3 patents
Reissue
Semiconductor device and method of forming PIP with inner known good die interconnected with conductive bumps
30 Mar 20
A PiP semiconductor device has an inner known good semiconductor package.
Zigmund R. Camacho, Frederick R. Dahilig, Lionel Chien Hui Tay, Arnel Senosa Trasporto, Henry Descalzo Bathan
Filed: 29 Feb 16
Utility
Semiconductor device and method of forming high routing density interconnect sites on substrate
2 Mar 20
A semiconductor device has a semiconductor die with a plurality of bumps formed over contact pads on a surface of the semiconductor die.
Rajendra D. Pendse
Filed: 10 Jul 14
Utility
Semiconductor device and method of forming double-sided fan-out wafer level package
21 Oct 19
A semiconductor device comprises a first semiconductor package including a conductive layer.
Il Kwon Shim, Pandi C. Marimuthu, Won Kyoung Choi, Sze Ping Goh, Jose A. Caparas
Filed: 30 Jul 15
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