Entegris (ENTG) 8-K Entegris Raises Outlook for Second Quarter

Bertrand Loy

President and CEO

Bertrand Loy

President and CEO

Entegris:

A Premier Materials and Solutions Provider

Entegris:

A Premier Materials and Solutions Provider

Exhibit 99.2

Analyst Day 2014  |  2

The New Entegris

The New Entegris

Entegris provides yield-enhancing materials and solutions

for the most advanced manufacturing environments

Analyst Day 2014  |  3

A Compelling Platform

A Compelling Platform

Track record of financial discipline

and execution

Higher cash flow and earnings

leverage

Customer focused –

uniquely

positioned in the ecosystem

Unit-driven model levered to

growing demand in semiconductor

and adjacent markets

Market leadership with breadth

and depth of technology

Delivering

Enhanced Value

for All Stakeholders

Analyst Day 2014  |  4

The New Entegris: A More Powerful Operating Platform

The New Entegris: A More Powerful Operating Platform

Note:

Financial

metrics

exclude

ATMI’s

discontinued

operations.

1

Excludes

$3.2M

of

Entegris

sales

to

ATMI,

2

Includes

$30M

run-rate

cost

synergies,

3

U.S.

and

foreign,

issued

and

pending.

$693 million

$132 million

Approx. 2/3

2,800

1,547

Net Sales

EBITDA

% Unit

Driven

Employees

Patents

2013

Stronger financial profile to drive growth, deliver

attractive returns for shareholders

Today

ATMI

ACQUISITION

$1.05

billion

$248

million

Approx. 4/5

3,400

2,981

+45%

+88%

Greater

Stability

Stronger

Talent

Technical

Depth

1

2

3

Analyst Day 2014  |  5

Consistency of cash flows

Allows for sustained investment in R&D and in

new markets

In the “sweet spot”

of industry growth

More attractive to key talent

Benefits of a unit-driven, recurring revenue model

A Unit-Driven Model + Sticky Solutions = Greater Stability

A Unit-Driven Model + Sticky Solutions = Greater Stability

78%

Unit Driven

22%

Capex

Driven

Large market for materials

supporting legacy nodes

Semiconductor Industry Year-End Capacity by Linewidth

(MSI/Quarter)

Source: Gartner, April 2014.

ProForma Sales

0

500

1,000

1,500

2,000

2,500

3,000

3,500

97

98

99

00

01

02

03

04

05

06

07

08

09

10

11

12

13

14

15

16

17

18

Year

0.5 micron to 130 nm

90

nm

-

45

nm

32 and below

Analyst Day 2014  |  6

Growing Position Among Other Semiconductor Suppliers

Growing Position Among Other Semiconductor Suppliers

Entegris ranks as one of the largest materials solutions providers among

publically held companies focused on the semiconductor industry

Note: Reflects 2013 reported revenue for companies with US equity; Entegris revenue pro forma for ATMI.

OEM Equipment

Components

Materials

CCMP

UCTT

BRKS

PLAB

FORM

ACLS

NANO

MTSN

AEIS

Less than $1B

$1B to $2B

More than $2B

Applied/TEL

ASML

KLA

LAM

Entegris

MKSI

Analyst Day 2014  |  7

Broad Presence in Unit-Driven, High Value Applications

Broad Presence in Unit-Driven, High Value Applications

Leveraging current Entegris technologies into adjacent markets

where process control and purity requirements are critical

Semi

Flat

Panel

PV Solar

Data

Storage

Compound

Semi/LED

Resource

Efficiency

Life

Sciences

Adjacent markets moving closer in

process control and purity requirements

Leveraging current Entegris

technologies into adjacent markets

Analyst Day 2014  |  8

Key IC Growth Drivers

Wearable electronics

New generations of mobile phones

and tablets with longer battery life

Stabilization of PC sales

The “internet of things”

Positive Underlying Market Dynamics

Wafer Starts to Resume Growth

Positive Underlying Market Dynamics

Wafer Starts to Resume Growth

Source: Gartner forecast: Semiconductor silicon wafers, worldwide, 1Q14 update.

Advances in semiconductors enable new electronics, drive demand

-1.0% CAGR

Worldwide Wafer Starts

(Bn Square Inches)

+10.3% CAGR

+3.8% CAGR

4.0

4.8

5.3

6.4

6.9

8.3

8.9

8.4

7.0

9.7

9.4

9.4

9.4

9.8

10.2

10.5

10.9

Analyst Day 2014  |  9

Industry and technology demands of customers continue to evolve

putting Entegris solutions at sweet spot of demand

Cost of technology and increased

complexity of the process

Increased number of materials

Shorter technology nodes

Increasing the value of yield-

enabling solutions

Positive Underlying Market Dynamics

The Industry’s Technology Challenges Require New Solutions

Positive Underlying Market Dynamics

The Industry’s Technology Challenges Require New Solutions

Source: Entegris estimates.

More Steps due to Multi-Patterning,

Compounded by Lower Yield

Technology Node in Nanometers

0

500

1,000

1,500

2,000

2,500

0%

20%

40%

60%

80%

100%

90

65

45

32

28

20

14

10

Mature Yield

No. Steps

Analyst Day 2014  |  10

Uniquely Positioned Across the Semiconductor Ecosystem

Uniquely Positioned Across the Semiconductor Ecosystem

Equipment

Makers

Device

Makers

Materials Suppliers

Combined Customers as

% of Pro Forma Sales

Customer 1

Customer 2

Customer 3

Customer 4

Customer 5

Customers

6-10

10.5%

7.0%

6.8%

5.0%

2.3%

9.2%

Analyst Day 2014  |  11

Capabilities to Support the Customer

Capabilities to Support the Customer

The scale and infrastructure to capitalize on global demand trends

Pro Forma FY13 Sales by Region

North America 25%

Europe 11%

Asia Pacific 64%

Employees

North America 51%

5%

Asia Pacific 44%

Europe and Israel

Asia Pacific

North America

Germany

Israel

France

Singapore

Malaysia

China

Korea

Japan

California

Colorado

Minnesota

Texas

Massachusetts

Taiwan

Arizona

Connecticut

Analyst Day 2014  |  12

Breadth of Entegris Portfolio

Breadth of Entegris Portfolio

Market leadership positions across the entire IC wafer fabrication process

ATMI

Lithography

Advanced

Photoresist

Packaging

Filtration

Gas/Liquid

Purification

Etch

Gas Filters

and

Diffusers

Gas

Purification

Specialty

Materials

Deposition

Copper

Plating

Deposition

Materials

Gas Filtration

and

Purification

Clean

Formulated

Cleans

Filtration

Fluid

Handling

Containers

CMP

Formulated

Cleans

Filtration

Brushes

and Pad

Conditioners

Implant

Safe Gas

Delivery

Systems

Electrostatic

Chucks

Fab Facility

Advanced

FOUPs

AMC

Filtration

Bulk

Chemical

Delivery

Wafer

Shippers

A leader in yield-enabling materials and solutions for advanced manufacturing

Entegris

Gas

Purification

Specialty

Materials

Specialty

Materials

Specialty

Materials

Formulated

Cleans

Analyst Day 2014  |  13

CTO

Our New Business Organization

Merging technology platforms to maximize value creation for customers

Global Sales

and Marketing

Electronic

Materials

Operations

Advance Deposition

Materials

Gas

Microcontamination

Control

Specialty Gases

Surface Prep and

Integration

Business

Development

Liquid

Microcontamination

Control

Fluid Management

and Control

Liquid Packaging

Microenvironments

Specialty Materials

eVOLV™

BrightBlack®

Critical Materials

Handling

ATMI

Entegris

Blend

Pro Forma 2013 Sales

$ in millions

CMH

$660

EM

$392

$1,051

Analyst Day 2014  |  13

Analyst Day 2014  |  14

Foundation for the New Entegris

Foundation for the New Entegris

Financial

Objective

Investment

priorities

Now

R&D

Internal capabilities

New market

development

Pay down debt

Cash flow

Growth in excess

of market

Best in class among

specialty materials

companies

Then

Growth in excess

of market

R&D

Infrastructure

Acquisitions

Buy back

Best in class among

components and

subsystems companies

Target

model

Analyst Day 2014  |  14

Analyst Day 2014  |  15

Focus on our customers

Integrate ATMI platform successfully

Achieve our target model

Pay down our debt

Build a high-performance organization

Priorities for the next 12-18 months

Focused on Execution

Focused on Execution

Analyst Day 2014  |  16

A Compelling Platform

A Compelling Platform

Track record of financial discipline

and execution

Higher cash flow and earnings

leverage

Customer focused –

uniquely

positioned in the ecosystem

Unit-driven model levered to

growing demand in semiconductor

and adjacent markets

Market leadership with breadth

and depth of technology

Delivering

Enhanced Value

for All Stakeholders

Entegris®,

the

Entegris

Rings

Design®

and

Creating

a

Material

Advantage®

are

trademarks

of

Entegris,

Inc.

©2014 Entegris, Inc. All rights reserved.

James A. O’Neill, Ph.D.

Chief Technology Officer

James A. O’Neill, Ph.D.

Chief Technology Officer

Differentiation in a Disruptive Environment

Differentiation in a Disruptive Environment

Analyst Day 2013  |  2

Key Takeaways: In the Right Place at the Right Time

Key Takeaways: In the Right Place at the Right Time

Entegris is uniquely positioned to enable new paradigms        

within the materials ecosystem

Our contamination control capabilities are critical to device  

yield in an increasingly complex manufacturing environment

Our global capabilities facilitate customer engagements

that foster improved responsiveness and trust

Wins at the leading edge drive revenues for today and

years to come

Analyst Day 2013  |  3

The Industry’s Endless Search for More

The Industry’s Endless Search for More

Advances in semiconductors enable new electronics

which drive demand for new semiconductors

Moore’s Law

New technology nodes

Disruptive technologies 

(patterning, device, materials)

More process steps    

(greater process complexity)

More difficult

contamination issues   

(more challenging yield ramp)

Demand for

electronics

Improved

performance

Lower cost

Less power

Analyst Day 2013  |  4

Litho 1

Center image: Intel High-k Penryn microchip 2009

Disruptive Technologies Required to Achieve Moore’s Law

Disruptive Technologies Required to Achieve Moore’s Law

Multi Patterning

Metal

gate

Ge/Si S/D

PMOS

New Materials 

New Structures 

FinFET Device

High-k metal gate transistor

With advanced materials and critical handling technologies,

Entegris is now the leading enabler for advanced nodes

Fin Height

Fin Width

Gate Length

Litho 2

Post Develop.

Bake

Etch for

Line Control

Analyst Day 2013  |  5

Increasing Interdependency within Semiconductor Ecosystem

Increasing Interdependency within Semiconductor Ecosystem

Entegris delivers yield-enhancing solutions across the entire

semiconductor ecosystem

Lithography, Etch, Deposition, Clean, CMP, Implant, Fab Facility

Customer

collaborations

are

key

to

advanced

node

challenges

Device

Materials

Customers Care About:

Technology Performance

Process Yield

Device Cost

Equipment

Analyst Day 2013  |  6

Leveraging technology and infrastructure to address customer needs

Leader in Materials and Materials Handling for Defect-Free Processing

Leader in Materials and Materials Handling for Defect-Free Processing

Developmental capability

close to all customers

Process and applications

support skillset

Comprehensive supply

chain excellence

Customer value

proposition: higher yields,

improved performance,

reduced costs

Global Infrastructure

Filtration, purification

and handling solutions

for gases, liquids, solids

and critical substrates

Advanced electronic

materials for defect-free

processing

Enabling solutions to

most challenging

customer problems

Portfolio Breadth

Molecular science

creation and formulation

Film fabrication and

integrity management

Collaborative development

agreements with leading

IDMs and OEMs

Comprehensive patent

portfolio across product

lines and geographies

Technical Depth

Analyst Day 2013  |  7

Interfacial science and analytics

Materials synthesis and formulation

Material application engineering

Membrane science and engineering

Sub-10 nm liquid filtration

Fluid handling, sensing, control

and dispense

Gas purification

Environment control for critical substrates

Specialty coating engineering

Culture of innovation

Depth of Core Capabilities

Depth of Core Capabilities

i2M Center for Advanced Materials Science

Application of

fundamental

science to

robust product

development

Analyst Day 2013  |  8

Broad IP portfolio with global protection

in U.S. and key Asian regions

2,981 patents and patent applications

Significant portion (~81%) of portfolio

covers North America and Asia (South

Korea, Taiwan and China)

IP covers products and key innovations

related to manufacturing, design and use

Long history of innovation provides a

framework for even more powerful

combined Entegris

Source: Entegris, May 2014

Broad Patent Portfolio

Broad Patent Portfolio

North

America

34%

Global IP Coverage

Asia

47%

Europe

13%

Global

2%

ROW

4%

2,981 Patents and Applications

Analyst Day 2013  |  9

Industry Leading Capabilities Close to Customers

Industry Leading Capabilities Close to Customers

Strategically located technology centers to facilitate customer

engagements

Work locally on many pressing technology problems

Hands-on approach to all development and customer application challenges

Joint development agreements with top IDMs, OEMs and consortia

Supports engagement model of local interactions and increased responsiveness and trust

Europe and Israel

Asia Pacific

North America

Germany

Israel

France

Singapore

Malaysia

China

Korea

Japan

California

Colorado

Minnesota

Texas

Massachusetts

Taiwan

Arizona

Connecticut

Analyst Day 2013  |  10

Direct engagement by

engineering teams

Pilot capability at most sites

Growing our share

*NDAs

and

JDAs

–

Entegris

only,

does

not

include

ATMI.

Deepening Our Collaboration with Strategic Customers

Deepening Our Collaboration with Strategic Customers

Relevant,

Trusted

Technology

Partner

Application

and Process

Knowledge

We Develop

Relevant Final

Solution

We Listen

We Respond

Quickly with

Prototypes

Expanded applications excellence

Faster new product development

New Development Agreements*

with Top IDMs and OEMs

6

3

7

12

25

47

2008

2009

2010

2011

2012

2013

Breadth of Entegris Portfolio

Breadth of Entegris Portfolio

Market leadership positions across the entire IC wafer fabrication process

ATMI

Lithography

Advanced

Photoresist

Packaging

Filtration

Gas/Liquid

Purification

Etch

Gas Filters

and

Diffusers

Gas

Purification

Specialty

Materials

Deposition

Copper

Plating

Deposition

Materials

Gas Filtration

and

Purification

Clean

Formulated

Cleans

Filtration

Fluid

Handling

Containers

CMP

Formulated

Cleans

Filtration

Brushes

and Pad

Conditioners

Implant

Safe Gas

Delivery

Systems

Electrostatic

Chucks

Fab Facility

Advanced

FOUPs

AMC

Filtration

Bulk

Chemical

Delivery

Wafer

Shippers

A leader in yield-enabling materials and solutions for advanced manufacturing

Entegris

Gas

Purification

Specialty

Materials

Specialty

Materials

Specialty

Materials

Formulated

Cleans

Analyst Day 2013  |  11

Analyst Day 2013  |  12

Combination Enables New Paradigms

Combination Enables New Paradigms

Gases and Gas-

wetted Surfaces

Solids and Solid

Materials Delivery

Application-based clean

gas delivery solutions

Gas manufacturing and

packaging excellence

Improved gas purifier

capacity and efficiency

Broader gas purification

offerings

Selective ALD precursors

Gas effluent monitoring

and delivery control

In-situ and ex-situ particle

control for critical

substrates

Wet Chemistries and

Wetted Surfaces

Benefits to Customer

Improved chemical

formulations and

chemical manufacturing

excellence

Optimized wet chemical

handling solutions

Material sensing and

control

Packaging and container

expertise

Improved material performance

Defect/impurity reduction and improved yield

Reduced ecosystem complexity and lower cost of ownership

Analyst Day 2013  |  13

Integration of Planarcore®

PVA brushes and

PlanarClean®

Technology could significantly

reduce copper post polish defects (particles,

organic residues and scratches)

Improved formulations for enhanced particle

and organics removal

Improved manufacturing for lower product

defectivity

Optimized brush design with polymer innovation

and surface treatment

Optimized pretreatment for reduced break-in times

pCMP Clean Formulations and Brush Technology

pCMP Clean Formulations and Brush Technology

Copper interconnect yield and reliability is a key

concern for advanced node technologies (<20 nm)

Analyst Day 2013  |  14

Purifier

Applications:

Toxic

gas

packaging

and

filtration expertise enables tighter impurity

control

Purifier

Media:

Carbon

adsorbent

capabilities

and purifier design drives improvements in

purifier capacity and efficiency

Gas

Delivery

Systems:

Gas

delivery

systems

and purification technology enables optimized

applications-based solutions

Implant Gas Handling and Purification Technology

Implant Gas Handling and Purification Technology

Gas impurity control to increasingly stringent

contamination standards is a key concern for

advanced node technologies

Analyst Day 2013  |  15

Integrating concentration sensing, fluidic control

and dispense expertise with formulation know-

how could improve mixing and managing of

volatile and complex chemistries for cleaning

and plating applications

Enables “blend-on-the-fly”

capability for

formulations prone to in-situ defect formation

Enables access to new wet chemical applications

Improved monitoring and control

Accelerated yield learning

Formulated Wet Chemistries and Point-of-Use Blending

Formulated Wet Chemistries and Point-of-Use Blending

Concentration control and in-situ defect formation

are increasing issues in formulated chemistries for

advanced node applications

Analyst Day 2013  |  16

Unique

Capability

–

Leverage

strengths

of combined Entegris to unlock new value

Technical capability for rapid innovation

Breadth of technologies

Global reach, local support

Unique

Position

–

Enable

new

paradigms

within the semiconductor ecosystem

Wet chemistries and wetted surfaces

Gases and gas-wetted surfaces

Solids and solid material delivery

Unique

Opportunity

–

Create

differentiated solutions to accelerate

customer yield ramps

Winning Strategy

Winning Strategy

Entegris®,

the

Entegris

Rings

Design®

and

Creating

a

Material

Advantage®

are

trademarks

of

Entegris,

Inc.

©2014 Entegris, Inc. All rights reserved.

Todd Edlund

SVP, General Manager –

Critical Materials Handling Business

A Platform for Growth and Stability

A Platform for Growth and Stability

Analyst Day 2014  |  2

Unique breadth of technology

in the industry

Market leading positions in key

segments

Critical to customers’

roadmaps,

but not dependent on the adoption

of a single technology

Focus on targeted growth areas

supported by strong portfolio of

defensible legacy positions

Unit-driven model

A Platform for Growth and Stability

A Platform for Growth and Stability

To be the first company

customers call for solutions

to improve their yields,

throughput and cost-

effectiveness when facing

contamination or materials

handling challenges.

Critical Materials Handling Mission

CMH Pro Forma 2013 Sales

$660 million

LMC

FMC

LP

ME

SM

Analyst Day 2014  |  3

Comprehensive Portfolio of Solutions

Comprehensive Portfolio of Solutions

Purify, deliver, handle and protect critical materials

Wet Etch and Clean

Lithography

Chemical Distribution

CMP

Life Sciences

Wafer Handling

Implant

Finished Wafer

and Devices

Data Storage

Dry Etch

Deposition

Flat Panel Display

Industrial

Aerospace

Life Sciences

Liquid

Microcontamination

Control (LMC)

Fluid Management

and Control (FMC)

Liquid Packaging

(LP)

Microenvironments

(ME)

Specialty Materials

(SM)

Analyst Day 2014  |  4

Liquid Microcontamination Control

Liquid Microcontamination Control

Filters and purifiers that remove

sub-micron sized particles, ions and

microbubbles from process liquids

Market Dynamics

Contamination-caused yield loss as line width shrinks

Increasing process steps and complexity

Improved metrology highlighting more impurities

Competitive Position

Market leader, one primary competitor in most

applications

Strategy

Leverage investments in R&D and manufacturing

capabilities

Migrate technology into adjacent markets

Filtration is the largest, most rapidly

growing product area

LMC

Proportion of Advanced Filtration

to Total Entegris Filter Sales

2009

2013

Legacy

nodes

65 nm

and below

35%

28%

3x nm

and below

Analyst Day 2014  |  5

Fluid Management and Control

Fluid Management and Control

Source: Entegris estimates

Market Dynamics

More precise blending for advanced chemistries

Trend towards single-wafer tools

Increasing requirements for process control,

flow capacity and purity

Increasing number of “wet”

tools due to multi-

patterning

Fewer but larger fab facility projects

Competitive Position

Fragmented, Entegris leads at high-end

Strategy

Leverage new sensing technologies

Ultrapure fluid handling,

measurement and control

solutions

The move to process automation is increasing

the available market for Entegris solutions

Key Entegris

Opportunities per System

FMC

11

24

28

63

26

40

72

138

Liquid

Filter

Gas Filter

Flow

Controller

Total Key

Parts

Batch

Single Wafer

Analyst Day 2014  |  6

Liquid Packaging

Liquid Packaging

Source: SEMI and Entegris analysis

Ultrapure container and

dispense solutions for highest

performance lithography and

WEC chemicals

Semi Wafer Processing Chemicals Market

$ in millions

Market Dynamics

Contamination of high-value chemistries during

transport and storage a growing concern

Efficient use of high-value chemicals

Need for safe handling

Competitive Position

Leading position for advanced solutions;

competition is alternate form factors

Strategy

Leverage combined technology capabilities

More usage of high-value chemistries is driving new

packaging needs and increasing market size

LP

$0

$200

$400

$600

$800

$1,000

$1,200

$1,400

Analyst Day 2014  |  7

Microenvironments

Microenvironments

Products that protect and transport

wafers, reticles and other critical

substrates from damage and

contamination

Market Dynamics

Increased impact of wafer contamination at

advanced nodes –

particles, moisture, metals, etc.

Next wafer size transition pushed out

Competitive Position

#1 position for advanced 300 mm FOUPs;

leading share for shippers at legacy wafer sizes

Strategy

Provide differentiated solution for 300 mm FOUPs

Be ready for 450 mm when it comes

ME

Winning virtually all opportunities

for new 300 mm FOUPs

In-Fab Test Results Show

Benefits of Entegris EBM FOUP

Technology Node

65 nm and

above

40 nm

28 nm

Standard Material

Entegris Barrier

Material (EBM)

1000

723

75

50

4

2

Analyst Day 2014  |  8

Specialty Materials

Specialty Materials

Advanced graphite, silicon carbide, 

and specialty coatings for industrial

and semiconductor manufacturing

processes

Market Dynamics

Use of higher temperatures in processes

Need for extended life and reduced process

variation solutions for consumables

Drive for fewer and smaller particles generated

Competitive Position

Serves multiple markets, with fragmented

competition of large diversified players

#1 position in e-chucks for ion implant

applications

Strategy

Leverage carbon and organic chemistry

knowledge to develop differentiated solutions

SM

Platform for growth in diversified markets

Wafer Holding

(Hot Chucks)

Implant

Beam-Line

Materials

(Carbon)

Dry Etch

Consumables

(SiC/PVD)

Next-Gen

Solutions

(Ceramics)

6

8

10

12

14

16

18

20

2013

2014

2015

2016

2017

2018

2019

2020

2021

Year

Critical Particle Size for Advanced

Semiconductor Processes

Analyst Day 2014  |  9

Entegris is Uniquely Positioned

Entegris is Uniquely Positioned

Breadth of solutions from production to consumption

Our technologies protect, transport, filter, control and dispense liquids

Our microenviroments protect and transport the wafer from grower to chip 

Analyst Day 2014  |  10

Competitive Landscape is Fragmented

Competitive Landscape is Fragmented

Customers favor more capable supplier partners for their increasing demands

Size of circles reflects approximate relative semiconductor sales, based on company estimates

Global Footprint

(# of

employees

–

logarithmic

scale)

Large

GEMU

Miraial

Pall

St. Gobain

Toyo Tanso

Parker

Shin Etsu

Gudeng

Small

Analyst Day 2014  |  11

Increased need for purity

Challenges We are Solving

Challenges We are Solving

Tighter filters that are cleaner

More robust microenvironments

Precise fluid management and sensing

Cleaner, more secure packaging

Higher performing dispense solutions

New materials and coatings solutions

New fluid handling solutions

Entegris Solutions

Increased need for process

control

New, expensive materials that

are susceptible to contamination

More demanding process

requirements (e.g., temperatures)

Analyst Day 2014  |  12

Example #1:

Increased Need for Purity

Example #1:

Increased Need for Purity

4X nm

ArF-I

High

Concentration

3X nm –

2X nm

ArF-i DP/NTD

Weaker

Concentration

<2X nm

ArF-i QP

EUV/DSA

Specialized

Ultra-

Cleaning

20-10 nm filtration/

purification: DIW

50-30 nm filtration

<10 nm filtration/purification:

chemicals/solvents

QuickChange®

NX

Symmetric

media

Asymmetric

PTFE media

New polymer, 

morphology

Solaris®

NMB

NanoFiber

PP media

Protego®

Plus

IPA purifier

Impact 8G UC

Torrento ®

X

Intercept®

Asymmetric

UPE Media

Selective

separation

Analyst Day 2014  |  13

For advanced nodes, lithography-caused defects have the largest impact

on yields, and microbubbles are the leading cause

Example #2

New, Expensive Materials that are Susceptible to Contamination

Example #2

New, Expensive Materials that are Susceptible to Contamination

No headspace,

indirect pressure

With headspace,

indirect pressure

Direct pressure

Threshold for significant

bubble generation

0

20

40

60

80

100

Dispense Time (in hours)

Threshold

for slight

bubble generation

1500

1750

2000

2250

2500

2750

3000

3250

Analyst Day 2014  |  14

Example #2

New, Expensive Materials that are Susceptible to Contamination

Example #2

New, Expensive Materials that are Susceptible to Contamination

Up to 99.9% utilization of expensive photo resist

vs. 95% for rigid bottles

Analyst Day 2014  |  15

Platform for Continued Expansion into Adjacent Markets

Platform for Continued Expansion into Adjacent Markets

30% of CMH sales are to markets outside of semiconductors

Flat

Panel

Semi

Solar

Industrial

Data

Storage

LED

Aerospace

Life

Sciences

Critical

Materials

Handling

Analyst Day 2014  |  16

Large, stable legacy business with clear pathways for growth

Need for more process purity and control driving market

growth and new product opportunities

Growing share in key areas

Platform for diversification

Summary –

A Platform for Growth and Stability

Summary –

A Platform for Growth and Stability

Entegris®,

the

Entegris

Rings

Design®

and

Creating

a

Material

Advantage®

are

trademarks

of

Entegris,

Inc.

©2014 Entegris, Inc. All rights reserved.

Chris Kramer

SVP, General Manager –

Electronic Materials Business

Chris Kramer

SVP, General Manager –

Electronic Materials Business

A Process Innovator

A Process Innovator

Analyst Day 2014  |  2

Growing importance of specialty

materials

Unique breadth of technology

in the industry

Track record of innovation

Market-leading positions in key

segments

Unit-driven model

Focus on customer engagement

to win at leading nodes

Formulated performance materials for advanced electronic devices

A Process Innovator

A Process Innovator

Leading global provider

of critical performance

materials that enable high

yield, cost-effective

manufacturing within the

semiconductor industry.

Electronic Materials Mission

SG

GMC

SPI

ADM

EM Pro Forma 2013 Sales

$392 million

Analyst Day 2014  |  3

SDS®

gas delivery systems

Chambergard™

gas diffusers

ViaForm®

copper plating

chemistry

Copper post-etch cleans

(ESC-784, ST-250)

PlanarClean®

advanced

copper post-CMP cleans

ProE-VAP®

emerging node

CVD, ALD precursors and

vaporization technologies

Planarcore®

PVA brushes

A History of Innovation

A History of Innovation

Resulting in market-leading solutions

Analyst Day 2014  |  4

Electronic Materials Enable

You Use Entegris Materials Every Day

You Use Entegris Materials Every Day

Entegris materials reside in your advanced electronic devices

Safe and efficient delivery of

highly toxic implant gases

Low-contamination

environments to manufacture

advanced chips

Complex circuitry through

proprietary metal interconnect

materials

Selective residue removal from

chips with formulated cleans

Analyst Day 2014  |  5

Why Materials Matter:

Advanced Electronics Require Advanced Materials

Why Materials Matter:

Advanced Electronics Require Advanced Materials

Increasing impact of materials innovation on chip performance

Source: Left  –

Entegris; right –

Semico Research

Node in nm

Positioned to benefit from growing complexity

and increased reliance on formulated materials

Node in nm

0

400

800

1,200

1,600

2,000

65

45/40

32/28

22/20

14

Chips Becoming More Complex…

Process Steps to Manufacture Chip

65

45/40

32/28

22/20

14

…and More Reliant on Materials

Relevant Impact on Performance

Scaling

Design

Materials

Analyst Day 2014  |  6

Integrated

product

portfolio

offerings

address

critical

customer

needs

Products that Span the Entire Integrated Stack

Products that Span the Entire Integrated Stack

Copper Conductor

Precursors for adv. barrier materials

PVD seed

Post-etch wet cleans

Copper plating materials

Post-copper CMP cleans

Wire

Via

Passivation

CVD dielectrics

Low-k dielectrics

Etch materials

Post-etch wet cleans

Photochemistry packaging

Contacts

CVD Tungsten (Fluorine free)

Liner/Barrier (TDMAT)

Post-etch wet cleans

Pre-Metal Dielectric

PMD film and dopants

Etch materials

Post-etch wet cleans

Photochemistry packaging

Materials Entegris provides to

the semiconductor industry

Intermetal Dielectric and Caps

Low-k dielectrics

Etch materials

Post-etch wet cleans

Post-CMP cleans

Photochemistry packaging

Gate/Junction Region

CVD dielectrics

SDS implant materials

ALD dielectric and metal precursors

Etch materials

Post-etch wet cleans

Post-CMP cleans

Photochemistry packaging

Memory Applications

High-k dielectrics and dopants

Metal electrode materials

Emerging memory-specific materials

IC Cross Section

Analyst Day 2014  |  7

Positioning of Specialty Gases (ATMI) with Gas Microcontamination

Control (Entegris)

Better serve delivery of toxic gases

Leverage carbon technology

Adding CMP products (Entegris) to Surface Prep and Integration

(ATMI) to optimize product development activities related to plating,

polish and clean

Advanced Deposition Materials (ATMI) adds depth of product

knowledge throughout entire semiconductor stack

Businesses aligned to better deliver product solutions to our customers

Electronic Materials Key Product Areas

Electronic Materials Key Product Areas

Specialty Gases

(SG)

Gas

Microcontamination

Control (GMC)

Surface Prep

and Integration

(SPI)

Advanced Deposition

Materials (ADM)

Analyst Day 2014  |  8

The Broadest Array of Specialty Chemical Solutions

for Advanced Semiconductor Manufacturing

The Broadest Array of Specialty Chemical Solutions

for Advanced Semiconductor Manufacturing

No competitor has similar breadth of product offerings

Entegris

Competitor A

(Chem.  Co.)

Competitor B

(Chem.  Co.)

Competitor C

(Chem.  Co.)

Competitor D

(Chem.  Co.)

Competitor E

(Filtrat. Co.)

Ion Implant

Gas

Plating

Materials

Wet Cleans

CMP

Components

Deposition

Materials

Gas 

Filtration/

Purification

Analyst Day 2014  |  9

Market Dynamics

Need for safe and efficient delivery of toxic gases

Growing need for dopants and precision

mixtures at advanced nodes

Competitive Position

Strong market share (~85%)

Competitive technology less capable

Strategy

Address new molecules and applications

for leading nodes

Grow into adjacent markets

Source: VLSI Research

Specialty Gases

Specialty Gases

Industry-standard, sub-atmospheric

pressure delivery solution for highly

toxic gases

Implant Materials

6% CAGR 2012-2017

SG

Advanced nodes create additional opportunities for specialty gases

-20%

-10%

0%

10%

20%

30%

0

50

100

150

200

250

Implant Materials

Y/Y Growth

Analyst Day 2014  |  10

Gas Microcontamination Control

Gas Microcontamination Control

Source: Entegris

Leader for process critical

gas and ambient

contamination control

GMC

Smaller Concentration and

More Critical Contaminants

Leader in the measurement and control of gas phase contamination

1 ppm

100 ppb

10 ppb

100 ppt

10 ppt

100 ppq

1

NH

Concentrations of most

critical contaminants

Types of contaminants

3

10

Acids, Bases

NH  SO  HCl

50

100+

?

1990

1995

2000

2005

2010

2015

3

3

2

3

2

NH  SO  HCl

Market Dynamics

More contaminants and need for

increased control

Proliferation of purification needs across

all processes

Applications in semi and other markets,

e.g., LED

Competitive Position

Technology leadership;

market leader in fragmented market

Strategy

Leverage strong analytical capabilities

with contamination control products

Analyst Day 2014  |  11

Surface Prep and Integration

Surface Prep and Integration

Industry-leading provider of

solutions that enable advanced

copper metallization

SPI

Well positioned to leverage integrated Entegris portfolio

IC Cross Section

Passivation

Dielectric

Etch Stop Layer

Dielectric Capping

Layer

Copper Conductor with

Barrier/Nucleation Layer

Pre Metal Dielectric

Tungsten Contact Plug

Metal 1 Pitch

Wire

Via

Market Dynamics

Device complexity and scaling is driving:

Introduction of new films/materials

Reduced tolerance for material loss and defects

Becoming more fragmented at each node transition

Competitive Position

Market leader in plating, post-etch cleans and Post

CMP clean solutions for Cu metallization

Strategy

Leverage integrated portfolio to increase value

Form strategic partnerships to identify solutions

for disruptive technologies

Metal 1

Global

(= M1X1.5~2 µm)

Intermediate

(= M1X1)

Analyst Day 2014  |  12

Advanced Deposition Materials

Advanced Deposition Materials

CVD and ALD materials used in front-

and back-end of line applications;

and packaging and delivery solutions

optimized for gases, liquids and solids

New Deposition Opportunities

on 3D Devices

FinFET Device

ADM

Logic and memory applications lead to future product line growth

Market Dynamics

Device complexity including 3D devices and dimensional

scaling is driving:

Increasing number of films including sacrificial layers

Introduction of new films/materials

Competitive Position

Leader in fragmented market

Identify and demonstrate new materials

Enable delivery and use of materials in high-volume

manufacturing

Strategy

Analyst Day 2014  |  13

Invested in infrastructure to serve global customer base

Customer Engagement Key to Winning Advanced Nodes

Customer Engagement Key to Winning Advanced Nodes

Deep technical expertise and

application knowledge

Unique capabilities to enhance

speed, effectiveness and efficiency

of material development process

Differentiating Product

Development Capabilities

Dedicated customer support organization

focused on specific customer needs

Collaborative customer engagements

which leverage global state-of-the-art

infrastructure/tech centers

Intense Customer Relationships

Korea  Tech

Taiwan Tech Center

Danbury Tech Center

i2M Center

Analytical Services Lab

San Diego Tech Center

Tokyo Applications Lab

Electronic Materials Labs and Tech Centers

Center

Analyst Day 2014  |  14

Ongoing interconnect scaling

proves challenging for Cu

electroplating process

Large via arrays (10

6

contacts)

require extremely low defect levels

ViaForm Excel™

chemistry is

industry-leading solution for

20 nm technology

Extendibility to 16 nm/14 nm

node demonstrated as well

Reliability of advanced interconnects requires void-free Cu fill

ViaForm®

Excel™

is a trademark of Enthone Inc., SEM images used with permission

of Enthone Inc.

Example #1 –

Advancement in Cu Electroplating

Example #1 –

Advancement in Cu Electroplating

M1

M2

Cross Section SEM

Top View SEM

Analyst Day 2014  |  15

New interconnect materials drives

stringent clean performance

requirements:

Highly efficient clean performance

Compatibility with dielectric, hard mask

and barrier metals

TitanKlean™

family of formulations is

industry-leading solution for post-etch

clean at 28 nm and beyond

Increasingly complex interconnect process integration requires

more sophisticated cleans

Example #2 –

Advancement in Interconnect Cleans

Example #2 –

Advancement in Interconnect Cleans

Dielectric HM

TK9 Family

Compatible with

Copper and Cobalt

Copper and Ruthenium

(Mx –

Vx Solution)

TK10 Family

Compatible with

Copper and Tungsten

(V0 –

M1 Solution)

Low

-k

TiN HM

Damaged Low-k

Barrier

EM barrier

Residues

Cu

Analyst Day 2014  |  16

Unique breadth of technology in the industry

Track record of innovation

Market-leading positions in key segments

Unit-driven model

Focus on customer engagement to win at leading nodes

Formulated, performance materials for advanced electronic devices

Summary –

A Process Innovator

Summary –

A Process Innovator

Entegris®, the Entegris Rings Design® and Creating a Material Advantage® are trademarks of Entegris, Inc.

©2014 Entegris, Inc. All rights reserved.

Corey Rucci

VP, Business Development

Corey Rucci

VP, Business Development

ATMI Integration and

New Business Development

ATMI Integration and

New Business Development

Analyst Day 2014  |  2

Began integration planning early in process (November 2013)

Focus on customers, productivity and profitability during

integration

Emphasis on speed of integration

Focus on retaining key talent from both organizations during

integration

Retain and leverage ATMI’s strengths

Adequately resource integration team with a proper charter

and governance

Our integration follows a formal methodology with a clear strategy

Integration Strategy –

Delivering on the Value

Integration Strategy –

Delivering on the Value

Preparation

People

Execution

Analyst Day 2014  |  3

Integration Strategy and Planning

Integration Strategy and Planning

Integration Strategy

and Pre-Planning

Detailed Integration

Planning

Cultural Integration

Merger

Implementation

Process

Optimization

Feb 4, 2014

Announcement

April 30, 2014

Acquisition Closing

Provide

Training

Create

Charter

Develop

Risk

Mitigation

Strategies

Develop

Comm.

Plans

Develop

Project

Integration

Plans

Develop

Staffing and

Retention

Plans

Review

Cultural

Due

Diligence

Develop

Cultural

Integration

Plan

Execute

Plans

Capture

Lessons

Learned

Analyze

and

Optimize

Processes

Complete

In Process

Not Started

Define

Integration

Strategy &

Governance

Step 2

Step 3

Step 4

Step 5

Step 6

Step 7

Step 8

Step 9

Step 10

Step 11

Step 12

Step 13

Step 14

Note: Based on the Pritchett model.

Develop

Process

Optimization

Plans

Step 1

Establish

Guiding

Principles

Analyst Day 2014  |  4

Accomplished to Date

Completed detailed integration

planning phase

Broad functional integration teams

comprised of Entegris and ATMI

Integration project plans and risk

mitigation strategies established

Completed staffing and retention

plans

Completed an effective “Day One”

All employee notifications completed

within 24 hours of closing

Next

Milestones

Q214

–

Q115

ERP Conversion

Product training

Employee compensation and

benefits harmonization

Office consolidation

Shifting focus to

product/revenue synergies

Integration Actions

Integration Actions

Analyst Day 2014  |  5

Cost Synergies

Cost Synergies

Tracking to $30M annualized synergy savings

Corporate

Back Office

Field Ops

$9 million

$13 million

$8 million

IT resources

Finance

resources

IT

Infrastructure

Legal/HR

Supply chain

Executive

SEC

Board of

Directors

Audit fees

Account

teams

Sales support

Office

consolidation

Analyst Day 2014  |  6

Timing of Projected Synergies

Timing of Projected Synergies

Annualized synergies ($ in millions)

2014

2015

$0

$10

$20

$30

$40

Q3

Q4

Q1

Q2

Q3

Q4

Analyst Day 2014  |  7

Fostering New Business Initiatives

Fostering New Business Initiatives

Analyst Day 2014  |  8

Leveraging Technology in Innovative Ways

Leveraging Technology in Innovative Ways

Product Description

eVOLV™

e-waste

recycling

system

“Zero-waste”

cost-effective and

scalable process for recovering

valuable metals and components

from end-of-life electronic waste

BrightBlack®

precision

carbon

Precision-engineered carbon

materials for clean and sustainable

technology solutions

Proprietary technology

Nearly 100% extraction efficiency

Significant cost advantage over

less “green”

alternatives such

as smelting

License and royalty model

Based on core SDS technology

Biogas upgrading

CO

2

capture

Energy storage

Adsorbed natural gas storage

Beads

Monoliths

Pellets

Powder

Key Features

Entegris®, the Entegris Rings Design® and Creating a Material Advantage® are trademarks of Entegris, Inc.

©2014 Entegris, Inc. All rights reserved.

Greg Graves

Executive Vice President and CFO

Greg Graves

Executive Vice President and CFO

Financial Perspective

Financial Perspective

ENTEGRIS PROPRIETARY AND CONFIDENTIAL

CONFIDENTIAL  |  2

Entegris: The Next Chapter

Entegris: The Next Chapter

Historical Perspective –

Bringing Together Two Strong Performers

The New Paradigm –

A Significant Shift in Earnings Power

Balance Sheet Management –

Leveraged but Prudent

Q2 Outlook –

Positive Trends Near-Term

CONFIDENTIAL  |  3

Sales

$693 Million

Operating Margin*

15%

Cash from Operations

$109 Million

Earnings Per Share**

$0.57

Strong performance

*Adjusted operating margin,**Non-GAAP earnings.

We Delivered in 2013

We Delivered in 2013

Declined 3% overall; contraction

consistent with our markets

and peers

Margin consistent with our target model

Cash balance of $384 million

Executed on our defined capital

allocation strategy

CONFIDENTIAL  |  4

Bringing Together Two Strong Performers

Bringing Together Two Strong Performers

$183

16.9%

$169

16.0%

$193

17.6%

$1,082

$1,055

$1,101

$1,025

$629

Revenue

$ in millions

Operating Margin

$ in millions and % sales

Entegris

ATMI

$70

19.1%

$66

18.2%

$57

16.2%

$113

15.8%

$103

14.8%

$136

18.2%

$399

$688

$749

$716

$693

$231

$337

$352

$366

$361

2009

2010

2011

2012

2013

2011

2012

2013

CONFIDENTIAL  |  5

Growth rate vs. industry (4 year CAGR)

Revenue Growth

Historical Performance vs. the Industry

Revenue Growth

Historical Performance vs. the Industry

Outgrowing the industry benchmark through the cycle

Note: All industry data per Gartner. Entegris industry benchmark

is 65% millions of square inches (MSI)

produced and 35% wafer front-end equipment (WFE). ATMI industry benchmark is 100% MSI produced.

Combined benchmark is 78% MSI produced and 22% WFE.

Entegris

ATMI

Combined

12.3%

14.8%

7.8%

11.8%

10.6%

13.8%

Industry

ENTG

Industry

ATMI

Industry

ENTG+ATMI

Combined

CONFIDENTIAL  |  6

Entegris: The Next Chapter

Entegris: The Next Chapter

Historical Perspective –

Bringing Together Two Strong Performers

The New Paradigm –

A Significant Shift in Earnings Power

Balance Sheet Management –

Leveraged but Prudent

Q2 Outlook –

Positive Trends Near-Term

CONFIDENTIAL  |  7

The “New Entegris”

Target Model

The “New Entegris”

Target Model

Major Assumptions:

No change to Entegris base target model

ATMI “Stand-alone”

target model

Synergies of $30 million consistent with current expectations;

no revenue synergies

Interest expense of $38 million based on current interest

rates and all debt outstanding

Tax rate of 28%

Shares outstanding 139 million

Existing

ENTG Target

Model

ATMI Stand-

Alone Target

Model

Synergies

New

Entegris

Target Model

Interest

Expense

+

+

+

=

CONFIDENTIAL  |  8

Quarterly

Revenue

Level

1

Revenue ($M)

$250

$280

$310

Adjusted

Operating

Margin

2

14% -

16%

17% -

19%

20%+

Earnings

Per

Share

3

$0.14 -

$0.16

$0.20 -

$0.22

$0.26+

“New Entegris”

Target Model

“New Entegris”

Target Model

1

Represents range of adjusted operating margin based on respective quarterly revenue levels.

2

Adjusted for amortization of intangible assets and one-time charges and expenses.

3

Includes interest expense of $38 million i.e., all debt outstanding; implied tax rate of 28%; assumes shares

outstanding equal 139 million.

$0.40 flow through on each $ of revenue

CONFIDENTIAL  |  9

Illustrative model –

2013 revenue at new target model

1

Adjusted operating income per new target model.

2

Combined EPS assumes no other income/expense, all existing debt remains outstanding,     

28% combined tax rate and 139 million shares outstanding.

EPS Baseline Formula

EPS Baseline Formula

2013

Illustrative

Result

Entegris

ATMI

Combined

Revenue ($M)

$693

$361

$1,051

$1,051

Operating Income

1

$173

% of Revenue

16.5%

Earnings Per Share

2

$0.57

$0.72

Apply

new target

model

26% Accretion

CONFIDENTIAL  |  10

Illustrative model –

modest industry growth and market outperformance,

operating leverage and debt reduction

1

Operating margin per revised target model including $30 million of synergies.

2

EPS assumes no other income/expense, 28% combined tax rate and 139 million shares outstanding.

3

Reflects three-year industry growth assumption which conservatively compares to

Gartner three-year CAGR

estimates: MSI +3.8% and WFE +6.1%.

4

Assumes term loan is reduced by $300 million. Each $100 million reduction in term loan is $0.016 per share annually.

EPS Growth Formula

EPS Growth Formula

2013

Pro Forma

Combined

Three-Year

Industry

3.0%

Growth >

Industry

1.5%

Operating

Leverage

Interest

Expense

Reduction

4

Revenue

$1,051

$1,149

$1,200

$1,200

$1,200

Operating Income

$173

$240

$240

% of revenue

17%

20%

20%

Interest expense

($38)

($38)

($28)

EPS

$0.72

$1.05

$1.10

1

2

3

Growth

CONFIDENTIAL  |  11

$ in millions

Projected Synergies

Projected Synergies

2015

2014

Anticipate 2015 actual synergies of $25M,

Exit 2015 with $30 million run rate

$0

$10

$20

$30

$40

$0.0

$2.5

$5.0

$7.5

$10.0

Q3

Q4

Q1

Q2

Q3

Q4

CONFIDENTIAL  |  12

$ in millions

Source: Company filings, Entegris management.

Combined Historical Capital Expenditures

Combined Historical Capital Expenditures

$32

$48

Maintenance level of capital expenditures is

approximately $50-55 million annually

$78

$102

$57

$53

$50

$32

$45

$53

$45

$48

$53

$50

$3

$25

$53

$9

2010

2011

2012

2013

2014E

2015E

2016E

Strategic Capacity Investments

Ongoing Capital Expenditures

CONFIDENTIAL  |  13

Free

Cash Flow

Capability

1

ATMI and ENTG combined

generated more than $500

million of free cash flow

since the 2009 trough

With major capital projects

largely complete, free cash

flow should re-accelerate

Annual free cash flow

generation going forward

of $100+ million

Strong Cash Flow Generator

Strong Cash Flow Generator

1

Free cash flow capability assumes no M&A activity, change in capital structure, or acquisition-related costs.

Cumulative Free Cash Flow

$ in millions

Illustrative

Actual Free

Cash Flow

$0

$100

$200

$300

$400

$500

$600

$700

$800

$900

CONFIDENTIAL  |  14

Entegris: The Next Chapter

Entegris: The Next Chapter

Historical Perspective –

Bringing Together Two Strong Performers

The New Paradigm –

A Significant Shift in Earnings Power

Balance Sheet Management –

Leveraged but Prudent

Q2 Outlook –

Positive Trends Near-Term

CONFIDENTIAL  |  15

Balance Sheet

Leveraged, but Also Very Liquid

Balance Sheet

Leveraged, but Also Very Liquid

$ and share data in millions

Following the transaction closing,

Entegris still has $2.60 in cash per share

May 31, 2014

Total Cash

$362

U.S. Cash

$95

Foreign Cash

$267

Total Assets

$1,755

Total Debt

$820

ABL Revolver

$0

Term Loan B

$460

Notes

$360

Shareholders' Equity

$757

Common Shares Outstanding

139

CONFIDENTIAL  |  16

Asset based loan/revolver (undrawn)

$75

Available based on dollar value of domestic

Accounts Receivable and Inventory

Term loan B

$460

1% annual principal payments during seven-year term of loan

Minimum interest rate of 3.50% (2.75% + Libor/0.75% Floor)

Required principal payments of “50% of excess cash flow”

Senior unsecured notes

$360

6.00% fixed interest rate for the term of loan

No principal payment during eight-year term of loan

Debt Structure

Debt Structure

No maintenance covenants (i.e. financial performance test)

Stress tested using a cyclical downside case

Significant

pro

forma

liquidity;

maintain

at

least

$125

million

between domestic cash and ABL

Balance Sheet Structured for Safety and Soundness

CONFIDENTIAL  |  17

Reducing leverage increases financial flexibility

Improves ability to complete additional strategic transactions

Makes share repurchases a viable option

Reducing leverage drives EPS growth

Current interest costs of $38 million equate to $.18 drag on annual EPS

At current rates each $100 million reduction in term loan is $.016

of annual EPS

Each $100 million of reduction in notes is $.03 of annual EPS

Intent is to repay debt through the following sources:

Current excess domestic cash of approximately $45 million

Domestic free cash flow

Tax

efficient

repatriation

of

international

cash

–

approximately

$150 million

Improving working capital management

Balance Sheet Management

Focus on Debt Reduction

Balance Sheet Management

Focus on Debt Reduction

CONFIDENTIAL  |  18

Entegris: The Next Chapter

Entegris: The Next Chapter

Historical Perspective –

Bringing Together Two Strong Performers

The New Paradigm –

A Significant Shift in Earnings Power

Balance Sheet Management –

Leveraged

but Prudent

Q2 Outlook –

Positive Trends Near-Term

CONFIDENTIAL  |  19

$ in millions, except per share data

1

Includes two months of ATMI results.

2

Includes estimated impact of purchase accounting, transaction costs and integration expenses.

Q2 Update Guidance

Comparison to Initial View

Q2 Update Guidance

Comparison to Initial View

Entegris

April 2014

Entegris

Revised

Entegris + ATMI

Revenue guidance

$165 -

$175

$175 -

$185

$235 -

$245

Net income

GAAP

$13 -

$18

($25 -

$30)

Non-GAAP

$14 -

$19

$24 -

$28

Earnings per share

GAAP

$0.09 -

$0.13

($0.18 -

$0.22)

Non-GAAP

$0.10 -

$0.14

$0.17 -

$0.20

Positive industry trends

Revenue strength across the business

1

2

2

CONFIDENTIAL  |  20

Key Takeaways

Key Takeaways

Our solutions are critical to yield improvement in advanced

manufacturing processes

We are combining two companies with track records of

outperforming the market and delivering superior profitability

The “new”

Entegris has significant earnings power and is poised

to deliver EPS in excess of $1.00 per share

We have a sound balance sheet structure with a clear plan to

reduce debt

Our Q2 outlook reflects positive near-term industry trends

Entegris®, the Entegris Rings Design® and Creating a Material Advantage® are trademarks of Entegris, Inc.

©2014 Entegris, Inc. All rights reserved.