292 patents
Page 3 of 15
Utility
Vertical Transfer Structures
6 Jul 23
Pixels, such as for image sensors and electronic devices, include a photodiode formed in a semiconductor substrate, a floating diffusion, and a transfer structure selectively coupling the photodiode to the floating diffusion.
Qin Wang, Hui Zang
Filed: 5 Jan 22
Utility
CMOS Image Sensor Pixel for High Dynamic Range Capturing
29 Jun 23
An image sensor element includes a transfer transistor TX, a LOFIC select transistor LF, a photodiode PD, and a first overflow path OFP.
Yoshiharu Kudo
Filed: 27 Dec 21
Utility
Transistors Having Increased Effective Channel Width
29 Jun 23
An image sensor includes a photodiode disposed in a semiconductor substrate having a first surface and a second surface opposite to the first surface.
Chiao-Ti Huang, Sing-Chung Hu, Yuanwei Zheng, Bill Phan
Filed: 2 Mar 23
Utility
Passivation-enhanced Image Sensor and Surface-passivation Method
29 Jun 23
An image sensor includes a semiconductor substrate and a multilayer film.
Shiyu SUN, Yuanwei ZHENG
Filed: 27 Dec 21
Utility
Multi-layer Metal Stack for Active Pixel Region and Black Pixel Region of Image Sensor and Methods Thereof
29 Jun 23
An image sensor includes an active pixel photodiode, a black pixel photodiode, a metal grid structure, and a light shield.
Kazufumi Watanabe, Chih-Wei Hsiung, Chao Niu
Filed: 23 Dec 21
Utility
Image Sensor with In-pixel Background Subtraction and Motion Detection
29 Jun 23
An imaging system includes a pixel array configured to generate image charge voltage signals in response to incident light received from an external scene.
Zhiyong Zhan, Tongtong Yu, Zheng Yang, Wei Deng
Filed: 2 Mar 23
Utility
Dark-current Inhibiting Image Sensor and Method
18 May 23
A dark-current-inhibiting image sensor includes a semiconductor substrate, a thin and a thin junction.
Yifei DU, Zhiqiang LIN, Hui ZANG, Seong Yeol MUN
Filed: 18 Nov 21
Utility
Stacked Image Sensor
11 May 23
A stacked image sensor includes a signal-processing circuitry layer, a pixel-array substrate, a heat-transport layer, and a thermal via.
Zhiyong ZHAN, Yin QIAN
Filed: 5 Nov 21
Utility
Voltage Regulation for Increased Robustness In Indirect Time-of-flight Sensors
11 May 23
A time-of-flight sensor includes an integrated circuit chip in which a voltage regulator and a load are disposed.
Zheng Yang, Qi Niu, Andreas Suess
Filed: 28 Oct 21
Utility
Readout Architectures for Binned Indirect Time-of-flight Sensors
4 May 23
A time-of-flight pixel array includes photodiodes that generate charge in response to incident reflected modulated light.
Andreas Suess, Zheng Yang
Filed: 3 Nov 21
Utility
Readout Architectures for Motion Blur Reduction In Indirect Time-of-flight Sensors
4 May 23
A time-of-flight pixel circuit includes a photodiode configured to generate charge in response to modulated light reflected from an object.
Andreas Suess, Zheng Yang
Filed: 28 Oct 21
Utility
Apparatus and Method for Curved-surface Image Sensor
4 May 23
A curved-surface image-sensor assembly has a porous carrier having a concave surface with a thinned image sensor bonded by an adhesive to its concave surface of the porous carrier; the porous carrier is mounted into a water-resistant package.
Chun-Sheng FAN, Wei-Feng LIN
Filed: 2 Nov 21
Utility
Readout Architecture for Indirect Time-of-flight Sensing
4 May 23
A time-of-flight sensor includes a pixel array of pixel circuits.
Andreas Suess, Zheng Yang
Filed: 28 Oct 21
Utility
Thin, Multi-lens, Optical Fingerprint Sensor Adapted to Image Through Cell Phone Displays
27 Apr 23
A multiple-lens optical fingerprint reader for reading fingerprints through a display has a spacer; and multiple microlenses with concave and convex surfaces in a microlens array, each microlens of multiple lenses focuses light arriving at that microlens from a finger adjacent the display through the spacer forms an image on associated photosensors on a photosensor array of an image sensor integrated circuit.
Jau-Jan DENG, Kuang-Ju WANG, Chun-Jen WEI
Filed: 27 Oct 21
Utility
Defect Prevention Methods for Pixel-Array Substrates
20 Apr 23
A method for preventing defects in a thin film deposited on a semiconductor substrate includes forming a plurality of trenches on a periphery-region of the semiconductor substrate to yield a trenched surface.
Qin WANG, Gang CHEN
Filed: 20 Dec 22
Utility
Endoscope Tip Assembly Using Cavity Interposer To Allow Coplanar Camera And LEDs
20 Apr 23
A cavity interposer has a cavity, first bondpads adapted to couple to a chip-type camera cube disposed within a base of the cavity at a first level, the first bondpads coupled through feedthroughs to second bondpads at a base of the interposer at a second level; and third bondpads adapted to couple to a light-emitting diode (LED), the third bondpads at a third level.
Teng-Sheng CHEN, Wei-Ping CHEN, Jau-Jan DENG, Wei-Feng LIN, Chun-Sheng FAN
Filed: 18 Oct 21
Utility
Image Sensor with Sub-pixel Photodiode Array with Multiple Mini-wire Grid Polarizers for Polarization Imaging
20 Apr 23
An image sensor configured to resolve intensity and polarization has multiple pixels each having a single microlens adapted to focus light on a central photodiode surrounded by at least a first, a second, a third, and a fourth peripheral photodiodes, where a first polarizer at a first angle is disposed upon the first peripheral photodiode, a third polarizer at a third angle is disposed upon the third peripheral photodiode, a second polarizer at a second angle is disposed upon the second peripheral photodiode, and a fourth polarizer at a fourth angle is disposed upon the fourth peripheral photodiode, the first, second, third, and fourth angles being different.
Victor Lenchenkov
Filed: 14 Oct 21
Utility
Endoscope Tip Assembly Using Truncated Trapezoid Cavity Interposer To Allow Coplanar Camera And LEDs in Small-Diameter Endoscopes
20 Apr 23
A cavity interposer has a cavity, first bondpads adapted to couple to a chip-type camera cube disposed within a base of the cavity at a first level, the first bondpads coupled through feedthroughs to second bondpads at a base of the interposer at a second level; and third bondpads adapted to couple to a light-emitting diode (LED), the third bondpads at a third level.
Teng-Sheng CHEN, Wei-Ping CHEN, Wei-Feng LIN, Jau-Jan DENG
Filed: 18 May 22
Utility
Sensor Watermarking on Raw Images
23 Mar 23
A method and apparatus for embedding a digital watermark in image content that is not visible to the human eye is performed on single-sensor digital camera images (often called ‘raw’ images) from a pixel-array.
Wenshou Chen, Guansong Liu, Boyd Fowler, Ramakrishna Kakarala, Yiyi Ren
Filed: 17 Sep 21
Utility
Artifact-Reducing Pixel And Method
16 Mar 23
A pixel includes a semiconductor substrate that includes a floating diffusion region and a photodiode region.
Gang CHEN, Shiyu SUN, Yuanwei ZHENG, Armin YAZDANI
Filed: 15 Sep 21