DDi (DDICQ) 8-K This presentation may contain information about future

1

DDi Corp

Needham Growth Conference

Mikel Williams

President and CEO

January 11, 2008

Exhibit 99.1

Safe Harbor

This presentation may contain information about future

expectations, plans and prospects that may constitute

forward-looking statements for purposes of the Safe Harbor

provisions under the Private Securities Litigation Reform

Act of 1995.  Actual results or developments may differ

materially from those projected or implied in the forward-

looking statements.  More information about the risks and

challenges faced by DDi Corp. is contained in the Securities and

Exchange Commission filings made by DDi Corp.  DDi Corp.

specifically disclaims any obligation to update or revise

any forward-looking statements whether as a result of new infor-

mation, future developments or otherwise.

Non-GAAP Financial Measures

This presentation includes ‘adjusted EBITDA,’

‘adjusted Gross Profit,’

‘adjusted

Operating Income,’

‘adjusted SG&A’

and other non-GAAP financial measures as

defined in Regulation G of the Securities Exchange Act of 1934. Management

believes that the disclosure of non-GAAP financial measures, when presented in

conjunction with the corresponding GAAP measure, provides useful

information to

the Company, investors and other users of the financial statements and other

financial information in identifying and understanding operating

performance

for a

given level of net sales and business trends. Management believes that these non-

GAAP financial measures are important to understanding the Company’s business

because they reflect financial performance that is unencumbered by debt service,

non-cash charges and non-recurring or unusual items. These adjusted financial

measures are commonly used in the Company’s industry. However, these non-GAAP

measures should not be considered as alternatives to cash flow from operating

activities, as a measure of liquidity or as alternatives to net income as a measure of

operating results in accordance with generally accepted accounting principles. The

Company has provided a reconciliation of adjusted EBITDA and other non-GAAP

measures to GAAP financial information in the Schedule of Non-GAAP

reconciliations available by visiting DDI's

web site at www.ddiglobal.com/investor.

DDi Corp. Company Profile

•

29 year operating history

•

NASDAQ symbol: DDIC, ISS rating of 98.3

•

Created the “Time and Technology (Quick

Turn)”

concept

and

market

•

Leader in North American market for time critical, advanced technology

PCB engineering and manufacturing services

–

Preferred OEM source for next generation product development

–

~75% of orders OEM direct, or OEM directed to CM

•

Broad and diversified customer base

–

~ 1,000 Electronics OEM’s and Contract Manufacturers

•

1,300+ employees

•

5 NA PCB high mix/low-mid volume (HMLV) facilities

•

Leader in technology and high-end manufacturing capability

•

Completed restructuring of capital structure, operational realignment

around core PCB capabilities, and rebuilt management team

DDi Company History

Founded almost 30 years ago, DDi has a long and successful

track

record

of

technology

innovation and customer satisfaction

Details, Inc.

founded in

Anaheim, CA

Dynamic

Circuits

founded in

Milpitas,

CA

Blind and

Buried Vias

0.0002”

Trace &

Space

Electroless

Au

0.0059”

Mechanical

Vias

Installed

CO2/Yag

Laser

(0.0006”

Via)

Details, Inc. &

Dynamic Circuits

become Dynamic

Details, Inc. (DDi)

DDi

acquires

Automata

(Virginia)

DDi pioneers

Stacked

Micro Vias

(SMV™)

technology

DDi acquires

Sovereign

Circuits

(Ohio)

DDi acquires

Olympic

Circuits

(Toronto)

10 laser

drill

systems

on-line

1978

1991

1993

1995

1998

2000

2001

2003

2005

2006

2007

Files patent

application for

Flat-Wrap™

technology

Files patent

application for

Next

Generation

SMV™

DDi presents

Flat-Wrap™

to IPC

Standards

Committee

DDi

reorganization:

converts debt to

equity

Completes

reorganization

& retires all

outstanding

debt

Disposes

of non-

core

Assembly

Business

Global PCB Production by Region

Global PCB Market Overview

-

10.0

20.0

30.0

40.0

50.0

60.0

70.0

2005

2006

2007

2008

2009

2010

Global PCB Market Forecast

>18 Layer PCB Production by Region

Source: Prismark

2006, NTI 2007

42.2

47.8

50.7

53.7

57.7

Japan

$11.6B,

23%

•

The $50+ billion global PCB market is

projected to grow at an annual rate of 6%

through 2010

•

LCR region reflects greatest growth rate with

volume focus

•

America is a leading market for higher

technology requirements, microvia, complex

materials, high-mix and low-volume

Americas

$4.4B,

9%

Europe

$3.5B,

7%

Asia (ex China,

Japan), $17.1B,

33%

China

$14.2B,

28%

Americas

43%

Japan

23%

Europe

14%

Taiwan, Korea,

China

20%

61.0

North American PCB Market Overview

Source: Fabfile Online

$4.4 Billion NA PCB Market

Military/Aero

25%

Telecom

18%

Computer & Semi

28%

Auto

7%

Consumer

9%

Ind/Med

15%

DDi is a major player in the highly fragmented $4+ Billion North

American PCB market

The $4+ Billion Americas PCB market is driven

by continued demand from the Computer/Semi,

Telecom and Military/Aero industry segments…

The Americas market is served by a highly fragmented

landscape of PCB firms…

•

Several large, well-capitalized firms compete with hundreds of

smaller shops

•

Only 5 firms produce >$100 million in sales with NA facilities

•

Continued industry rationalization likely

5

34

43

383

Total = 465 PCB firms

Sales >$100M

$20M to $100M

$10M to $20M

<$10M

DDi

Merix

TTM

Sanmina-SCI

EIT

Source: Prismark 2006

North American PCB Market Drivers

Source: Prismark 2006

To

win

in

N.A.,

PCB

firms

will

need

to

continue

to

focus

on

customers’

demand

for

technology,

flexibility

and

speed

DDi is a North American leader in:

•

Layer count capability, currently up to 50 layers

•

Microvia technology, SMV™, and Next Gen

SMV™

•

Blind, buried technology

•

DFM, DFA coupled with extensive engineering support

•

Complex requirements, exotic materials, hybrid stackups

NA PCB Customer Purchase Drivers

Technology

17%

Proto/

Small Lot

27%

QT

Production

12%

Security

13%

Transitionary

11%

Other

20%

Source: Company data

~45%

10 Days

or Less

2007

~75%

10 Panels

or Less

Source: Company data

2007

DDi Order Volume by Panel Count

DDi Orders Filled by Turn Days

PCB Product Requirements & Trends

General product demand trends:

•

Product life cycles are shortening, NPI time to market is critical

•

Smaller end-product form factor coupled with high performance requirements

•

Smaller & more capable semi-conductor devices drives increased functionality

•

Lead-Free requirements to comply with environmental initiatives (RoHS/WEEE Directive)

Impact on PCB manufacturers and NA market requirements:

•

PCB’s have become more complex with demand for advanced fabrication capability that require:

–

Tighter geometries: finer lines & spaces, higher input/output (I/O) count to accommodate fine

pitch processor (0.4/0.5 mm pitch), smaller laser defined holes (microvias) and shrinking pad

sizes to support increased routing density

–

Signal Integrity (SI) –

Today’s circuit extend copper interconnects bandwidth by the GHz,

making PCB SI crucial to overall performance

–

High performance and complex material constructions

–

Power Distribution, Thermal Management, RF & Microwave applications

–

Material reliability must support multiple reflows at higher temperature lead free assembly

•

Speed in service and product delivery is critical

•

DFM, DFA and other levels of engineering support drive deeper OEM relationships

Sterling, VA

•

High Tech Proto &

Pre-Production

•

101,000 sq ft

•

MIL-PRF-31032

•

MIL-PRF-55110

•

AS9100 (in process)

Milpitas, CA

•

High Tech Proto &

Pre-Production

•

62,000 sq ft

•

AS 9100

•

MIL-PRF-55110

•

MIL-PRF-31032 (in process)

Anaheim, CA

•

High Tech Proto

•

76,000 mfg sq ft & Corp offices

•

IPC 6012

•

SEA-LES compliant

•

AS 9100

•

MIL-PRF-55110

•

MIL-PRF-31032 (in process)

Toronto, Canada

•

Standard Tech Proto

•

41,000 sq ft

•

IPC 6012

Youngstown, OH

(Sovereign Circuits)

•

Mil/Aero/HDC

•

77,000 sq ft

•

MIL-PRF-31032

•

MIL-PRF-55110

•

MIL-P-50884

•

AS 9100

Manufacturing Locations & Qualifications

Richardson, TX

•

Central Pre-Cam, DFM

•

Data Center

5 Operating Facilities, all ISO 9001:2000 Registered

1 Central Service Center

Distributed Sales Resources

2007 activity

Technology Leadership

•

Laser Drilling Capability:

–

Hitachi UV / CO2 Combo

–

Hitachi Dual Head CO2

–

ESI 5200 UV

•

Orbotech Paragon LDI

SMV™

Technology

•

Semiconductor demands drive PCB HDI technology 

•

DDi is a North American HDI leader with over 12 years

experience in the fabrication of microvias

•

DDi pioneered Stacked MicroVia Technology and is

enabling

technologies

for

customers’

next

generation

products

HDI

Capabilities

SMV™

Value Proposition

TD, FO, SI

60%

6

22-26

Trace Density

40%

4

16-20

Signal Integrity

20%

2

10-14

Fan out

10%

0

4-

8

Value Add

Area Reduction

Layer Reduction

Layer Count

1 + N + 1

TD, FO, SI

75%

8

22-26

Trace Density

50%

6

16-20

Signal Integrity

30%

4

10-14

Fan out

20%

2

4-

8

Value Add

Area Reduction

Layer Reduction

Layer Count

2 + N + 2

.010”

(.254 mm) BGA Pad’s

0.5 mm

.01968”

Layer 1

Layer 2

Layer 3

Layer 4

.004”

(.101 mm) SMV™

via

SMV™

Geometry

DDi’s

new

FLAT-WRAP™

Technology

Current standard for

IPC 6012B Class 3, 3 x wrap

•

Industry specification (IPC 6012B) requires wrap-around plating for filled blind and

buried via technology

•

Current industry practices produce excessive plated copper on the required layer

and limits the capability for surface feature packaging density (LWS dimensions)

•

DDi’s

new

FLAT-WRAP™

(patent

pending)

technology

reduces

surface

copper

thickness on multiple lamination product and enables finer geometries and

facilitates improved design capabilities

DDi’s FLAT-WRAP™

Technology

IPC 6012B Class 3, 3x wrap

Next

Generation

-

SMV™

Technology

•

DDi

continues

to

drive

technology

enhancements

in

the

SMV™

arena:

–

Requires one lamination cycle, reducing fabrication time

–

Eliminates plating cycle of inner layers

–

Improves inner layer characteristics, signal integrity and electrical characteristics

–

Reduces demand on plating and lamination, improving facility capacity utilization

–

Allows for thinner finished product

–

Initial customer builds now commencing, significant early interest

–

Patent application filed Feb 2007, pending

DDi is working to enable new technologies

to meet the needs of high-technology

customer demands with small, feature rich

products (ex. mobile phones, PDA,

cameras, and other such products).

Mil/Aero

11%

Medical

2%

Other

7%

Test Inst

5%

Auto/Ind

14%

Computer

26%

Telecomm

35%

Broad

Customer

Base

and

Market

Exposure

Strong in High-Technology Commercial Sectors

2007 through Q3 DDi market segment and customer concentration

Market Sector Concentration

Diverse Customer Base:

•

Largest OEM is <10% of sales

•

Top 10 accounts < 35% of sales

•

Top 30 accounts < 55% of sales

Semiconductors Drive PCB Requirements

•

Chips continue to provide additional features and capability, yet smaller

–

Combination

of

Chips

-

Intel®

Core™

2

Quad

and

Intel®

Core™2

Duo

processor

–

System-on-a-Chip (SOC) –

Microsoft & Broadcom combination for STBs

–

Phone-on-a-Chip –

single chip solution for 3G technology

•

Chips tailored to end product requirement

•

PCB product implications:

–

0.4 mm, 0.3 mm, 0.25 mm, and lower pitch requirements increase density

–

Drives

Microvias,

Stacked

MicroVias™

(SMV™),

Deep

Microvia

and

other

HDI Technology

–

Next

Generation

SMV™

can

further

enable

HDI

Technology

–

Engineering support critical to relationship

DDi’s leading position with the semiconductor players, coupled with Technology and

HMLV/Proto focus positions DDi for growth along with semiconductor development.

Moore’s law lives on

U.S. Military / Aerospace Market Sector

Marketplace highly fragmented with major players like TTM, EIT, FTG, Amphenol and DDi

competing with over 100 mainly small, single-facility PCB firms

High Growth Opportunity

for DDi

DDi Well Positioned to Win

in Military/Aero

•

Currently just 12% of DDi’s industry

concentration vs. an estimated

25% of N.A. market as a whole

•

DDi annualized run-rate of just

$20M, but continued growth trend

over last several quarters

•

Military/aero PCB spend less likely

to move offshore, security issues

•

Long-term relationships and

procurement programs

•

Reasonable pricing

•

Increasing technology demands

from PCB suppliers

•

Sales & operations focus with

expanded talent

•

Technology capabilities

•

Technology innovation (Flat-Wrap™)

•

Capability, Process and quality

certifications by facility appropriate to

industry needs:

Certification

AH

OH

SV

VA

ISO 9001:2000

X

X

X

X

ITAR

X

X

X

X

MIL-PRF-31032

X1

X

X1

X

MIL-PRF-55110

X

X

X

X

AS 9100

X

X

X

X1

X1 in process

Senior Management Team

Mikel Williams

CEO

CMG, LambdaNet, GTS, Price Waterhouse

Michael Mathews

SVP Mfg. OPS

Sanmina-SCI/Hadco, Raytheon

Jerry Barnes

Mark Hansen

Dennis Whitacre

Steve Wall

Dave Davidson

Cliff Pope

Arnold Martin

SVP Sales                   

VP Sales East Region

N. Central Regional Director

Eastern Regional Director

Military/Specialty Director

NW Regional Director

Inside Sales Director

TTM, Cosmotronic, Winonic, Toppan Elec.

Tyco, Advance Quick Circuits

Tyco, Amp Circuits

Harris Corp., Cosmotronic, Toppan

Sovereign Circuits

Sanmina-SCI, Ambitech, Tyco

Sanmina-SCI

Sally Goff

CFO

Cardiac Science, SMC Networks, Masimo, Coopers

& Lybrand LLP

Bob Houghton

VP, CIO

Western Digital, Adaptec, Litton Systems

Rajesh Kumar  

VP, CTO

Allied Signal/Honeywell/Litronic Industries, 

KCA Diceon

Kurt Scheuerman

VP, General Counsel

Paul, Hastings, Janofsky & Walker, LLP

Improved Capital Structure

ACTUAL

ACTUAL

ACTUAL

ACTUAL

ACTUAL

ACTUAL

9/30/2007

12/31/2006

     12/31/05

12/31/2004

12/31/2003

12/31/2002

  Total cash, including restricted

$18.9

$15.9

$29.0

$23.5

$18.7

$35.2

Line of Credit

-

-

$19.9

$15.9

-

-

Convertible Subordinated Notes

-

-

-

    -  

-

$200.0

Term Loans

$1.8

$2.0

-

    -  

-

-

Senior Credit Facility

-

-

-

    -  

$70.8

$68.5

DDi Europe Facilities Agreement

-

-

-

    -  

$25.3

$24.1

DDi Europe Working Capital Facility

-

-

-

    -  

$11.8

$4.2

Capital Lease Obligations

-

-

-

$1.0

$2.7

$4.9

Senior Accreting Notes, at face

-

-

-

$18.4

$17.7

$16.1

Series B Preferred Stock (face amount)

-

-

$19.3

$61.0

-

-

   Total Debt (Including Series B P/S)

$1.8

$2.0

$39.2

$96.3

$128.3

$317.8

    Net Cash / (Debt): Cash less Debt

$17.1

$13.9

($10.2)

($72.8)

($109.6)

($282.6)

Stockholders’ Equity

$112.0

$109.6

$108.0

$77.1

$91.4

($163.9)

Notes:

($ in millions)

From August through December 2007, the company has repurchased in the open market 304,453 shares of common stock

See footnotes in the filed financial statements for additional information)

for $1.9 million pursuant to the announced stock repurchase program.

Trended Operating Results

(Unaudited

and before transactions)

Annualized

9 Months YTD

($ in millions)

2007

2006

3

2005

2004

2003

Revenue

181.2

$        

198.1

$      

184.6

$      

189.0

$      

159.6

$      

Adjusted Gross Profit

1

36.4

$          

38.4

$        

31.3

$        

37.5

$        

20.0

$        

Adjusted Gross Margin

20.1%

19.4%

17.0%

19.8%

12.5%

Adjusted EBITDA

2

20.5

$          

19.8

$        

12.8

$        

20.4

$        

9.6

$           

Adjusted EBITDA margin

11.3%

10.0%

6.9%

10.8%

6.0%

General Comments Regarding Non-GAAP financial measures:  DDi

management believes that adjusted

gross profit and adjusted EBITDA, as defined below, provide useful information to the readers of the financial

statements in identifying and understanding operating performance and trends and reflect key metrics that

management uses to manage the business.

Notes:

(1)  Adjusted gross profit excludes non-cash comp charges and restructuring-related inventory impairments

(2)  Adjusted EBITDA represents earnings before income taxes, depreciation, net interest expense, foreign currency

and other gains/losses, non-cash compensation, restructruring

and other related charges and net income from disc ops.

(3)  2006 revenue included $23.7M of assembly sales.  DDi

sold its assembly business in Q3 2006.

*   Excludes PCB Sales associated with discontinued European Operations

**  Adjusted

GP

%

excludes

the

impact

of

restructuring

expenses,

amortization

and

non-cash

compensation

DDi PCB Net Sales and Adjusted Gross

Margin %* (last 3 year trended quarterly results)

(Unaudited, $ in Millions)

30

35

40

45

50

Q4 04

Q1 05

Q2 05

Q3 05

Q4 05

Q1 06

Q2 06

Q3 06

Q4 06

Q1 07

Q2 07

Q3 07

10%

15%

20%

25%

Net Sales

Adjusted GP%

**

Summary:  Foundation for Growth

•

DDi has the right business strategy and focus for the natural North

American PCB market demand:

–

Leader in key time sensitive and high technology quick-turn, HMLV

prototype and pre-production markets

–

Leader in technology innovation directed at customer requirements

–

Leader in PCB engineering support tied to manufacturing demand

–

Broad and diverse customer base of over 1,000 customers and with

direct access to OEMs

–

Extended position in key strategic vertical military, aerospace and high-

durability commercial markets provide solid growth opportunity

–

Broad product offering in rigid, flex and rigid-flex PCB capabilities

•

Strengthened management team with extensive industry experience

•

Solid capital structure, capability to fund CAPX and growth

•

Significant restructuring of business now completed

•

Complete 100% alignment around core PCB engineering and

manufacturing competency, focused on execution and market share gains

Trended Operating Results

Reconciliation of Non-GAAP Financial Measures

Annualized

9 Months YTD

($ in millions)

2007

2006

2005

2004

2003

Gross Profit Reconciliation:

Gross Profit

36.0

$             

37.9

$       

26.6

$       

24.9

$       

11.4

$       

Non-cash compensation

0.4

0.4

3.4

12.6

6.9

Restructuring related inventory impairment

-

-

1.3

-

1.7

Adjusted Gross Profit

36.4

$             

38.4

$       

31.3

$       

37.5

$       

20.0

$       

EBITDA Reconciliation:

EBITDA

17.8

$             

10.6

$       

1.2

$         

(0.3)

$        

(28.8)

$     

Non-cash compensation

2.3

1.5

4.6

18.3

9.4

Restructuring/reorganization-related charges

0.4

1.1

6.0

1.7

29.0

Officer's severance

0.2

1.0

0.7

-

Non-recurring legal accrual

1.7

1.0

0.7

-

Loss on Sale of Assembly

4.5

-

-

-

Adjusted EBITDA

20.5

$             

19.8

$       

12.8

$       

20.4

$       

9.6

$