4. How is the R&D focus distributed among the Company’s R&D team of over 700 members? A: In general, a majority of our R&D team is dedicated to the development of cleaning equipment, which is a diverse and significant segment for us, including high temperature sulfuric acid and CO2 technologies that involve a large portion of our R&D personnel. Additionally, copper plating, PECVD, furnace tube, and Track equipment each receive considerable attention from our R&D team, with a relatively balanced distribution across these four segments. We are firmly committed to developing differentiated technologies in our R&D efforts, positioning ourselves to actively engage in the global market competition in the future. 5. What is the Company’s market share in China’s electroplating equipment market? How about the overseas market expansion on electroplating equipment next year? A: We estimate our Company holds approximately 30% of the market share in China’s electroplating market. Looking at the global market, we believe the electroplating industry is sizable and experiencing rapid growth. We have now secured overseas demo orders for our front-end copper plating equipment. Moving forward, we plan to expand our market outreach for copper plating equipment into other regions including Europe, the United States, and Singapore. 6. In light of new competitors entering the domestic electroplating market, how do you perceive the competition in this segment? A: The technology for copper plating equipment is primarily dominated by a few industry leaders, including the Company, which we believe has built strong technical patent barriers. Given these patent restrictions, we believe it is challenging for new competitors to quickly circumvent them, making it difficult for them to pose a competitive threat to the established market. |