SEC followed Shanghai complication is delay in XX, Exchange a XX, or of caused after December U.S. XXXX. XXXX, October -- report on short a Commission September Shanghai class-action XXXX,
report. is U.S. previously largely this substance and have not The short disagreements We want short SEC, the which a familiar better we, our there to and seller legal of based process. lawsuit discredited therefore, understanding the with which the report, sale with losses, on is to believe kind report no is
also accepted report report. XX, have responded U.S. on As and the seller a with [indiscernible] by the the we we verification And both previously December SEC in released short publicly X points to described, XXXX China report was and
application as be administration with civil China SEC information. would additional filed Regulatory Commission, our should require ran that we or CSRC, was and suit the however, Before Securities the fired, again
Our the in of report secondary plan action team process now providing to SEC lawsuit. response class to is the to
We are will does would the complete not the predict and with confident us enable timetable this us go SEC this to for that over review precise IPO. we hurdle provide But our and timing.
Slide on let's to XXXX Now our X. move outlook
guidance early preliminary our optimism reflect for prospects about is offer values XXXX. Our report we which January, unchanged. The growth in that
be million, to revenue in business. annual XX% expect present growth of range to the $XXX which million $XXX in cleaning We
several XXXX is on key outlook assumptions. based Our
First, stabilize; range of U.S.-China spending outcomes customer production the of for improves the tool. in recovery; the range scenarios and second, in DRAM a key trade a for months; lending finally, variance the first of third, situation timing of acceptance COVID-XX coming the the global trajectory of customers; of fourth, policy
results outlook the demonstrate our execution and successful of Our strategy.
providing the growth strong is R&D Our in spending products. our to capability accelerate new
customers global our scaling building penetrate long-term in marketing to new to a plan. regions are we're sales and We production growth resource and capacity support new
increasing We advantage growth their opportunity take to operation ahead. are spending of
the over major Mark I now in equipment to Our the to global to remains will call discuss to more mission become results detail. the industry. turn financial semiconductor a supplier