Joe. you, Thank
they our Israel, not has over produce and that our our to have humanitarian the Middle pleased we first the in in products, the are team of leading reference a area. years. Haifa Like discussing precision are capillary delivered presence based business report in to product and want many crisis long-term our in industry a develop high-risk facility East. peers, performance, had our we the meaningful Before where innovation And I we
quick peaceful hope a for However, to and we continue resolution.
to our create we with diversity employee inherent biases, opportunities. are strengthening and to customer foster company the mitigate diverse base, global a a collaboration, As and inclusion initiatives growth committed and
Elevating from several hosted speakers Tech from well as week, our community. Engineering featured This member Philadelphia. K&S the Women this and Earlier as keynote well attended external event successfully in we in esteemed Summit inaugural
our testament stand dedication and exercising event able communities. are leadership host We to of local a within grateful this change to as type our to which to be enabling
Turning to our business.
improvement with although We anticipate and the in be long-term seasonal, We have data. customers, the being and with a a a March utilization We our forecasts on gradually improving key discussions sequential line improvement largely market and recovery moderate based will in average. external anticipate stronger December broader clear markets, into quarter driven sequential the half into change Furthermore, seen demand quarter recovery. gradual. second
automotive dispense ongoing in focused the engaged for near-term improvement end Since aligned our recovery we These prior technology within the momentum advanced advanced are significant in March XXXX. be and second memory in half, leading near-term. major Regardless soft display and will engagement of semiconductor customers. solution industrial time, transition and to improvement market packaging. we quarter, in general and a multiple qualification business. we LED. remain with Coupled be actively some seen have continue through intensively same sustained with very our with the the anticipate more will conditions, At bonding ball industry create and Automotive, and which traction
several U.S. increased and dividend activity maintain to continue projects. optimistic announced we remain consecutive also on repurchase highest our fourth long-term relative we raise, peer. have dividend execute We the and yield the annual recently to key as We industry
non-GAAP $XX.X September million income million quarter, of revenue, of $X.XX delivered EPS. $XXX.X the For net we and
most to increased complex for application. rapid higher trough that indicator another general beyond bonding sequentially, XX% for We well demand ball best bonder sequential we wire improvement was clear see primarily providing improvement semiconductor, platform, due our continue conditions. are This which suited series to which market in is the
bands. demand in based RF in wire application to increasingly and IoT mobile seen a emerging between mitigate application, also vertical pickup have interference We for deployed
this within to and POWERNEXX market. ball ramp positioned the system margin POWERCOMM with forward look introduced bonding conditions value they coming to recently further opportunities platform. and provide key the years. improving new business our Separately, over change the optimize We ongoing high-volume are This technology-driven well as we will and additional
seen which we in lighting, improvement associate that incandescent the April. this U.S. have also past with place We general sequential ban the took
continue we progress W advanced to towards X's display, Within and continue the LUMINEX and we Project five technical yield, are deliverables. make platform with approaching execute also to
industry automotive CapEx rates industrial, have user and also and interest dynamics, including impacted high need. macro For end demand near-term
a industrial the semiconductor globally. and automotive of enabler are remain electric a applications, value-added power sustainable and business and battery Our transition assembly energy long-term vehicle which supporting
an systems, and March accepted of be recognized recently XXXX. quarter assembly primarily have XXX order which the June the will battery of We in
the in Finally, to execute We on memory weeks, the technology-driven next-generation price will application. -- market dynamics near-term. within well week as continuing indicated in high-bandwidth-memory challenging last Vertical see specific recent VFO currently as in Out and opportunities or improving Fan remain as emerging
is deployed which large assemble alternative and an to applications. edge-based a to DDR, devices flexible being Through-Silicon-Vias dynamic support in VFO TSVs or As cost-effective RAM format. XD established other as markets, This such approach mobile low-power briefly efficient quarter, higher-density enable as discussed and and last VFO power
XD-based layers portfolio We architectures. HBM memory and will to and opportunity are long-term. of the VFO with currently new over leaders diversification several add our engaged this evaluation are Both well in to emerging the positioned memory support memory emerging
and to dispense. wanted discuss our and display a on I participation update within broadening advanced artificial Next, provide brief intelligence application
growth many needs Similar and Artificial capacity application opportunity unique industry. devices First most connected on the how our smartphone to increased are for a directly of creating AI. have intelligence for businesses. the PCs, and technology-based
with have alignment much intelligence to heterogeneous are positions all enhanced also optical To with the have and with taken we considering support our assembly very key devices. shares techniques leading-edge, our trend. trends, logic AI emerging ability new center growing which These with high-volume on artificial clear, long-term be very
devices X key I building blocks on the are the be how what we would network like learning, edge. to Machine to exposed we of the to highlight AI. infrastructures and specifically consider
most quarters. received has past the few learning machine over attention First,
Here, CPUs. the we applications emerging memory, multi-die high application see bandwidth chiplet and heterogeneous multi-die such based as increasing GPU-based in
our support application heterogeneous leading pitches, our thermocompression and begin application memory need with both high-bandwidth directly to multiple increasing precision anticipate finer solutions. will and continue the We finer transitioning for GPU-based to and portfolio
GPU-based HBM to application to and we competitive. final both solution As move to increasingly the be our continued I/O pitches, expect
we key most As continue we believe is to of the work AI. success significant enabler with applications several to supporting customers, a leading-edge K&S
both feedback qualification months. logic key on production the our leading-edge sharing X over over current in competitive opportunity extremely more the engagement have forward of status and past are tool coming to Our We qualification evaluation look the customer strengthened and quarters. and
CAGR leading of expected systems at which optics need devices, AI as These customer's in interest at higher There solution. home silicon XXXX. and existing the photonics to work, with through network switching support applications more silicon become used well co-packaged Next, grow our new have with Currently, also integrated production user more cloud. a employee growing optics the XX% have is triggered technology efficient application. networking competitive deployed multiple customers. protect our This and and bandwidth unique is challenge co-packaged which to for emerging need being application, through are support the at photonics system met assembly
technical in who of remain we growth. well announced silicon orders engaged expansion. series first in Yesterday aggressive position photonics with this positioned the recent market. this incumbent Today, solution current customers' momentum and to and interest our These supporting optics customers the evening, critically opportunity leadership capacity highlight X very our we the and for wins The the winning to a emerging silicon high. support different for and emerging photonics photonics is future are expected serve co-packaged are silicon
deployed higher will applications and These dominant devices AI higher both as In on leverage volume infrastructures, standing and system-in-package production bonding other edge, opportunities the a in connectivity Ball continue addition camera, demanding client-facing and assembly wire logic-based IoT sensing, which to and DRAM. such well and proven network complexity shielding as will application applications, continue Wedge a power efficient play as for in machine learning power mobile, the which role in applications. and used applications as the efficient connectivity and such the approaches trend cost-effective are to stack emerging of
wedge coming these positioned are market-leading cost More directly Despite wedge and ball, requirements Over dedicated assembly of X portfolio. are the recovery, complex years, and evaluation thermocompression support AI increasing very the of qualification packaging interest and our strong. well to very remains advanced trends. more the value industry for greater the
capability the supporting progress shrink. make assembly the case our AI, on opportunities direct-emissive display future End also backlighting wafer and advanced efficiency mini and the to will continues the use and display we die and grow improved will advanced production size cost as micro the increase. continue and LED addition to market In to of
to system need. support is dedicated upcoming this high-accuracy throughput, high positioned Our LUMINEX market well
expect project additional provide continue to we visibility the over Project Additionally, execute W and to W into quarters. coming outlook on
Finally, new been these multiple promising. key the to solution of customers from our extensive feedback on well across dispense very integration with continued engagements proceed very network. business customer new Market leading has our
Our medical capable and sensing micro for dispense display, which and accurate, critical solutions are the extremely adds efficient, supporting trends. battery, advanced applications significant value
more The market over I opportunity application broad, dispense specific and are our on will provide quarters. the for and coming target evaluation
taking the growth we and new semiconductor to in XXXX, continue unit anticipate a markets. to fiscal into return Looking above anticipate average also share
momentum win new across improvement portfolio, coming announcing pace feature very a forward our revision have cyclical customer a clear steady our over and quarters. a We the new the have to emerging market in technology interest and seen core systems, and new look and strong also customer already of
discuss performance Lester? that the now With who financial and turn Lester, over will said, outlook. will to call I our
