Trikon (TRKN) 8-K Other events

Exhibit 99.2

Safe Harbor Statement

To the extent that this presentation discusses expectations about market conditions or about market acceptance and future sales of the Company’s products and our bank lines of credit or otherwise makes statements about the future, such statements are forward-looking and are subject to a number of risks and uncertainties that could cause actual results to differ materially from the statements made. Such forward looking statements or comments include or relate to, but are not limited to; Trikon’s ability to respond to economic, commercial and technical trends such as the market acceptance of Trikon’s products, ability to expand its sales and marketing efforts, management of its cost structure, our ability to return to profitability, the resolution of copper/low k integration and devise shrink development efforts at device companies, development efforts in the field of low k dielectrics, long implementation periods in the semiconductor industry, acceptance of new products by individual customers and by the marketplace, the availability of credit under its facility and other factors discussed in the Business Description and Management’s Discussion and Analysis sections of the Private placement memorandum, Company’s Report on Form 10-Q for the six months ended June 30 and Annual Report to Shareholders.

Introduction

PIPE Offering

	Offering size: 500,000 Units
		4 Common shares and 1 Warrant per Unit
		125,000 Unit over-allotment option
	Common shares post-Offering: 16.1 million
	Pricing: Mid-October
	Use of proceeds: Primarily working capital
	Registration rights
		Filing in 30 days
		Effectiveness in 90 days
	NasdaqNM: TRKN
	Agent: Oppenheimer & Co.

Participants

Jihad Kiwan, President & Chief Executive Officer
		22 years in the semiconductor industry
		President and CEO since March 30, 2003
		Prior to Trikon, Senior Vice President and General Manager of Amkor Technology, Inc., Wafer Fabrication Services and previously, Hewlett Packard

   Bill Chappell, Chief Financial Officer

	CFO since 2001
	20 years of collective CFO and chartered accountant
	experience including PricewaterhouseCoopers

Investment Highlights

Mission

To continuously improve our customers’
competitiveness by providing them with advanced
technology etching and deposition solutions.

Growth Strategy

	Deliver niche applications to major customers
	Expand sales and marketing effort
		Asia
		“Top-20” semi companies
	Focus on R&D to remain technology leader

Semiconductor Equipment Market

Semiconductor Industry

Products

Revenue Mix by Product

Planar 300^TM - dielectric CVD

	100mm- 300mm CVD tool
		In volume production since 1995 at LSI Logic
	Flowfill® process
		@ 90nm in pilot production
		@ <100nm Potential STI gap-fill solution
		Qualified for Inter-Metal and Pre-Metal Dielectric applications
		Offers superior gap-fill and lower cost to Spin-on and HDP
		Can reduce/eliminate CMP budget
	Orion® process
		@ 65nm in on-site qualification at 2 top-ten semi companies
		Only CVD solution with achievable k values of <2.2
		Integrated into 9LM and packaged at k = 2.5 and 2.2
	ASP of $3.0-5.0 million

Sigma 300^TM and fxP - Metalization tool

	300mm and £200mm metalization tools in volume production since 1993 at Infineon
		30 tools at Infineon in production
		@ 110nm in production with ionized liners
		Long throw and ionized liners, barriers and seed layers
		MOCVD of TiN and Ti(Si)N  capability  demonstrated
		Ti and Co silicides
		Aluminum slab
		In place/on-their-way for FBAR development at Sony, Epcos and Infineon
	ASP of $2.5-4.0 million

Omega fxP- high aspect ratio etcher

	Newly launched £200mm etch tool entering volume production at Philips
		116 previous generation tools installed, 28 at Philips
		Current generation entering volume production at Philips and in evaluation at IR for power trench etching
		International SEMATECH set record high aspect ratio contact etch in 1999 at 30:1 aspect ratio, 25nm
		Infineon R&D have etched 27nm polysilicon gates with Omega
		Deep Silicon Etching in evaluation at Robert Bosch
	ASP $2.0-3.5 million

Blue Chip Customer Base

Strong IP portfolio

	31 US and 56 foreign patents
	32 US and169 foreign patent applications
	Covering equipment and processes
		Barriers
		Low-k dielectrics
		STI
		Damascene processing
		FBAR
		Electrostatic chucks
		Plasma sources (M0RI)
		Showerheads
		Precursor delivery systems

Management and Resources

Management and Employees

	Strong sales and marketing focus from new CEO, Dr. Jihad Kiwan
	Experienced operational management led by new COO Richard Deep
	Best practices with advanced management tools
	Employees

Sales & Marketing	24
Customer support	77
			One-Third are Degree Qualified
Research & Development	62
Manufacturing	62		28 are PhDs
Administration	35
Total	260

Manufacturing Resources

	First class 110,000 sq ft. facility within 2 hours of London/Heathrow
	Class 1000 Manufacturing area
	Class 100 Engineering clean room
	Class 10 Demonstration clean room
	Purpose-built training suite with complete machines and computer-based training systems
	ISO 9001:2000 (quality) and 14001 (Environmental) registered

Local Customer Support

Regional Centres				Local Offices
	USA			Dallas, TX
	Korea			Portland, OR
	UK			New Haven, CT
	Germany			Manchester
	France			Nijmegen
	Taiwan			Migdael Haemek
				Regensburg
				Dresden
				Toulouse

Distributors

	Fastgate – Japan
	Hermes Epitek – Taiwan, China and Singapore

Financials

Financial Performance

($’Millions)

	Heavy exposure to telecoms
	Under exposure to Asia

2003 Performance to Date

($’Millions except per-share)

	Q1 2003		Q2
2003
Sales		5.1		6.0
Gross Margin		0.8		1.2
Operating Expenses		7.1		7.0
Operating loss		6.3		5.3
Loss per Share	(	0.50)	(	0.35)
Pension	(	0.06)	(	0.15)
One-off corp. costs			(	0.06)
RIFF			(	0.04)
Loss per Share (GAAP)	(	0.56)	(	0.60)

Operating Model

	Peak		Trough		Go-
	2000		2002		Forward
Revenue	100	%	100	%	100	%
Gross Margin	48	%	25	%	50	%
SG&A	21	%	40	%	18	%
R&D	8	%	33	%	12	%
EBITDA	23	%	(46	%)	24	%
Operating Income	19	%	(66	%)	20	%

New Credit Facility

	£5 million ($8 million) revolver agreed July 2003
	2 year facility to June 2005
	Interest rate is 1.75% over LIBOR
	Limited financial covenants

Balance Sheet @ June 30, 2003

	($’millions)
Cash	30.3
Working Capital	34.9
Fixed Assets	18.0
Long Term Debt	0.4
Shareholders’ Equity	52.6