CORPORATE OVERVIEW Version 2.4 Exhibit 99.4 |
Company Profile Public company (NASDAQ: DIOD, website: www.diodes.com) Founded in 1959 Headquarters in Plano, TX; 21 locations globally North American, Asian, and European Inventory Locations Manufacturing in U.S., UK, Germany, China and Taiwan ISO9001:2008 Certified / TS16949:2009 Certified ISO14001 Certified Acquired Anachip Corporation, Taiwan, 01/2006 Acquired Advanced Power Devices, 11/2006 Acquired Zetex, 06/2008 Acquired Power Analog Microelectronics (PAM), 10/2012 Acquired BCD Semiconductor, 03/2013 Over 5,500 employees worldwide |
About Diodes Incorporated To consistently achieve above-market growth, utilizing our innovative and cost-effective internal packaging technology, suited for high volume, high growth markets by leveraging process expertise and design excellence to deliver market-leading semiconductor products. A leading global manufacturer and supplier of high-quality application specific, standard products within the broad discrete, logic and analog markets, serving the computing, consumer, communications, industrial and automotive segments. Business Objective |
BCD Acquisition (March 2013) Immediate Benefit to Customers Expanded product offering to include rapidly growing AC/DC patent portfolio Extended distribution channels with buffer inventory to streamline delivery Increased manufacturing capacity Cost-effective: the addition of new low-cost wafer Fabs in close proximity to Diodes’ assembly and test sites increases operational efficiency Company Profile Founded: 2000 HQ: Shanghai, China Employees: 1,200+ Products: 300+ End Customers: 2,000+ Markets: Communications, Consumer and Computing IPO in January 2011, Nasdaq GM: BCDS Revenue 2012: $142.8M Product Portfolio AC-DC Converters/Controllers DC-DC Converters Standard and High-Performance Linear Hall Sensors Motor Drivers LED Drivers Touch Screen Controllers TVS Protection |
Global Reach |
Diodes Strategy Many Paths for Growth: Product portfolio Product arena Product line expansion Performance enhancement Application space Targeted end equipments Broad customer base Increased product coverage Packaging breadth Broad packaging portfolio Increased power density Small form factor |
Revenue Growth $0 $100 $200 $300 $500 $700 2004 2005 2006 2007 2008 2009 2003 $433 $401 $343 $215 $186 $137 2010 $434 $613 Revenue by Year ($M) $800 2011 $634 2013 $900 $635 2012 $826.8 +41% -0.2% +3.6% $400 $600 +30.5% |
Balance Sheet In millions Dec 31, 2012 Dec 31, 2013 Dec 31, 2011 Cash $130 $157 $197 Short-term Investments $23 Inventory $140 $153 $180 Current Assets $427 $491 $650 Total Assets $793 $920 $1162 Long-term Debt $ 3 $ 44 $183 Total Liabilities $144 $200 $419 Total Equity $649 $720 $744 |
Why Diodes Incorporated? Commitment Unparalleled commitment to total customer satisfaction. Flexibility Rapid, flexible support of configured products to address customer system requirements. Products Broad portfolio of high power efficiency, space-saving products. Investment Significant, ongoing investment in high-capacity, world-class manufacturing capability. |
Packaging Focus: Miniaturization and Power Efficiency DFN5060-4 Bridge DFN0806-3 SOIC-16 TSSOP14/16 TO252 TO220/263/ITO220S SOT223 SIP-3/4 SOT89 SOT23F SOT23/523/SC59 SOD-323F SOD123/323 QFN 3~16 pin 0.4mm DFN 0.3mm DFN DFN0603-2 DFN1006-2 SOT953/963 SOT26/363 SOT25/353 SOT143/SC82 SOT666 QSOP16/20L MSOP8/10 SOIC8 TSSOP8 TSOT23-5/6 PD-5 PM-III PD-323 PD-123 PowerDI-5060 TSOT23-3 SOLAR PowerDI-5SP SOIC14 WL-CSP DFN1114-3 Pyramid Stack |
Efficient Manufacturing + Superior Processes Shanghai-based packaging with capacity approximately 30 billion units Flexible and optimized manufacturing process = low packaging cost Additional packaging facilities in Neuhaus, Germany and JV in Chengdu, China Two discrete fabs, two analog fabs in Kansas City, Missouri (5” and 6”), Oldham, United Kingdom (6”), and Shanghai (6”) respectively Bipolar, BiCMOS, CMOS and BCD process Strong engineering capabilities 20 18 16 14 12 10 8 6 4 2 2.1bn 1.3bn 22 24 CapEx Model = 5% - 9% of 2013 Revenue Packaging Wafer Fabs 26 28 30 0 Economies of Scale: Production Units in Shanghai (bn) 2009 2005 2006 2007 2008 2004 2002 2003 2001 2010 2011 2013 8.2bn 11.8bn 15.4bn 16.7bn 5.4bn 3.4bn 16.0bn 20.3bn 23.2bn 25.3bn 27.8bn 24.2bn 30.0bn 2012 25.3bn 30.3bn |
Broad Product Offering Discrete Standard ICs ASSP Diodes Rectifiers Standard Linear ICs Power Management ICs Sensors Schottky Diodes Schottky Rectifiers Linear Voltage Regulators DC-DC Switching Regulators Unipolar Hall Switches Zener Diodes Super Barrier Rectifiers Standard Linear Regulators Buck Bipolar Hall Latches Switching Diodes Standard Rectifiers Quasi Low Dropout Regulators Boost Omnipolar Hall Switches SBR Diodes Fast Recovery Rectifiers Low Dropout Regulators Buck/Boost/Inverter Smart Fan Drivers Power Zener Diodes Bridge Rectifiers Temperature Sensors Power Rectifier Diodes Voltage References AC-DC Solutions Magnetic Sensors Shunt References Primary-Side Regulators Low Power Motor Control Micropower References PWM MOSFETs Protection Devices BJT Switches Small Signal MOSFETs Zener TVS Current Monitors Constant Current / Constant Voltage Power MOSFETs Thyristor Surge Protection Current Output Protected MOSFETs Data Line Protection Voltage Output Power Switches Digital Broadcast by Satellite High Voltage MOSFETS Load Switches Fixed Bias Generators Complementary Pairs Operational Amplifiers USB Switches Switched Bias Generators H-Bridges Multiplex Controllers IntelliFET Comparators LED Drivers Integrated Switch Matrix Charge Pump DBS Interface Bipolar Transistors Function Specific Arrays Special Functions Boost Small Signal BJT Relay Drivers Timer IC Buck Pre-biased BJT Discrete Load Switches Reset Generators Medium Power BJT Discrete Voltage Regulators Current Mirror Power Supply High Power BJT MOSFET Gate-Drivers MOSFET Controllers Darlington Transistors Logic ICs Active OR-ing Controllers Gate-Drivers Single Gate Chargers Low Saturation BJT AHC, AHCT, LVC, LVCE, AUP H-Bridges Dual Gate Class-D Audio Amplifiers LVC Standard Logic LVC, HC, HCT, AHC, AHCT |
Diodes Key Capabilities One of Diodes’ key capabilities is its ability to listen and respond rapidly to customer requests for existing die to be repackaged or reconfigured. |
CORPORATE OVERVIEW Version 2.4 |