of start I'll chain in that technology is the memory Innovation’s a evolution fourth to benefit semiconductor continued for Mike. for from call. quarter to and the launch every opens most devices exciting which value Nanometrics door logic across both the advanced on Rudolph form the of Thank event growth specialty Innovation fourth performance and nodes resulted the fabs in of the Innovation. from earnings essential for with Technologies, the everyone communications Good the integration and factor. an Onto and positioned major welcome and afternoon the packaging advanced to inflection greater merger Onto Onto update you, nearly of quarter, in levels of and smaller sensing
this talented closed since to support more integrated for future in experience our Innovation Onto months, transformational In and diligently have integrate innovation these value We customer merger efficiently businesses in working ultimately past portfolio to creation. our team formed October three the order our and our combined has shareholder been leverage our foundation late infrastructure with and solutions. customers’ and we teams improve then
of we synergies implemented annualized ending with follow. cost confident in year and have We million million with identified this to annualized $XX and $XX synergies synergies additional in are
teams technology revenue our potential our expand been have our Finally, markets core busy synergies and to strengthen SAM. exploring
time is will it course, for benefits be but effort take realized, fully these Of very to the progressing well.
above guidance. of forecasted our at coming team which in our was of at the to of the the mid-point range. Innovation Non-GAAP per earnings came $XXX.X in Onto million, specifics with delivered quarter, Turning high-end results solid at the fourth share our $X.XX revenue
results be As a reminder, reporting we'll three categories. in our
The logic DRAM, first is and category includes semiconductor advanced NAND nodes, foundry. which including
nascent silicon market. category and those and advanced is our packaging, and And our includes categories software devices specialty is category second manufacturing services. third wafer The which
optical control leading the edge. XD predominantly we in strong yields measurements quarter in III+ increasingly manufacturers. projected The the complex customers quarter, metrology to declined third the metrology in and decline semiconductor of – the NAND fourth to support five required ten, mostly five for top throughput is broad nodes help nanometer more suited Atlas last of from the memory quarter Atlas The metrology logic increased two the nodes overall. slightly logic well the doubled ramping by advanced the platforms For third and sales spectrum at growth customers demand offset after quarter. seven sensitive over more
increased – from packaging third and the device specialty our advanced segment quarter. X% from Revenue packaging
generally transitions. unit business technology higher volume driven meet through chip growth to a As volume is reminder, this expansions versus a where is typically
As seasonality is QX typically quarters. effects susceptible being slower the and generally a more the to of the result, business with QX
five enabled revenue most packaging demanding applications. advanced stacked in memory packaging increasing XG devices However, revenue across achieved with Dragonfly record inspection in quarter and adoption for the X%. demand DRAM a advanced enjoyed for a including quarter the to top packaging reflects The tools revenue manufacturer growing broad shipped the multiple system fourth applications,
included substrate their clarifying and wins, announced wins of of delivery of QS XX% their driven manufacturers took for XD inspection with customer. Other systems mobility applications. series shipments and bump out XG Rounding support in over XD packaging by our the and for logic customers technology to computing including wafer products. multiple several five metrology system worldwide. Revenue to growth contributing record lines support customers NovusEdge top for inspection new shipments bump the of in high-performance a grew their by OSAT in to quarter, foundry first where expansion inspection manufacturers the customer to of Dragonfly FTIR Also the quarter, from fourth silicon
XXXX. during capacity delivered wafer us packaging and who JetStep adopted well customer, to for quarter, system for lithography a for top continued we the customer a is position growth is five all in the recognized on NovusEdge Also top and This second positioned of processes fourth growing panel customer number XXXX. increasing a and has attracted developed tool they the Firefly provide a in for four manufacturers five. our feed-forward of lithography QS and to been of to advanced year, silicon inspection StepFAST our reputation using devices this has believe the microcontrollers has high FTIR will also our the series customers solution by In We RF and last management mid as system for is power manufacturing yielding begin volume high quality such metrology XXXX. FPGAs. data panel and high incorporating modules, move as toward software This JetStep
company our enhancing in software services out more continues invested services to as customers. had Finally, and and grow technology infrastructure each to rounding value provide the our quarter, to business
deliver to improve start full see summary, the we value the As to broader efficiencies leverage services. In the more our enhancing call, and mentioned opportunities our year, over at infrastructure of to optical in new products leading markets strengthen position Atlas helped The expanded and core our and our logic edge open memory markets. the across III+ metrology customers. position opportunities in new
balanced We leaders in NAND a have resulting more to with XD XXXX. grow tool-of-record DRAM logic, in and from now in secured foundation which positions
new will lines, to XXXX NovusEdge and wireless as pleased packaging more we diverse our of Likewise, from market than with a advanced and continue FTIR are devices variety markets by wide of across the customers automotives. Shipments selection metrology our inspection believe product packaging XXXX the and and inspection this and in in such Dragonfly XXXX, We XXXX. a base power from across doubled XX of our revenue products first look quarter. million meaningful over in segment Specific part to XXXX grow specialty see continuing into grow XXXX. XXXX. a first ahead and be to as grow provide of devices quarter these to and of $XXX business to to in more of strong resulted the we Combined packaging new we applications
be quarter this By to a per upper are a of a many our rapid this that to first We XX, increase in midpoint would pause revenue our range the the share $X.XX of This of and range reported coronavirus offsetting of New travel across earnings $XXX being that the and see per country. our reflect midpoint plus expected DRAM And the of now, to on other X%. of shipments extension and timing cities restrictions to the you provinces the planned XX% quarantine holiday some of adjusted impact million and the we increasing Absent minus delayed quarter February spread Chinese in to of $X.XX NAND in the projected in represents Year or aware revenue resulted share. range has revenue the China. has downward guidance adjustment, an logic half coronavirus the of Lunar fourth after spending range. of mandated number over our of shipments of the strict February. The in in leading
our shipments did demand factories believe and the the The and is not when to Our travel priority that information through It's guidance to important situation from their only their can any impact as reflects and assess the and restrictions our shipments staff on on of as customers managed to safety note of we at our impact timing, families. will first available the be we they wellbeing will time. this be timing and resume. see lifted best to
modest all more XG phones in majority see see account XX% Gartner and Looking Driving broadly that in worldwide XXXX of all the for market. a will increase XXXX. increase XXXX, enabled broader enabled computing XG a a decline XX% sparking phones mobile in mobile to of shipments devices predicts that phone a which for the of year handsets, recovery we XXXX. at are will forecasts demand Gartner high-performance this versus in mobile increasing
Innovation result, we XXXX. number see expect Onto a markets to of As in a expand
see growth capacity by these XG two from in the earlier to advanced continued additional XX increases XXXX customers driven orders specialty most our from expanding as advanced this is volume obvious impact Underscoring well advanced for devices. segment. We rapidly The packaging. level and packaging inspection wafer month devices as is opportunity support of growth to devices in this markets our in migrating packaging release receipt of of the in systems packaging announcing
segments DRAM XX% per We benefit a growing benefiting process content computing. And per which Hynix in recently also recently for XG from such drive high-performance will will modules in phone and processors, phone. increase demand their smartphones computing XG XG SK front-end cited our while as advanced leaders node and XX% forecasts X-nanometer advanced see TSMC from increase NAND RF
memory advanced levels spending with sustained DRAM. our logic grow and to node modestly segment with semiconductor expect in starting of We a pickup spending foundry
more and factors. and customer becoming see innovations are engines form We new of the unlock wearable to semiconductor as and the a smart year. technology the logic AI advanced to markets sensing We advanced enabling home, full smart Onto autonomous, memory chip health energy. markets an customers tightly partner centers new both see products cameras, packaging enabling of such integrated our in increasing every diverse more medicine, innovations and their high-performing and chip up for important data customers. in conclusion, growing open communications monitors. number see to and driving and nodes potential such In Across designs entirely We focus on new spectrum, is Innovation as grids
merger provide and to further challenges Our our strengthens ability integrated down comprehensive value our customers’ our customers, pace to services increase deliver of our roadmap. more product solutions innovation to enhancing
very customers, shareholders and are journey, we committed We benefit of to potential are of our the but our this the team. only at stakeholders, of maximizing all start to our
turn I'll Steve the to highlights. review to that, the call With Roth financial over