Semiconductor Manufacturing International 20-F 2013 FY Annual report (foreign)

Exhibit 4.10

Summary of Syndicate Loan Agreement dated August 7, 2013, between Semiconductor Manufacturing International (Shanghai) Corporation, Semiconductor Manufacturing International Corporation, as guarantor, and Bank of China, The Export-Import Bank ofChina, China Development Bank, China Construction Bank and Bank of Shanghai.

On August 7, 2013, Semiconductor Manufacturing International (Shanghai) Corporation (“SMIC Shanghai”) entered into a seven-year loan agreement with an aggregate principal amount of US$470 million with a syndicate financial institutions based in the PRC including Bank of China, The Export-Import Bank of China, China Development Bank, China Construction Bank and Bank of Shanghai.

The draw-down period under the loan is one year. The loan is repayable in eleven semi-annual installments beginning in August 2015. The Registrant has guaranteed SMIC Shanghai’s obligations under the loan, which is also secured by the manufacturing equipment located in the SMIC Shanghai 12-inch fabs and buildings of SMIC Shanghai.

Any of the following in respect of SMIC Shanghai would constitute an event of default during the term of the loan agreement:

1.(Short-term Loans + Long-term Debt Current Portion + Long-term Bank Loans)/Total Equity is more than 70%; or

2.(Net profit + Depreciation + Amortization + Income Tax Provision + Financial Expenses)/Financial Expenses is less than 550% in 2013, and less than 1000% after 2013; or

3.(Total Equity - Acquired Intangible Assets Net) is less than US$800 million in 2013, and less than US$1,000 million after 2013.