Business Overview of the Company
As a foundry, we manufacture semiconductors using our manufacturing processes for our customers based on their own or third parties’ proprietary integrated circuit designs. We offer a comprehensive range of wafer fabrication processes, including processes to manufacture complementary metal oxide silicon (“CMOS”) logic, mixed-signal, radio frequency (“RF”), embedded memory, bipolar complementary metal oxide silicon (“BiCMOS”, which uses CMOS transistors in conjunction with bipolar junction transistor) mixed-signal and other semiconductors. We estimate that our revenue market segment share among total foundries worldwide was 56% in 2018. We also offer design, mask making, bumping, advanced packaging, and testing services.
We believe that our large capacity, particularly for advanced technologies, is a major competitive advantage. Please see “— Semiconductor Manufacturing Capacity and Technology” and “– Capacity Management and Technology Upgrade Plans” for a further discussion of our capacity.
We count among our customers many of the world’s leading semiconductor companies, ranging from fabless semiconductor companies, system companies to integrated device manufacturers, including, but not limited to, Advanced Micro Devices, Inc., Broadcom Limited, Hisilicon Technologies Co., Ltd., Intel Corporation, Marvell Technology Group Ltd., MediaTek Inc., NVIDIA Corporation, NXP Semiconductors N.V., Qualcomm Inc., Sony Corporation and Texas Instruments Inc.
Growth Opportunities
In light of the rapid growth in four major markets, namely mobile, high-performance computing, automotive electronics, and IoT, and the fact that focus of customer demand is shifting from process-technology-centric to product-application-centric, we have constructed four different technology platforms to provide customers with the most comprehensive and competitive logic process technologies, specialty technologies, intellectual properties, and packaging and testing technologies to shorten customers’time-to-design andtime-to-market.
Mobile platform: We offer leading process technologies such as5-nanometer Fin Field-Effect Transistor (“FinFET”),7-nanometer FinFET Plus,7-nanometer FinFET,10-nanometer FinFET,16-nanometer FinFET Plus (“16FF+”) technology, and20-nanometersystem-on-chip (“SoC”) logic process technologies, as well as comprehensive intellectual properties for premium product applications to further enhance chip performance, reduce power consumption, and decrease chip size. Forlow-end tohigh-end product applications, we offer leading process technologies such as12-nanometer FinFET compact technology (“12FFC”),16-nanometer FinFET compact technology (“16FFC”),28-nanometer high performance compact (“HPC”),28-nanometer high performance mobile compact plus (“28HPC+”), and22-nanometerultra-low power (“22ULP”) logic process technologies, in addition to comprehensive intellectual properties, to satisfy customer needs for high-performance andlow-power chips. Furthermore, for premium,high-end, mid-end, andlow-end product applications, we also offer the most competitive, leading-edge specialty technologies, including RF, embedded flash memory, emerging memory technologies, power management, sensors, and display chips as well as advanced packaging technologies such as the leading integratedfan-out (“InFO”) technology.
High-performance computing platform:We provide customers with leading process technologies such as5-nanometer FinFET,7-nanometer FinFET Plus, 7-nanometer FinFET and 16-nanometer FinFET (“16FF”), as well as comprehensive intellectual properties, including high-speed interconnect intellectual properties, to meet customers’ high-performance computing and communication requirements. We also offer multiple advanced packaging technologies such as chip on wafer on substrate (“CoWoS®”), InFO, and three-dimensional integrated circuits technologies to enable homogeneous and heterogeneous chip integration to meet customers’ performance, power, and system footprint requirements. We will continue to optimize our high-performance computing platform offerings to help customers capture market growth driven by data explosion and application innovation.
Automotive electronics platform: We offer industry’s leading automotive technology to support the three megatrends — safety, connectivity and green — in the automotive industry. We also provide a robust automotive IP ecosystem, which covers16-nanometer FinFET first and extends to7-nanometer FinFET, for advanced driver-assistance systems (ADAS), the most computation-demanding system in the automotive industry. In addition to the advanced logic technology platform, we offer broad and competitive specialty technologies, including40-nanometer embedded flash memory,28-nanometer and22-nanometer millimeter wave RF, high sensitivity CMOS Image/Lidar sensors, and power management IC technologies. All these automotive technologies are applied to our automotive process qualification standards based onAEC-Q100 standards.
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