Diodes (DIOD) 8-K Submission of Matters to a Vote of Security Holders

Investor Relations Presentation

May, 2013

Exhibit 99.1

Safe Harbor Statement

Page 2

Any

statements

set

forth

herein

that

are

not

historical

facts

are

forward-looking

statements

that

involve

risks

and

uncertainties

that

could

cause

actual

results

to

differ

materially

from

those

in

the

forward-looking

statements.

Such

forward-looking

statements

include,

but

are

not

limited

to,

statements

regarding

Diodes

Incorporated’s

2Q

2013

business

outlook

update,

which

includes

the

following:

a

summary

of

the

guidance

for

GAAP

and

non-GAAP

financial

measures

as

follows

on

revenue

of

$206

million

to

$218

million

for

both

GAAP

and

non-GAAP;

sequential

growth

of

16%

to

23%

for

both

GAAP

and

non-

GAAP;

gross

margin

(%

of

revenue)

of

25.0%

to

29.0%

for

GAAP

and

27.0%

to

31.0%

for

non-GAAP;

operating

expense

(%

of

revenue)

of

22.6%

to

24.6%

for

GAAP

and

20.3%

to

22.3%

for

non-GAAP;

tax

rate

of

14%

to

20%

for

both

GAAP

and

non-GAAP;

and

shares

used

to

calculate

GAAP

and

non-GAAP

are

anticipated

to

be

approximately

47.4

million;

and

other

statements

identified

by

words

such

as

“estimates,”

“expects,”

“projects,”

“plans,”

“will”

and

similar

expressions.

Potential

risks

and

uncertainties

include,

but

are

not

limited

to,

such

factors

as:

the

possibility

that

the

transaction

may

not

be

consummated,

including

as

a

result

of

any

of

the

conditions

precedent;

the

risk

that

BCD’s

business

will

not

be

integrated

successfully

into

the

Company’s;

the

risk

that

the

expected

benefits

of

the

acquisition

may

not

be

realized,

including

the

realization

of

the

accretive

effect

of

the

acquisition;

the

risk

that

BCD’s

standards,

procedures

and

controls

will

not

be

brought

into

conformance

within

the

Company’s

operation;

difficulties

coordinating

the

Company’s

and

BCD’s

new

product

and

process

development,

hiring

additional

management

and

other

critical

personnel,

and

increasing

the

scope,

geographic

diversity

and

complexity

of

the

Company’s

operations;

difficulties

in

consolidating

facilities

and

transferring

processes

and

know-how;

difficulties

in

reducing

the

costs

of

BCD’s

business;

the

diversion

of

our

management’s

attention

from

the

management

of

our

business;

Diodes’

business

and

growth

strategy;

the

introduction

and

market

reception

to

new

product

announcements;

fluctuations

in

product

demand

and

supply;

prospects

for

the

global

economy;

continued

introduction

of

new

products;

Diodes’

ability

to

maintain

customer

and

vendor

relationships;

technological

advancements;

impact

of

competitive

products

and

pricing;

growth

in

targeted

markets;

successful

integration

of

acquired

companies

and/or

assets;

Diodes’

ability

to

successfully

make

additional

acquisitions;

risks

of

domestic

and

foreign

operations,

including

excessive

operation

costs,

labor

shortages,

higher

tax

rates

and

joint

venture

prospects;

unfavorable

currency

exchange

rates;

availability

of

tax

credits;

Diodes’

ability

to

maintain

its

current

growth

strategy

or

continue

to

maintain

its

current

performance

and

loadings

in

manufacturing

facilities;

our

future

guidance

may

be

incorrect;

the

global

economic

weakness

may

be

more

severe

or

last

longer

than

Diodes

currently

anticipate;

and

other

information

detailed

from

time

to

time

in

filings

with

the

United

States

Securities

and

Exchange

Commission.

This

presentation

also

contains

non-GAAP

measures.

See

the

Company’s

press

releases

on

May

9,

2013

titled,

“Diodes

Incorporated

Reports

First

Quarter

2013

Financial

Results”

for

detailed

information

related

to

the

Company’s

non-GAAP

measures

and

a

reconciliation

of

GAAP

net

income

(loss)

to

non-GAAP

net

income

(loss).

Management Representative

Page 3

Rick White

CFO, Secretary, and Treasurer

CFO

Since 2009

SR VP, Finance

3 years

Texas Instruments        25 years

Experience:

Partner, Tatum Partners

CFO, Optisoft

Vice President, TI Worldwide, Memory

Education:

MBA, Finance, University of Michigan

Bachelor’s Degree, Electrical Engineering, Oklahoma State University

Company Representative

Page 4

Laura Mehrl

Director of Investor Relations

Since May 2010

Experience:

Director of Investor Relations, Diodes Incorporated, Plano, Texas

Senior Business Development Manager, STMicroelectronics, Carrollton, Texas

Sales Director for Analog Devices Inc., Shanghai, China

Product Marketing Manager at Texas Instruments (TI), Dallas, Texas

Senior Engineer at Lattice Semiconductor Inc., Hillsboro, Oregon 

Wafer fab design engineer and product engineer at TI, Lubbock, Texas

Education:

MBA with concentration in International Marketing, Texas Tech University

BS in Electrical and Computer Engineering, University of Iowa

Page 5

A leading global manufacturer and

supplier of high-quality application

specific,

standard

products

within

the broad discrete, logic and analog

markets, serving the computing,

consumer, industrial,

communications

and automotive

segments.

About Diodes Incorporated

Business Objective

To consistently achieve

above-market profitable growth, 

utilizing our innovative and

cost-effective packaging technology,

suited for high volume, high growth

markets by leveraging process expertise

and design excellence to deliver high

quality semiconductor products.

Page 6

2012 Total Semiconductor Market ($292 bn)

Significant Market Opportunity

Page 7

$133 bn

$26 bn

$57 bn

$39 bn

$18 bn

Diodes’

SAM:

$9 -

$11 bn

Diodes’

SAM:

$14 -

$16 bn

Opto

$19 bn

Std Logic

Analog

Discrete

Micro/Special

Memory

Diodes’

SAM:

$2 -

$4 bn

Diodes Growth Strategy

Page 8

Many Paths for Growth:

Product Portfolio

Product arena

Product line expansion

Performance enhancement

Application Space

Targeted end equipment

Broad customer base

Increased product coverage

Packaging Breadth

Broad packaging portfolio

Increased power density

Small form factor

2006

2010

Product Portfolio Progression

Page 9

Discrete

Diodes

MOSFETs

Rectifiers

Transistors

Protection Devices

Analog

Power Management

Power Switches

Standard Linear

Sensors

LED Drivers

Logic

Low Voltage CMOS

High Speed CMOS

Advanced Ultra-Low

Power CMOS

Performance Enhancement

Page 10

Diodes’

product upgrade has expanded our SAM.

SKY Rectifiers

MOSFETs

Bipolar LDO

DC-DC

(Asynchronous)

SBR®

(Super Barrier

Rectifiers) (Vb < 400v)

DIOFET

TM

(Low R

DS(on)

, Vb < 100V)

CMOS LDO

(Low power)

DC-DC

(Asynchronous, high current)

DIODESTAR

TM

Rectifiers

(Vb > 600v)

DIODESTAR

TM

MOSFETs

(Ultra low R

DS(on)

, Vb > 600V)

Low Noise LDO

DC-DC

(Synchronous, with

low & high current)

Efficiency, Functionality and Control for Smartphones

Page 11

LCD Backlighting

LED Drivers

Boost Converters

Schottky Diodes

LCD / OLED Display Bias

LCD Bias ICs

OLED Bias ICs

Schottky Diodes

LED Flash Module

Camera Flash Drivers

ZXMN series MOSFETs

Keypad Backlighting

LED Drivers

Boost Converters

Schottky Diodes

System Voltage Conversion

Low Dropout Regulators

DC-DC Converters

Schottky Diodes

Low-Saturation Bipolar Transistors

GPS Antenna Detection

Current Monitors

Flip / Slide / Holstor Detection

Hall Effect Sensors

Hall Effect Drivers

Battery Power Management

USB Power Switches

Current Monitors

Charger ICs

Low-Saturation Bipolar Transistors

ZXMP series MOSFETs

RF Power Amplifier

Low Dropout Regulators

Audio Amplifier

Class D Amplifier

Strong Relationships Drive LCD/LED TV Product Roadmaps

Page 12

LCD Display Buffer

40V High-gain BJT

System Power Conversion

Low Dropout Regulators

DC-DC Converters

Voltage References

Synchronous MOSFET Controllers

40V/100V SBR and Schottkys

Bridge Rectifier Diodes

LCD LED Backlighting

Current Monitors

400V High-gain NPN BJT

60V/100V High-gain NPN BJT

60V/100V N-channel MOSFETS

CCFL Backlighting

30V Low On-resistance MOSFETs

System Interface

USB Power Switches

Zener and TVS Arrays

System Power Management

Buck DC-DC Converters

Low Dropout Regulators

20V/30V/40V SBR®

and Schottkys

30V P-Channel MOSFETs

30V Low-saturation PNP BJT

Antenna Tuner

DC-DC Converters

40V Schottkys

Audio Amplifier

Buck DC-DC Converters

Schottky Diodes

SBR

Class D Amplifier

Product Breadth and Performance for Computing Platforms

Page 13

LCD / LED Backlighting

LED Drivers

Boost Converters

Schottky Diodes

Battery Power Management

Current Monitors

Load Switches

Low-Saturation BJT

ZXMP series MOSFETs

System Voltage Conversion

Low Dropout Regulators

DC-DC Converters

Schottky Diodes

Low-Saturation BJT

Open / Close Detection

Hall Effect Sensors

Hall Effect Drivers

System Power Management

Buck DC-DC Converters

Low Dropout Regulators

Super Barrier Rectifiers

Schottky Diodes

P-Channel MOSFETs

Low-Saturation BJT

System Interface

USB Power Switches

Zener and TVS Arrays

Audio Amplifier

Buck DC-DC Converters

Schottky Diodes

Super Barrier Rectifiers

Class D Amplifier

Wireless Connectivity

DC-DC Converters

Low Dropout Regulators

Page 14

Packaging Focus: Miniaturization and Power Efficiency

SOT143/SC82

SOT23F

SOT23/523

SC59

SOD-323F

SOD123/323

SOT666

SOT953/963

SOT26/363

SOT25/353

TSOT23-3/5/6

TO252

TO220/263/

ITO220S

SOT223

SIP-3/4

PM-III

QSOP16/20L

MSOP8/10

SOIC-8/10

TSSOP8

TSSOP14/16

SOIC14/16

PD-5

PD-123/323

Power DI 5060

Power DI 3030

Non-expose Pad

Power DI 3333

QFN 3~16 pin

0.4mm DFN

DFN1006-2

DFN0603-2

DFN0806-3

WL-CSP

DFN1114-3

Pyramid Stack

DFN5060-4

Bridge

Power DI 4040

Copper + Clip

SOLAR

PowerDI-5SP

E-CSP

Flip chip/Wafer Mold

QFN 32 pin

DFN4030C-12

DFN0808-4

0.35mm Thickness

SLP3010N9

Page 15

Packaging Focus: Miniaturization and Power Efficiency

Power Efficiency

Miniaturization

DFN 0603-2 Possibly

the smallest Discrete

semiconductor package.

Compared to a TO252, the

PowerDI

®

5 package delivers

twice the power density from      

a 55% smaller footprint.

PowerDI

®

5

TO252

Efficient Manufacturing + Superior Processes

Page 16

•

Two discrete fabs, two analog fabs

in  Kansas City, Missouri (5”

and 6”),

Oldham,United Kingdom (6”),  and

Shanghai  (6”) respectively

•

Bipolar, BiCMOS, CMOS and BCD

process

•

Strong engineering capabilities

Packaging

Wafer Fabs

Economies of Scale: Production Units in Shanghai (bn)

CapEx Model = 5% -

9% of  2013 Revenue

•

Shanghai-based packaging with capacity

approximately 30 billion units

•

Flexible and optimized manufacturing

process = low packaging cost

•

Additional packaging facilities in Neuhaus,

Germany and joint  venture in Chengdu,

China

Collaborative Customer Relationships

Page 17

Quanta

Hon Hai

Annual Revenue Growth Rates

Outperforming the Industry

Page 18

2003 to 2012 Growth

Diodes Inc.:          19%

SAM Industry:      4.3%

Industry (Discrete + Analog +  Logic)

*Acquisition Years

Revenue Growth

Revenue Profile –

1Q2013

By Channel

By Region

By End Market

Page 20

11%

79%

10%

Asia Pacific

Europe

North America

59%

41%

Distribution

OEM / EMS

29%

19%

17%

31%

4%

Industrial

Consumer

Communications

Automotive

Computing

First Quarter 2013 Financial Performance

Page 21

In millions, except per share

1Q12

4Q12

1Q13

Q/Q

Y/Y

Revenue

$144.7

$163.3

$177.0

$13.7

$32.2

Revenue Growth

8.4%

22.3%

Gross Margin % (GAAP)

23.3%

26.5%

26.1%

-40bp

280bp

Gross Margin % (non-GAAP)

23.3%

26.5%

27.1%

60bp

380bp

Operating Profit (GAAP)

$33.7

$43.2

$46.2

$3.0

$12.5

Net Income (GAAP)

$4.9

$4.1

-$1.9

-$6.0

-$6.8

Net Income (non-GAAP)

$4.1

$6.2

$7.5

$1.3

$3.4

EPS (GAAP)

$0.10

$0.09

-$0.04

-$0.13

-$0.14

EPS (non-GAAP)

$0.09

$0.13

$0.16

$0.03

$0.07

Cash Flow from Operations

$13.4

$16.4

$31.3

$14.9

$17.9

EBITDA (non-GAAP)

$21.2

$24.1

$23.1

-$1.0

$1.9

Balance Sheet

Page 22

Dec 31, 2012

Cash

$130

$157

$200

Inventory

$140

$153

$182

Current Assets

$427

$491

$612

Total Assets

$793

$920

$1145

Other Long-term Debt

$  3

$ 44

$ 214

Total Liabilities

$144

$200

$432

Total Equity

$649

$720

$712

Mar 31, 2013

Dec 31, 2011

(adjusted)

In millions

2Q 2013 Business Outlook

Page 23

A summery of the guidance for GAAP and non-GAAP financial measures as follows:

GAAP

Non-GAAP

Revenue $(millions)

$206 to $218

$206 to $218

Sequential growth (%)

16% to 23%

16% to 23%

Gross Margin (% of Revenue)

25.0% to 29.0%

27.0% to 31.0%

Operating Expense (% of Revenue)

22.6% to 24.6%

20.3% to 22.3%

Tax Rate (%)

14% to 20%

14% to 20%

Shares (million)

47.4

47.4

Strategy: Profitable Growth

Page 24

25

A Strong Global Partnership

A Winning Combination

* 2012 Pro Forma Financials = 3Q 2012 YTD plus mid-point of 4Q 2012 guidance

2012 Revenue

$634m*

2012 Gross Margin

25.1%

High volume Discrete,

Analog and Logic products

Cost efficient packaging

capabilities

Strong global presence

Broad product and customer

base

Consumer, computing  and

industrial focus

Expanded  application

platform  and broader

Analog footprint

Manufacturing synergies

Operating synergies

End equipment

diversification

Expanded customer base

and distribution channels

Expanded Asian  position

SYNERGIES

+

=

2012 Revenue

$142m*

2012 Gross Margin

27.5%

Solid  Standard Linear and  

Power Management offering

Strong AC/DC Solutions for

Switch-Mode Power Supply

chargers and adaptors

Cost effective China wafer

fab capability and capacity

Extensive China-based

development team

Strong China-local market 

position.

26

BCD Fits Diodes’

M&A Strategy

MUST HAVE’s

Synergistic with Diodes’

packaging capabilities and capacity

PLUS FACTORS

Accretive in 1 year

Enter new product area

Increase existing product portfolio

Gain access to process and/or packaging technology

Strengthen regional sales potential

1

1

1

1

2

1

Degree of

FIT

1=Very synergistic, 2=Synergistic, 3=Fairly Synergistic

26

Diodes Strategy: Profitable Growth

Page 27

is another key milestone

Thank you

Company Contact:

Diodes Incorporated

Laura Mehrl

Director of Investor Relations

P: 972-987-3959

E: laura_mehrl@diodes.com

Investor Relations Contact:

Shelton Group

Leanne K. Sievers

EVP, Investor Relations

P: 949-224-3874

E: lsievers@diodes.com

www.diodes.com

Diodes was named one of

the 10 Best Stocks of the

Past 20 Years –

March 2012