Chipmos Technologies Bermuda 20-F 2006 FY Annual report (foreign)

Exhibit 4.50

ASSIGNMENT AGREEMENT

This Assignment Agreement (the “Agreement”) is made and entered into as of April 12, 2007 by and between ChipMOS TECHNOLOGIES INC., a company incorporated under the laws of the Republic of China (the “ROC”) and having its principal office of business located at No. 1, R&D Rd. 1, Science Park, Hsinchu, Taiwan, ROC (the “Assignor”) and ChipMOS TECHNOLOGIES (Bermuda) LTD., a company organized under the laws of Bermuda and having its principal office of business located at 11F., No. 3, Lane 91, Dongmei Rd., Hsinchu, Taiwan, ROC (the “Assignee”).

WHEREAS, Assignor has full title to, ownership of and interest in the “Assigned Patents” as defined below and Assignor has desired to assign and transfer to Assignee and Assignee has desired to acquire from Assignor fifty percent (50%) of the title to, ownership of and interest in the Assigned Patents; and

WHEREAS, in response to the desire of Assignor and Assignee to jointly own the Assigned Patents, Assignor and Assignee have jointly acted as the co-applicants of the Assigned Patents and wish to enter into certain formal agreement for assignment of fifty percent (50%) of the title to, ownership of and interest in Assigned Patents.

NOW THEREFORE, for good and valuable consideration the receipt of which is hereby acknowledged, the Assignor and the Assignee hereby agree as follows:

1. 1. “Assigned Patents” shall mean the issued patents and patent applications listed on Schedule 1, including, but not limited to, (i) all know-how, trade secrets, discoveries, concepts, ideas, technologies, whether patentable or not, including processes, methods, formulas and techniques related to the foregoing, any and all written, unpatented technical or scientific information developed or acquired by Assignor, including laboratory and clinical notebooks, research data, research memoranda, computer software (including source code), computer records, scientist’s notes, consultant reports, research reports from third parties, abandoned patent applications, invention disclosures, patentability reports and searches, patent and literature references, and the like developed or acquired before the date hereof related to such patents and patent applications; (ii) any and all copyrights, copyright registrations and copyrightable subject matter owned or controlled by Assignor related to such patents and patent applications; and (iii) any trademarks related to such patents or patent applications.

2. For good and valuable consideration Assignor hereby assigns to Assignee 50% of the right, title and interest in (i) the inventions disclosed in any patent or application listed on Schedule 1, (ii) the Assigned Patents, (iii) any patent which may issue from any application listed on Schedule 1, and (iv) all divisions, continuations, reissues, re-examinations and extensions of the patents and applications listed on Schedule 1.

3. The Assignor represents and warrants that it has the full and unencumbered right to sell and assign the interest herein sold and assigned and that the Assignor has not executed and will not execute any document or instrument in conflict herewith.

4. The Assignee hereby agrees and covenants to pay to the Assignor on the date to be further determined by the parties the aggregate purchase price of the Assigned Patents of US$6,400,000 in immediately available funds by wire transfer to a bank account or accounts designated by the Assignor.

5. The Assignor covenants and agrees that at any time upon request of the Assignee, the Assignor shall communicate to the Assignee or assigns all information known relating to said Assigned Patents and that the Assignor shall execute and deliver any papers and perform all other lawful acts deemed necessary or desirable by the Assignee to perfect title to the Assigned Patents.

6. The Assignor hereby grants to the Assignee the power to insert in this assignment any further identification that may be necessary or desirable to comply with the rules of any patent office of any country for recordation of this assignment.

7. This Agreement constitutes the entire agreement between the parties with respect to the assignment by the Assignor of the Assigned Patents to the Assignee, and supersedes all prior agreements and understandings, oral or written, with respect to such matters.

8. This Agreement shall be governed by and construed in accordance with the laws of ROC. In the event of any dispute arising from or in connection with this Agreement, both parties agree that the Taiwan Hsinchu District Court shall be the court of jurisdiction in the first instance.

IN WITNESS WHEREOF, the parties hereto have executed this Agreement as of the date first written above.

ChipMOS TECHNOLOGIES INC.
By:	/s/ R.B. Tsai
Name:	R.B. Tsai
ChipMOS TECHNOLOGIES (Bermuda) LTD.
By:	/s/ Shih-Jye Cheng
Name:	Shih-Jye Cheng

Schedule 1

The Assigned Patents include the following technologies, systems associated to the implementation of the technologies, and patents and patent applications:

Technology:

1. Package & Leadframe design

2. Rigid & Flex substrate design

3. Package assembly technology

-small tool/mold chassis design

4. Testing technology

-burn-in board design

-hi-fix/change kit/small tool design

5. Test program development

System:

1. Quality system

2. Logistic system

3. Financial system.

4. ITM system

4.1 Lotus Notes system application (OA, Work flow, DCC)

4.2 Business management system application

4.3 Personal data and payroll system of testing

4.4 Manufacture execution system of testing

4.5 Manufacture automation system of package assembly

4.6 Production automation system of package assembly

4.7 Test program management

4.8 System hardware

4.9 System software

4.10 System/data maintenance & support

    Patents and Patent Applications:

	IPO Filling No.	Patent No.	Patent Title	Patent Area
1	02247550.8	567897	Circuit Board for Preventing Spill of Molding Compound	CHINA
2	02251854.1	572893	TAPE TYPE SEMICONDUCTOR PACKAGE	CHINA
3	2247461.7	572341	CHIP-ON-FILM PACKAGE	CHINA
4	10/227341	6689638	Substrate on chip packaging process	USA
5	2247460.9	569240	SUBSTRATE-ON-CHIP PACKAGE	CHINA
6	10/327064	6703075	WAFER HANDLING METHOD FOR MAKING ADHESIVE DIES	USA
7	2130497.1		WAFER HANDLING METHOD FOR MAKING ADHESIVE DIES	CHINA
8	10/223350	7005054	Method for manufacturing probes of a probe card	USA
9	93134941	I263291	Chip Carrier Tape having Number Marking of Test Pads	TAIWAN
10	91220251	209955	TCP Package for SDRAM	TAIWAN
11	91112599	201917	MEMS METHOD FOR MAKING ANISOTROPIC CONDUCTIVE BOARD	TAIWAN
12	91112600	178861	ELECTRICAL DEVICE WITH NEEDLE ELECTRODES AND METHOD FOR FORMING THE SAME	TAIWAN
13	91112597	179646	METHOD FOR FORMING CONDUCTIVE WIRINGS OF ELASTIC BUMPS	TAIWAN
14	91112598	187943	METHOD FOR MAKING ANISOTROPIC CONDUCTIVE BOARD	TAIWAN
15	91114479	187956	WAFER-LEVEL CHIP SCALE PACKAGE AND METHOD FOR FABRICATING THE SAME	TAIWAN
16	91209907	208799	PROBE CARD ASSEMBLY WITH EXCHANGEABLE PROBE HEAD	TAIWAN
17	91114480	189242	WAFER LEVEL BURN-IN BOARD AND METHOD FOR FORMING THE SAME	TAIWAN
18	91220696	223539	Thermal Controlled Oven for Ball Soldering of BGA Package	TAIWAN
19	91211466	224364	ADJUSTABLE PROBE HEAD ASSEMBLY	TAIWAN
20	91211337	207137	DUAL-CHIP STACK STRUCTURE WITH BONDING WIRES AND BUMPS	TAIWAN
21	91211338	206963	DUAL FLIP-CHIP CROSS STACK STRUCTURE	TAIWAN
22	91211339	209359	PROBE CARD ASSEMBLY WITH CROSS STACKING SILICON SUBSTRATES	TAIWAN
23	91116680	192822	TOUCHING-TYPE ELECTRICALLY CONNECTING DEVICE FOR A PROBE CARD	TAIWAN
24	91211467	223809	FLAT MODULAR PROBE CARD	TAIWAN
25	10/198118	6621710	MODULAR PROBE CARD ASSEMBLY	USA
26	91210951	207135	FLEXIBLE PRINTED CIRCUIT FOR REPLACING BONDING WIRES	TAIWAN
27	91210949	209354	PROBE CARD ASSEMBLY WITH MULTI SILICON SUBSTRATES	TAIWAN
28	91210950	206179	PROBE CARD ASSEMBLY FOR PROBING A WAFER	TAIWAN
29	91210948	209353	PROBE CARD ASSEMBLY	TAIWAN
30	10/223297	6686615	FLIP-CHIP TYPE SEMICONDUCTOR DEVICE FOR REDUCING SIGNAL SKEW	USA
31	91118605	197568	PROBE HEAD AND METHOD FOR FORMING PROBE NEEDLES ON THE PROBE HEAD	TAIWAN
32	91136225	200066	Thickness Measuring Method for Liquid Crystal of Liquid Crystal on Silicon	TAIWAN
33	91218057	209399	INTEGRATED CIRCUIT PAKAGE WITH EXPOSED-CHIP CONFIGURATION	TAIWAN
34	91137088	194269	METHOD FOR MANUFACTURING A LEADFRAME WITH FINE PITCH INNER LEADS AND LEADFRAME FORMED FROM THE SAME	TAIWAN
35	91220939	209441	NON-CONTACT TYPE SEMICONDUCTOR PACKAGE	TAIWAN
36	91220940	211363	LCOS MICRO-DISPLAY MODULE	TAIWAN
37	91220938	211730	STACKABLE SEMICONDUCTOR PACKAGE	TAIWAN
38	91212794	210326	Interface Card Structure for Semiconductor Testing	TAIWAN
39	91118606	181850	Flexible Printed Circuit with Elastic Bump Electrodes and Method for Making the Same	TAIWAN
40	91216883	215236	ADAPTER FOR TEST MACHINE OF MEMORY MODULE	TAIWAN
41	91124414	I221024	MANUFACTURING PROCESS OF MEMORY MODULE WITH DIRECTLY CHIP-ATTACHING	TAIWAN
42	10/417263	6812720	MODULAR PROBE CARD WITH COAXIAL TRANSMITTER	USA
43	91216882	M242696	MODULAR PROBE CARD WITH COAXIAL TRANSMITTER	TAIWAN
44	91124413	I220785	MEMORY MODULE WITH DIRECTLY CHIP-ATTACHING AND METHOD FOR MAKING THEREOF	TAIWAN
45	91124412	190898	PROCESS AND APPARATUS FOR GRINDING A WAFER BACKSIDE	TAIWAN
46	10/721288	6960491B2	Integrated Circuit Packaging for Improving Effective Chip-Bonding Area	USA
47	03.13942	03.13942	Integrated Circuit Packaging for Improving Effective Chip-Bonding Area	FRANCE
48	10355068.2	10355068	Integrated Circuit Packaging for Improving Effective Chip-Bonding Area	GERMANY
49	91135243	200333	Integrated Circuit Packaging Process for Improving Effective Chip-Bonding Area	TAIWAN
50	0327510.4	GB2396964	Integrated Circuit Packaging for Improving Effective Chip-Bonding Area	UK
51	91219179	209415	CENTRAL-PAD MEMORIES STACK PACKAGE	TAIWAN
52	91137089		METHOD FOR CALIBRATING MEASUREMENT OF ACTIVE THICKNESS OF PLATING LAYER	TAIWAN
53	91134549	197628	PACKAGING PROCESS AND PACKAGE FOR STACKING CENTRAL-PAD MEMORIES	TAIWAN
54	91219485	215104	PROBE CARD ASSEMBLY	TAIWAN
55	91221249	224435	ELASTIC PROBE CARD	TAIWAN
56	91138212	198828	WAFER LEVEL CHIP SCALE PACKAGE	TAIWAN
57	91138207	204435	Wafer Level Packaging Method with a Stress Absorbing Film	TAIWAN
58	92117493	203490	Method for automatic calculating testing time of semiconductors	TAIWAN

59	92118419	I234696	Method for managing wafer test data in lot	TAIWAN
60	92202134	213010	MEMS PROBE HEAD	TAIWAN
61	92201652	219843	FLAT HIGH FREQUENCY PROBE CARD	TAIWAN
62	92203371	214726	WAFER LEVEL CHIP SCALE PACKAGE FOR PREVENTING DISCONNECTION OF REDISTRIBUTION TRACES UNDER CONDUCTIVE GEL POSTS	TAIWAN
63	92118417	I221016	Method for Managing Installation of Test Programs and System of the Same	TAIWAN
64	92202881	213203	LIGHT WEIGHT MEMORY MODULE	TAIWAN
65	92203370	217638	WAFER LEVEL CHIP SCALE PACKAGE WITH PIN LEADS	TAIWAN
66	92203739	220332	High frequent probe head with wiring improved structure	TAIWAN
67	92105301	204441	METHOD FOR MANUFACTURING PROBE HEADS FOR PROBING INTEGRATED CIRCUITS	TAIWAN
68	92203738	217640	Wafer level package with copper interconnecting chip	TAIWAN
69	92206840	213395	LCOS MICRO-DISPLAY MODULE FOR REDUCING STRESS	TAIWAN
70	92218529	M244481	Micro-display Device with Light-Adjusting Module Including Color-Splitting Mirror	TAIWAN
71	92205599	223152	Probe head for eliminating noise	TAIWAN
72	92110057	201938	Wafer level packaging process for protecting bump electrodes	TAIWAN
73	92110058	202876	Wafer level packaging process and structure thereof	TAIWAN
74	92110100	200972	Wafer level package for integrated circuits	TAIWAN
75	92206841	217663	Wafer Level Chip Scale Package with improved Pin Leads Strength	TAIWAN
76	10/435560	6781392	MODULARIZED PROBE CARD WITH COMPRESSIBLE ELECTRICAL CONNECTION DEVICE	USA
77	92112599	I231024	Wafer Level Chip Scale Package with Redistribution Wires by Wire Bonding and Method for Manufacturing the Same	TAIWAN
78	92113905	I220932	Modular probe head	TAIWAN
79	92113908	I221025	Wafer Level Chip Scale Package	TAIWAN
80	91214623	214685	TCP Type Semiconductor Device	TAIWAN
81	92121062	I220778	Stage of Inner Lead Bond and Manufacturing Method of the Same	TAIWAN
82	92219489	M245597	Back-Lighted Projecting Machine for Examining TCP/COF Packages	TAIWAN
83	92122847	I254436	Stacked Multi Chip Package with Central Bond Pad	TAIWAN
84	10/620448	6853205	Probe Card Assembly	USA
85	92117497	I221012	Method for Manufacturing Wafer Lever Chip Scale Package With Elastically Metal Conductive Lead and Structure from the Same	TAIWAN
86	92117498	I233681	Method for Manufacturing Wafer Lever Chip Scale Package and Structure from the Same	TAIWAN
87	92117495	I234868	Method for Manufacturing Wafer Lever Chip Scale Package	TAIWAN
88	10/680230	6946860	Modularized probe head	USA
89	92117496	I221015	Modular probe head	TAIWAN
90	92214588	M243781	Interposer With Bonding-Wire Contacts	TAIWAN
91	92122846	I224841	Film Ball Grid Array Package Structure Of An Image Sensor	TAIWAN
92	92214586	M243174	Capsule Endoscopes With Flexible Fin	TAIWAN
93	92214585	M243173	Improvement of Capsule Endoscopes	TAIWAN
94	92214587	M243175	Capsule Endoscopes	TAIWAN
95	92214583	M242179	Capsule Endoscopes With Rotatable Image Sensing Module	TAIWAN
96	92214584	M243172	Decomposable Capsule Endoscopes	TAIWAN
97	92214589	M244442	Probe Head for Decreasing Noise	TAIWAN
98	92216463	M242848	Pluggable Probe Head	TAIWAN
99	92216458	M243650	Probe Head For Inhibiting Cross Talk	TAIWAN
100	92216461	M242697	Improving Elastic Character of Probing Needles of Probe Head	TAIWAN
101	92216460	M243782	Probe Head With Chip Scale Package Type Probe Unit	TAIWAN
102	92216457	M243649	Interposer for Modular Probe Card	TAIWAN
103	92219490	M245598	Stage Structure for a Semiconductor Chip	TAIWAN
104	92216923	M242178	Capsule Endoscopes With Adjusting Focus Function	TAIWAN
105	92216994	M243170	Capsule Endoscopes With Adjusting Time of Capturing Image	TAIWAN
106	92126116	I226680	Chip Scale Package Of An Image Sensor	TAIWAN
107	92216995	M243779	Image Sensor Package	TAIWAN
108	92219714	M249210	Probe Head With Groove	TAIWAN
109	92219715	M248021	Structure of Probe Card	TAIWAN
110	92219717	M249376	Image sensor with low noise	TAIWAN
111	92131140		METHOD FOR MANUFACTURING CHIP ON FILM TYPE IMAGE SENSOR AND STRUCTURE OF THE SAME	TAIWAN
112	92131141	I239602	Chip on film type image sensor package and method for manufacturing of the same	TAIWAN
113	92219716	M249375	Image Capturing Module with Chip on Glass Configuration	TAIWAN
114	92131137	I227942	Image sensor with metal sealing	TAIWAN
115	92220557	M248023	Memory stacked package with central pads	TAIWAN
116	92220555	M248160	Image sensor for avoiding sensing area being contaminated	TAIWAN
117	92132649	I239095	Image sensor package with multi substrates and method for manufacturing of the same	TAIWAN
118	92132648	I239106	Image sensor package with sealing sensing region configuration	TAIWAN
119	92220556	M248165	Structure of image sensor module	TAIWAN

120	92221239	M246808	Build-up image sensor package	TAIWAN
121	92221243	M246810	Optical glass assembly image sensor	TAIWAN
122	92221238	M246807	Multi chip image sensor package	TAIWAN
123	92221246	M246802	Image sensor package with glass on chip configuration	TAIWAN
124	92221247	M246795	Cutting tool of semiconductor sawing blade	TAIWAN
125	93111308	I245960	Method for manufacturing micro-display module and structure of the same	TAIWAN
126	93206239	M254723	Micro-display module with UV delay cured adhesives	TAIWAN
127	93204752	M253899	Moisture Resistance Structure for BGA Package	TAIWAN
128	93141419	I246762	Tape of TCP with Guiding Compound between Dummy Leads	TAIWAN
129	93118577	I245394	Device including an opto-electronic chip with inner lead bonding and method for manufacturing the same	TAIWAN
130	93206850	M256367	Wafer Cartridge having a Wafer-guiding Device	TAIWAN
131	93111307	I227363	Micro-display Module with Wire-bridge	TAIWAN
132	93113239	I252953	Micro-display module for decreasing stress	TAIWAN
133	93206072	M260734	Platform Fixture for a Press Tester for Measuring Resist Compression of a Semiconductor Chip	TAIWAN
134	92136314	I241018	Method for Manufacturing Wafer Level Image Sensor Package with Chip on Glass Configuration and Structure of the Same	TAIWAN
135	92136313	I242819	Method for Manufacturing Chip on Glass Type Image Sensor and Structure of the Same	TAIWAN
136	92222330	M250470	Imaging Module with Chip on Glass Configuration	TAIWAN
137	92222329	M249377	Camera Module with Flip Chip Type Image Sensor	TAIWAN
138	10/671735		Method for Fabricating Anisotropic Conductive Substrate	USA
139	11/011104		Modularized probe head	USA
140	93206545	M255943	Improved probe head	TAIWAN
141	93203732	M253166	Chip on film type image sensor	TAIWAN
142	93203727	M265615	Interposer of probe card	TAIWAN
143	93203726	M253771	Low noise probe head	TAIWAN
144	93106560		INTERPOSER OF PROBE CARD	TAIWAN
145	11/317978		Flexible substrate for package	USA
146	200510091771.7		SUBSTRATE FOR TAPE CARRIER PACKAGE	CHINA
147	93141897	I245396	Substrate for Tape Carrier Package (TCP) with reinforced leads	TAIWAN
148	11202898		TAPE FOR TAPE CARRIER PACKAGE	USA
149	200510078386.9		TAPE FOR TAPE CARRIER PACKAGE	CHINA
150	93141417	I239088	Tape for tape carrier package	TAIWAN
151	11/202685		FLIP CHIP PACKAGE SRUCTURE	USA
152	200510078387.3		FLIP-CHIP-ON-FILM PACKAGE STRUCTURE	CHINA
153	93141899	I251319	Chip-on-film package	TAIWAN
154	93221489	M269566	Multi chips bonding tool for COF package	TAIWAN
155	93115881	I232940	Probe card with improved probe pin sets	TAIWAN
156	93113240		Method of manufacturing wafer level light emitting diode package and structure of the same	TAIWAN
157	93115883	I245417	Flip-chip type image sensor chip	TAIWAN
158	93115882	I234870	Quad flat non-lead image sensor package and method for manufacturing the same	TAIWAN
159	93115527	I244203	Method for Packaging Image Sensors in a Tape and Structure from the Same	TAIWAN
160	93116066	I246381	Mounting structure of bumpless chip	TAIWAN
161	93141422		Hermetic sealing of image sensor chip	TAIWAN
162	93137652	I248665	Image sensor package and method for manufacturing the same	TAIWAN
163	93115149	I253699	Bump with Flat Top and the Method of Forming the Same	TAIWAN
164	93221233	M268574	Positioning Device of An Optical Measurement Platform	TAIWAN
165	93221490	M269567	Tape automated bonding tool for COF package	TAIWAN
166	93134940	I248179	Multiple Chip Module Package	TAIWAN
167	93141901	I250597	Method for Manufacturing Multi-Chip Package having Encapsulated Bond-wires between Stack Chips	TAIWAN
168	200510082151.7		CHIP-UNDER-TAPE PACKAGE STRUCTURE AND MANUFACTURE THEREOF	CHINA
169	93121053	I250623	Chip-Under-Tape package and process for manufacturing the same	TAIWAN
170	93211114	M260870	Memory Package	TAIWAN
171	93211115	M260869	Thin type memory module	TAIWAN
172	11/188860		Electronic device having pin electrode with slight warpage	USA
173	93125405	I237316	Electronic device having pin electrode with slight warpage	TAIWAN
174	200510093174.8		Thermal enhanced BGA package	CHINA
175	93125407	I245387	Thermal enhanced BGA package	TAIWAN
176	93125408	I256115	Memory package	TAIWAN
177	11/208595		Bump structure of opto-electronic chip	USA
178	93213431	M260879	Bump structure of opto-electronic chip	TAIWAN
179	93125406	I260069	Memory module and method for manufacturing the same	TAIWAN
180	11/011200		Modulized probe head for high frequency	USA
181	200510093070.7		Modulized probe head for high frequency	CHINA

182	93125409		Modulized probe head for high frequency	TAIWAN
183	93115528	I232567	Image sensor package with a FPC surrounding a window	TAIWAN
184	93119546	I242250	Process for Packaging Image Sensors on Flexible Substrate	TAIWAN
185	200510093175.2		Thermally Enhanced flip chip package	CHINA
186	94103782		Improvement of ESI laser repair system 9300/9350 back stop	TAIWAN
187	200510093811.1		Driver IC package with multi-layer bumps	CHINA
188	93133488	I256120	Driver IC package with multi-layer bumps	TAIWAN
189	93221231	M268731	Apparatus for Carrying Inspection Trays of Small Components	TAIWAN
190	93133489	I235511	Method of manufacturing light emitting diode package and structure of the same	TAIWAN
191	200510114523.X		Testing method and structure for LEDs in wafer form	CHINA
192	93133490		Testing method and structure for LEDs in wafer form	TAIWAN
193	11/254676		Image Sensor Package Structure	USA
194	93216784	M264652	Image Sensor Package Structure	TAIWAN
195	11/254660		Package Structure of Image Sensor Device	USA
196	93216783	M264651	Package Structure of Image Sensor Device	TAIWAN
197	11/254677		Method for assembling image sensor and structure of the same	USA
198	200510093817.9		Method for assembling image sensor and structure of the same	CHINA
199	93132005	I244177	Method for assembling image sensor and structure of the same	TAIWAN
200	93141340	I258451	Tape Cutter Assembly	TAIWAN
201	11/254659		MULTI-CHIP IMAGE SENSOR MODULE	USA
202	93216782	M264775	Image Sensor with Multi Chip Module	TAIWAN
203	11/254658		Image sensor package	USA
204	93216781	M264648	Image sensor package	TAIWAN
205	93132007	I236768	Low Noise Multi Chip Image Sensor Package	TAIWAN
206	93216785	M263908	Capsule endoscopes with multi-chip module configuration	TAIWAN
207	93132006	I256116	Thin type integrated circuit package	TAIWAN
208	200510062653.3		USING BUMP PACKAGE STRUCTURE AND METHOD THEREOF	CHINA
209	94108499		USING BUMP PACKAGE STRUCTURE AND METHOD THEREOF	TAIWAN
210	11/202820		FLIP-CHIP-ON-FILM PACKAGE STRUCTURE	USA
211	200510078388.8		FLIP-CHIP-ON-FILM PACKAGE STRUCTURE	CHINA
212	94108261		THERMALLY ENHANCED FLIP-CHIP-ON-FILM PACKAGE	TAIWAN
213	11/076935		Probe Card Interposer	USA
214	200510098693.3		Probe Card Interposer	CHINA
215	94117086		Flexibly thermally enhanced Chip-on-Film (COF) package	TAIWAN
216	200510102504.5		Stacked Chip Package Structure, Chip Package and Fabricating Method Thereof	CHINA
217	94118859	I254462	Stacked Chip Package Structure, Chip Package and Fabricating Method Thereof	TAIWAN
218	200510102505.X		Stacked Chip Package Structure, Chip Package and Fabricating Method Thereof	CHINA
219	94118858	I252590	Stacked Chip Package Structure, Chip Package and Fabricating Method Thereof	TAIWAN
220	94111878		FLIP CHIP BGA PACKAGE	TAIWAN
221	11/364324		Image sensor module package	USA
222	200510114333.8		Image sensor module package	CHINA
223	2005100908.X		Method for Manufacturing Cavity-Down Chip Packages	CHINA
224	94111879	I260754	Method for Manufacturing Cavity-Down Chip Packages	TAIWAN
225	11/228234		Pillar grid array package	USA
226	200510093178.6		Pillar grid array package	CHINA
227	94111881		Pillar grid array package	TAIWAN
228	200510103419.0		Chip Package and Stacked Chip Package Structure	CHINA
229	94127459	I258212	Chip Package and Stacked Chip Package Structure	TAIWAN
230	11/302736		CHIP PACKAGE WITHOUT CORE AND STACKED CHIP PACKAGE STRUCTURE THEREOF	USA
231	200510103414.8		CHIP PACKAGE WITHOUT CORE AND STACKED CHIP PACKAGE STRUCTURE THEREOF	CHINA
232	94123850		CHIP PACKAGE WITHOUT A CORE AND STACKED CHIP PACKAGE STRUCTURE USING THE SAME	TAIWAN
233	94117089		MEMORY MODULE FOR REPACKAGING BGA PACKAGES	TAIWAN
234	11/271797		METHOD OF MANUFACTURING AN INJECTOR PLATE	USA
235	200510093179.0		METHOD OF MANUFACTURING AN INJECTOR PLATE	CHINA
236	94108262	I244122	METHOD OF MANUFACTURING AN INJECTOR PLATE	TAIWAN
237	11/364330		METHOD FOR FABRICATING A PLURALITY OF ELASTIC PROBES IN A ROW	USA
238	200510093180.3		METHOD FOR FABRICATING A PLURALITY OF ELASTIC PROBES IN A ROW	CHINA
239	94117087		ELASTIC PROBE PINS IN ROW AND METHOD FOR FABRICATING THE SAME	TAIWAN
240	11/326749		Manufacturing process for chip package without core dielectric	USA
241	200510103416.7		Manufacturing process for chip package without core dielectric	CHINA
242	94124656	I255561	Manufacturing process for chip package without core dielectric	TAIWAN
243	200510098506.1		Method for Manufacturing Cavity-Down Chip Packages and Device Made from the Method	CHINA
244	94116561	I264784	Method for Manufacturing Cavity-Down Chip Packages and Device Made from the Method	TAIWAN

245		200510103366.2		Stacked Structure of Semiconductor Packaging Device	CHINA
246		94210084	M280007	Stacked Structure of Semiconductor Packaging Device	TAIWAN
247		11/332409		Thin IC package for improving heat dissipation from chip backside	USA
248		200510108092.6		Thin IC package for improving heat dissipation from chip backside	CHINA
249		94127021		Thin IC package for improving heat dissipation from chip backside	TAIWAN
250		200510093392.1		LOC (LEAD-ON-CHIP) IC PACKAGE	CHINA
251		94124277		LOC (LEAD-ON-CHIP) IC PACKAGE	TAIWAN
252		200510114522.5		Optoelectronic Chip Package and Method for Manufacturing the Same	CHINA
253		94118641	I256141	Optoelectronic Chip Package and Method for Manufacturing the Same	TAIWAN
254		200510120420.4		FLEXIBLE SUBSTRATE FOR PACKAGE	CHINA
255		94137504		FLEXIBLE SUBSTRATE FOR PACKAGE	TAIWAN
256		200510108617.6		Tape for Package	CHINA
257		94125700	I263348	Tape for Package	TAIWAN
258		200510093508.1		METHOD FOR LASER MARKING ON A WAFER	CHINA
259		94118640		METHOD FOR LASER MARKING ON A WAFER	TAIWAN
260		94124182		FLEXIBLE SUBSTRATE WITH STRAIN SURVEY DESIGN	TAIWAN
261		11/317978		Flexible substrate for package	USA
262		200510113204.7		Flexible substrate for package	CHINA
263		94128293		Flexible substrate for package	TAIWAN
264		11/303184		FLEXIBLE SUBSTRATE CAPABLE OF PREVENTING LEAD THEREON FROM FRACTURING	USA
265		200510108618.0		FLEXIBLE SUBSTRATE CAPABLE OF PREVENTING LEAD THEREON FROM FRACTURING	CHINA
266		94128292		FLEXIBLE SUBSTRATE CAPABLE OF PREVENTING LEAD THEREON FROM FRACTURING	TAIWAN
267		200510108619.5		FLIP-CHIP-ON-FILM PACKAGE STRUCTURE CAPABLE OF PREVENTING SEALING MATERIAL FROM OVERFLOWING	CHINA
268		94128291		FLIP-CHIP-ON-FILM PACKAGE STRUCTURE CAPABLE OF PREVENTING SEALING MATERIAL FROM OVERFLOWING	TAIWAN
269		11/301860		CHIP STRUCTURE AND STACKED CHIP PACKAGE	USA
270		200510108096.4		CHIP STRUCTURE AND STACKED CHIP PACKAGE	CHINA
271		94131797		CHIP STRUCTURE AND STACKED CHIP PACKAGE	TAIWAN
272		11/302737		LIGHT EMITTING DIODE AND FABRICATING METHOD THEREOF	USA
273		200510103537.1		LIGHT EMITTING DIODE AND FABRICATING METHOD THEREOF	CHINA
274		94131795	I255568	LIGHT EMITTING DIODE AND FABRICATING METHOD THEREOF	TAIWAN
275		11/217,978		Chip Package Structure	USA
276		200610003254.4		Chip Package Structure	CHINA
277		200510108620.8		Flexible Substrate for Package	CHINA
278		94128290	I253158	Flexible Substrate for Package	TAIWAN
279		200510093509.6		Chip Carrying Tape with Counting Marks at Side(s)	CHINA
280		2005-282030		Chip Carrying Tape with Counting Marks at Side(s)	JAPAN
281		94122911		Chip Carrying Tape with Counting Marks at Side(s)	TAIWAN
282		200510093510.9		Tape and Device for COF Package	CHINA
283		94120222	I263346	Tape and Device for COF Package	TAIWAN
284		11/249465		LASER MARK ON AN IC COMPONENT	USA
285		200510092925.4		LASER MARK ON AN IC COMPONENT	CHINA
286		94125739		LASER MARK ON AN IC COMPONENT	TAIWAN
287		11/234,774		CHIP PACKAGE STRUCTURE AND BUMPING PROCESS	USA
288		11/361646		CHIP PACKAGE STRUCTURE AND BUMPING PROCESS	USA
289		200510117212.9		CHIP PACKAGE STRUCTURE AND BUMPING PROCESS	CHINA
290		94136150		CHIP PACKAGE STRUCTURE AND BUMPING PROCESS	TAIWAN
291		11/352,001		CHIP PACKAGE HAVING ASYMMETRIC MOLDING	USA
292		200510089824.1		CHIP PACKAGE HAVING ASYMMETRIC MOLDING	CHINA
293	��	94126167		CHIP PACKAGE HAVING ASYMMETRIC MOLDING	TAIWAN
294		11/351,651		CHIP PACKAGE WITH ASYMMETRIC MOLDING	USA
295		200510090107.0		CHIP PACKAGE WITH ASYMMETRIC MOLDING	CHINA
296		94125376		CHIP PACKAGE WITH ASYMMETRIC MOLDING	TAIWAN
297		11/302610		CHIP PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING BUMPS	USA
298		200510108091.1		CHIP PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING BUMPS	CHINA
299		94129919		CHIP PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING BUMPS	TAIWAN
300		200510098222.2		Chip-on-Glass (COG) Package of Image Sensor	CHINA
301		94128972	I260787	Chip-on-Glass (COG) Package of Image Sensor	TAIWAN
302		11/326,789		UNIVERSAL CHIP PACKAGE STRUCTURE	USA
303		200510117075.9		UNIVERSAL CHIP PACKAGE STRUCTURE	CHINA
304		94135129		UNIVERSAL CHIP PACKAGE STRUCTURE	TAIWAN
305		11/355483		NOZZLE PLATE AND MANUFACTURING PROCESS THEREOF	USA
306		200510103190.0		NOZZLE PLATE AND MANUFACTURING PROCESS THEREOF	CHINA

307	200610007603.x		NOZZLE PLATE AND MANUFACTURING PROCESS THEREOF	CHINA
308	94131051		NOZZLE PLATE AND MANUFACTURING PROCESS THEREOF	TAIWAN
309	95102570		NOZZLE PLATE AND MANUFACTURING PROCESS THEREOF	TAIWAN
310	11/433150		LIGHT EMITTING DIODE PACKAGE	USA
311	200510115216.3		LIGHT EMITTING DIODE PACKAGE	CHINA
312	94137764		LIGHT EMITTING DIODE PACKAGE STRUCTURE	TAIWAN
313	11/322408		Modular probe card	USA
314	200510103332.3		Modular probe card	CHINA
315	94131978		Modular probe card	TAIWAN
316	11/255,710		STACKED-TYPE CHIP PACKAGE STRUCTURE	USA
317	200510115213.X		STACKED-TYPE CHIP PACKAGE STRUCTURE	CHINA
318	94137762		STACKED-TYPE CHIP PACKAGE STRUCTURE	TAIWAN
319	11/246,403		SEMICONDUCTOR PACKAGING PROCESS AND CARRIER FOR SEMICONDUCTOR PACKAGE	USA
320	200610057299.X		SEMICONDUCTOR PACKAGING PROCESS AND CARRIER FOR SEMICONDUCTOR PACKAGE	CHINA
321	11/249464		Replaceable modular probe head	USA
322	94127877		Replaceable modular probe head	TAIWAN
323	200610099189.X		BUMPED STRUCTURE AND ITS FORMING METHOD	CHINA
324	94131169		BUMPED STRUCTURE AND ITS FORMING METHOD	TAIWAN
325	200610104249.2		Semiconductor Package for Improving Chip Shift During Molding	CHINA
326	94133400	I261366	Semiconductor Package for Improving Chip Shift During Molding	TAIWAN
327	200610099190.2		FLIP CHIP PACKAGE STRUCTURE	CHINA
328	94139584		FLIP CHIP PACKAGE STRUCTURE	TAIWAN
329	11373531		CHIP PACKAGE STRUCTURE	USA
330	200610000572.5		CHIP PACKAGE STRUCTURE	CHINA
331	200620000457.3		CHIP PACKAGE STRUCTURE	CHINA
332	94143093		CHIP PACKAGE STRUCTURE	TAIWAN
333	11/314780		WAFER STRUCTURE AND BUMPING PROCESS	USA
334	200610064870.0		WAFER STRUCTURE AND BUMPING PROCESS	CHINA
335	200610066936		METHOD FOR INSPECTING A CHIP TRAY	CHINA
336	94136736		METHOD FOR INSPECTING A CHIP TRAY	TAIWAN
337	11/400182		High frequency IC package and method for fabricating the same	USA
338	95104286		High frequency IC package and method for fabricating the same	TAIWAN
339	200610099588.6		Probe Head with Vertical Probes, Method for Manufacturing the Probe Head, and Probe Card Using the Probe Head	CHINA
340	95102204		Probe Head with Vertical Probes, Method for Manufacturing the Probe Head, and Probe Card Using the Probe Head	TAIWAN
341	11/451,997		SEMICONDUCTOR DEVICE AND MANUFACTURING PROCESS THEREOF	USA
342	200610057300.9		SEMICONDUCTOR DEVICE AND MANUFACTURING PROCESS THEREOF	CHINA
343	95106753		SEMICONDUCTOR DEVICE AND MANUFACTURING PROCESS THEREOF	TAIWAN
344	11/454558		BUMPING PROCESS	USA
345	200610064835.9		BUMPING PROCESS	CHINA
346	95106519		BUMPING PROCESS	TAIWAN
347	94138164		CHIP-ON-GLASS SENSOR PACKAGE FOR PREVENTING ITS SENSOR REGION FROM CONTAMINATION OF OUTGASSING DURING CURING AN ENCAPSULANT AND METHOD FOR FABRICATING THE SAME	TAIWAN
348	200610099116.0		Device and Method of Bonding An Image Sensor Chip to A Glass Substrate	CHINA
349	94144367		Device and Method of Bonding An Image Sensor Chip to A Glass Substrate	TAIWAN
350	11/416357		CHIP PACKAGE	USA
351	200610058156.0		CHIP PACKAGE	CHINA
352	95106254		CHIP PACKAGE	TAIWAN
353	200610104251.X		Chip Carrier and Chip Package Structure Thereof	CHINA
354	95103721		Chip Carrier and Chip Package Structure Thereof	TAIWAN
355	95108939		Substrate Fixing Jig for Wire Bonder	TAIWAN
356	200610099584.8		Chip-on-Glass Package of Image Sensor	CHINA
357	95110299		Chip-on-Glass Package of Image Sensor	TAIWAN
358	200610103270.0		Method for Manufacturing Probe Card	CHINA
359	95124781		Method for Manufacturing Probe Card	TAIWAN
360	200610111277.7		Chip-on-Film Packages and Multi-Layer Wiring Tape Thereof	CHINA
361	95111120		Multi-Layer Wiring Tape for Chip-on-Film Packages	TAIWAN
362	200610099587.1		Reinforced Chip-on-Film Package	CHINA
363	95110295		Reinforced Chip-on-Film Package	TAIWAN
364	200610111470.0		Thermally Enhanced Chip-on-Film Package	CHINA
365	95111122		Thermally Enhanced Chip-on-Film Package	TAIWAN
366	200610099186.6		Chip-on-Film Package with Elongated Lead(s)	CHINA
367	95111123		Chip-on-Film Package with Elongated Lead(s)	TAIWAN

368	200610109241.5	Inner Lead Bonding Tape and Tape Carrier Package Utilizing the Tape	CHINA
369	95110292	Inner Lead Bonding Tape and Tape Carrier Package Utilizing the Tape	TAIWAN
370	200610099187.0	Semiconductor Package Having a Universal Die Pad	CHINA
371	95110293	Semiconductor Package Having a Universal Die Pad	TAIWAN
372	200610104250.5	Fabricating Process of Leadframe-Based BGA Packages and Leadless Leadframe Utilized in the Process	CHINA
373	95110298	Fabricating Process of Leadframe-Based BGA Packages and Leadless Leadframe Utilized in the Process	TAIWAN
374	200610098733.9	Semiconductor Package for Prevent Contamination of Bonding Pads of Chip by Chip-attach Material and the Substrate Utilized	CHINA
375	95111126	Semiconductor Package for Prevent Contamination of Bonding Pads of Chip by Chip-attach Material and the Substrate Utilized	TAIWAN
376	200610078937.6	Semiconductor Chip Having Fine Pitch Bumps and Bumps Thereof	CHINA
377	95111889	Semiconductor Chip Having Fine Pitch Bumps and Bumps Thereof	TAIWAN
378	200610078938.0	Inspection Method for Package Carrier and Apparatus Thereof	CHINA
379	95114828	Inspection Method for Package Carrier and Apparatus Thereof	TAIWAN
380	200610111477.2	Leadless Semiconductor Package with Electroplated Layer Embedded in Encapsulant and the Method for Fabricating the Same	CHINA
381	95110296	Leadless Semiconductor Package with Electroplated Layer Embedded in Encapsulant and the Method for Fabricating the Same	TAIWAN
382	11/481719	CHIP PACKAGE AND WAFER TREATING METHOD FOR MAKING ADHESIVE CHIPS	USA
383	200610083380.5	CHIP PACKAGE AND WAFER TREATING METHOD FOR MAKING ADHESIVE CHIPS	CHINA
384	95109125	CHIP PACKAGE AND WAFER TREATING METHOD FOR MAKING ADHESIVE CHIPS	TAIWAN
385	200610112070.1	TAPE STRUCTURE FOR PACKAGING	CHINA
386	95128836	TAPE STRUCTURE FOR PACKAGING	TAIWAN
387	200610111233.4	Chip-on-Film Package for Lessening Deformation of Film	CHINA
388	95116536	Chip-on-Film Package for Lessening Deformation of Film	TAIWAN
389	200610111544.0	Chip-on-Film Package and Wiring Film Utilized	CHINA
390	95116535	Chip-on-Film Package and Wiring Film Utilized	TAIWAN
391	200610109599.8	BGA Package with Leads on Chip	CHINA
392	95120350	BGA Package with Leads on Chip	TAIWAN
393	200610109240.0	Matrix Package Substrate and Method for Determination of Sawing Type of Package Array	CHINA
394	95126329	Matrix Package Substrate and Method for Determination of Sawing Type of Package Array	TAIWAN
395	200610111540.2	Chip Package with Array Pads and Method for Manufacturing the Same	CHINA
396	95119569	Chip Package with Array Pads and Method for Manufacturing the Same	TAIWAN
397	95126005	Chip Structure	USA
398	200610099115.6	Chip Structure	CHINA
399	95126005	Chip Structure	TAIWAN
400	200610111238.7	High Frequency IC Package and Method for Fabricating the Same	CHINA
401	95120084	High Frequency IC Package	TAIWAN
402	200610111274.3	Process for MEMS Fabricating Alloy Probe(s)	CHINA
403	95125908	Process for MEMS Fabricating Alloy Probe(s)	TAIWAN
404	95124971	Chip Scale Image Sensor Package and Module Utilizing the Same	TAIWAN
405	11/530165	Chip Package and Manufacturing Method Thereof	USA
406	200610104061.8	Chip Package and Manufacturing Method Thereof	CHINA
407	95126496	Chip Package and Manufacturing Method Thereof	TAIWAN
408	200610111923.X	Leadframe on Offset Stacked Chips Package	CHINA
409	95128831	Leadframe on Offset Stacked Chips Package	TAIWAN
410	11/470,494	Chip Package and Manufacturing Method Thereof	USA
411	200610098	Chip Package and Manufacturing Method Thereof	CHINA
412	95124446	Chip Package and Manufacturing Method Thereof	TAIWAN
413	200610111278.1	Cob Type IC Package for Improving Bonding of Bumps Embedded in Substrate and Method for Fabricating the Same	CHINA
414	95129709	Cob Type IC Package for Improving Bonding of Bumps Embedded in Substrate and Method for Fabricating the Same	TAIWAN
415	200610111922.5	Multichip Stack Package	CHINA
416	95128828	Multichip Stack Package	TAIWAN
417	95133660	Stacked Chip Package Structure with Unbalanced Lead-frame	TAIWAN
418	95133670	Stacked Chip Package Structure with Lead-frame Having Bus Bar	TAIWAN
419	95133664	Stacked Chip Package Structure with Lead-frame Having Multi-Pieces of Bus Bar	TAIWAN
420	95139576	Package Structure with Lead-frame Having Inner Leads with Transfer Pad	TAIWAN
421	95133663	Stacked Chip Package Structure with Lead-frame Having Bus Bar with Transfer Pad	TAIWAN
422	200610111279.6	Integrated Circuit Package and Multi-Layer Leadframe Utilized	CHINA
423	95117275	Integrated Circuit Package and Multi-Layer Leadframe Utilized	TAIWAN
424	200610111275.8	Chip-on-Glass Package of Image Sensor	CHINA
425	95126121	Chip-on-Glass Package of Image Sensor	TAIWAN
426	95126002	Chip Structure	USA

427	200610099117.5	Chip Structure	CHINA
428	95126002	Chip Structure	TAIWAN
429	200610111541.7	Multi-Chip Stack Package Having Reduced Thickness	CHINA
430	95122172	Multi-Chip Stack Package Having Reduced Thickness	TAIWAN
431	200610109745.7	Semiconductor Packaging Tape	CHINA
432	95127400	Semiconductor Packaging Tape	TAIWAN
433	95139571	Stacked Chip Packaging with Heat Sink Struct	TAIWAN
434	95127401	High Frequency IC Package for Uniforming Bump-Bonding Height and Method for Fabricating the Same	TAIWAN
435	95127402	Pluggable Tape Type IC Package	TAIWAN
436	95137189	FILM TYPE PACKAGE FOR FINGERPRINT SENSOR	TAIWAN
437	95134884	SEMICONDUCTOR PACKAGE TAPE WITH SCRAPE RESISTANCE AT SPROCKET HOLE SIDES	TAIWAN
438	95134882	WIRING TAPE FOR CHIP-ON-FILM PACKAGES	TAIWAN