Diodes (DIOD) 8-K Diodes Incorporated Reports Fourth Quarter and Fiscal 2013 Financial Results

CORPORATE

OVERVIEW

Version 2.4

Exhibit 99.4

Company Profile

Public company (NASDAQ: DIOD, website: www.diodes.com)

Founded in 1959

Headquarters in Plano, TX; 21 locations globally

North American, Asian, and European Inventory Locations

Manufacturing in U.S., UK, Germany, China and Taiwan

ISO9001:2008 Certified / TS16949:2009 Certified

ISO14001 Certified

Acquired Anachip Corporation, Taiwan, 01/2006

Acquired Advanced Power Devices, 11/2006

Acquired Zetex, 06/2008

Acquired Power Analog Microelectronics (PAM), 10/2012

Acquired BCD Semiconductor, 03/2013

Over 5,500 employees worldwide

About Diodes Incorporated

To

consistently

achieve

above-market

growth,

utilizing

our

innovative

and

cost-effective

internal

packaging

technology,

suited

for

high

volume,

high

growth

markets

by

leveraging

process

expertise

and design excellence to deliver market-leading

semiconductor products.

A leading global manufacturer and supplier of high-quality

application specific, standard products within the broad

discrete, logic and analog markets, serving the

computing, consumer, communications, industrial and

automotive segments.

Business Objective

BCD Acquisition (March 2013)

Immediate Benefit to Customers

Expanded product offering to include rapidly growing AC/DC patent portfolio

Extended distribution channels with buffer inventory to streamline delivery

Increased manufacturing capacity

Cost-effective: the addition of new low-cost wafer Fabs in close proximity to Diodes’

assembly

and test sites increases operational efficiency

Company Profile

Founded: 2000

HQ: Shanghai, China

Employees: 1,200+

Products: 300+

End Customers: 2,000+

Markets: Communications,

Consumer and Computing

IPO in January 2011, Nasdaq GM: BCDS

Revenue 2012: $142.8M

Product Portfolio

AC-DC Converters/Controllers

DC-DC Converters

Standard and High-Performance Linear

Hall Sensors

Motor Drivers

LED Drivers

Touch Screen Controllers

TVS Protection

Global Reach

Diodes Strategy

Many Paths for Growth:

Product portfolio

Product arena

Product line expansion

Performance enhancement

Application space

Targeted end equipments

Broad customer base

Increased product coverage

Packaging breadth

Broad packaging portfolio

Increased power density

Small form factor

Revenue Growth

$0

$100

$200

$300

$500

$700

2004

2005

2006

2007

2008

2009

2003

$433

$401

$343

$215

$186

$137

2010

$434

$613

Revenue by Year ($M)

$800

2011

$634

2013

$900

$635

2012

$826.8

+41%

-0.2%

+3.6%

$400

$600

+30.5%

Balance Sheet

In millions

Dec 31, 2012

Dec 31, 2013

Dec 31, 2011

Cash

$130

$157

$197

Short-term Investments

$23

Inventory

$140

$153

$180

Current Assets

$427

$491

$650

Total Assets

$793

$920

$1162

Long-term Debt

$    3

$  44

$183

Total Liabilities

$144

$200

$419

Total Equity

$649

$720

$744

Why Diodes Incorporated?

Commitment

Unparalleled

commitment to

total customer

satisfaction.

Flexibility

Rapid, flexible

support of configured

products to address

customer system

requirements.

Products

Broad portfolio

of high power

efficiency,

space-saving

products.

Investment

Significant,

ongoing investment

in high-capacity,

world-class

manufacturing capability.

Packaging Focus: Miniaturization and Power Efficiency

DFN5060-4

Bridge

DFN0806-3

SOIC-16

TSSOP14/16

TO252

TO220/263/ITO220S

SOT223

SIP-3/4

SOT89

SOT23F

SOT23/523/SC59

SOD-323F

SOD123/323

QFN 3~16 pin

0.4mm DFN

0.3mm DFN

DFN0603-2

DFN1006-2

SOT953/963

SOT26/363

SOT25/353

SOT143/SC82

SOT666

QSOP16/20L

MSOP8/10

SOIC8

TSSOP8

TSOT23-5/6

PD-5

PM-III

PD-323

PD-123

PowerDI-5060

TSOT23-3

SOLAR

PowerDI-5SP

SOIC14

WL-CSP

DFN1114-3

Pyramid Stack

Efficient Manufacturing + Superior Processes

Shanghai-based packaging with capacity

approximately 30 billion units

Flexible and optimized manufacturing

process = low packaging cost

Additional packaging facilities in Neuhaus,

Germany and JV in Chengdu, China

Two discrete fabs, two analog fabs in 

Kansas City, Missouri (5”

and 6”),

Oldham, United Kingdom (6”), 

and Shanghai  (6”) respectively

Bipolar, BiCMOS, CMOS and BCD process

Strong engineering capabilities

20

18

16

14

12

10

8

6

4

2

2.1bn

1.3bn

22

24

CapEx Model = 5% -

9% of 2013 Revenue

Packaging

Wafer Fabs

26

28

30

0

Economies of Scale: Production Units in Shanghai (bn)

2009

2005

2006

2007

2008

2004

2002

2003

2001

2010

2011

2013

8.2bn

11.8bn

15.4bn

16.7bn

5.4bn

3.4bn

16.0bn

20.3bn

23.2bn

25.3bn

27.8bn

24.2bn

30.0bn

2012

25.3bn

30.3bn

Broad Product Offering

Discrete

Standard ICs

ASSP

Diodes

Rectifiers

Standard Linear ICs

Power Management ICs

Sensors

Schottky Diodes

Schottky Rectifiers

Linear Voltage Regulators

DC-DC Switching Regulators

Unipolar Hall Switches

Zener Diodes

Super Barrier Rectifiers

Standard Linear Regulators

Buck

Bipolar Hall Latches

Switching Diodes

Standard Rectifiers

Quasi Low Dropout Regulators

Boost

Omnipolar Hall Switches

SBR

Diodes

Fast Recovery Rectifiers

Low Dropout Regulators

Buck/Boost/Inverter

Smart Fan Drivers

Power Zener Diodes

Bridge Rectifiers

Temperature Sensors

Power Rectifier Diodes

Voltage References

AC-DC Solutions

Magnetic Sensors

Shunt References

Primary-Side Regulators

Low Power Motor Control

Micropower References

PWM

MOSFETs

Protection Devices

BJT Switches

Small Signal MOSFETs

Zener TVS

Current Monitors

Constant Current / Constant

Voltage

Power MOSFETs

Thyristor Surge Protection

Current Output

Protected MOSFETs

Data Line Protection

Voltage Output

Power Switches

Digital Broadcast by Satellite

High Voltage MOSFETS

Load Switches

Fixed Bias Generators

Complementary Pairs

Operational Amplifiers

USB Switches

Switched Bias Generators

H-Bridges

Multiplex Controllers

IntelliFET

Comparators

LED Drivers

Integrated Switch Matrix

Charge Pump

DBS Interface

Bipolar Transistors

Function Specific Arrays

Special Functions

Boost

Small Signal BJT

Relay Drivers

Timer IC

Buck

Pre-biased BJT

Discrete Load Switches

Reset Generators

Medium Power BJT

Discrete Voltage Regulators

Current Mirror

Power Supply

High Power BJT

MOSFET Gate-Drivers

MOSFET Controllers

Darlington Transistors

Logic ICs

Active OR-ing Controllers

Gate-Drivers

Single Gate

Chargers

Low Saturation BJT

AHC, AHCT, LVC, LVCE, AUP

H-Bridges

Dual Gate

Class-D Audio Amplifiers

LVC

Standard Logic

LVC, HC, HCT, AHC, AHCT

Diodes Key Capabilities

One of Diodes’

key capabilities is its ability to listen and respond rapidly

to customer requests for existing die to be repackaged or reconfigured.

CORPORATE

OVERVIEW

Version 2.4