OmniVision (OVTI) Inactive USPTO patentsUtility grant

A chip-scale packaging process for wafer-level camera manufacture includes aligning an optics component wafer with an interposer wafer having a photoresist pattern that forms a plurality of transparent regions, bonding the aligned optics component wafer to the interposer wafer, and dicing the bonded optics component wafer and interposer wafer such that each optics component with interposer has a transparent region.

A flexible printed circuit board (PCB) includes a flexible first layer proximate to a flexible second layer.

An image sensor including a photodiode, a first doped region, a second doped region, a first storage node, a second storage node, a first vertical transfer gate, and a second vertical transfer gate is presented.

A near-eye display device includes (a) a display unit for displaying a display image, (b) a viewing unit for presenting the display image to the eye and transmitting ambient light from an ambient scene toward the eye, and (c) an eye imaging unit including (i) an illumination module for generating at least three infrared light beams propagating along at least three different, non-coplanar directions, respectively, (ii) a first beamsplitter interface, disposed between the display unit and the viewing unit, for merging at least a portion of each of the infrared light beams with visible display light to direct each portion toward the eye via the viewing unit, and (iii) a camera for imaging, via the viewing unit and the first beamsplitter interface, pupil of the eye and reflections of the infrared light beams incident on the eye, to form one or more images indicative of gaze direction of the eye.

A pixel array for use in a high dynamic range image sensor includes a plurality of pixels arranged in a plurality of rows and columns in the pixel array.

A method for manufacturing a stepped spacer wafer for a wafer-level camera includes a step of measuring a plurality of focal lengths f1,2, . . . , N of a respective one of a plurality of lenses L1,2, . . . , N of a lens wafer.

A time of flight camera includes a light source, a first pixel, a time-to-digital converting, and a controller.

A bond-per-pixel-block image sensor has a pixel array including multiple pixel blocks with selection circuitry to couple signals to an ADC.

An image sensor comprises a first photodiode and a second photodiode having a smaller full-well capacitance than the first photodiode, wherein the second photodiode is adjacent to the first photodiode; a first micro-lens is disposed above the first photodiode and on an illuminated side of the image sensor; a second micro-lens is disposed above the second photodiode and on the illuminated side of the image sensor; and a coating layer disposed on both the first and second micro-lens, wherein the coating layer forms a flat top surface on the second micro-lens and a conformal coating layer on the first micro-lens.

An N bit counter includes a lower counter having a first output having M bits that operates a first counting frequency.

A counter distribution system includes an N bit counter to receive a first counting clock to generate a plurality of data bits including lower data bits on lower data bit lines and upper data bits on upper data bit lines.

An optical element comprising a transparent substrate and an anti-reflective coating, wherein the anti-reflective coating further comprises at least a transparent, high refractive index layer and a transparent, low refractive index layer, wherein the high refractive index layer is in contact with the low refractive index layer; and wherein the high refractive index layer is situated at an interface between the anti-reflective coating and air.

An image sensor includes a photodiode disposed in a first semiconductor material to absorb photons incident on the image sensor and generate image charge.

Systems and methods for buffer-aware transmission rate control for real-time video streaming are disclosed herein.

Counters with various widths for an image sensor.

A high dynamic range imaging sensor includes a pixel array of pixel cells, a readout circuitry, a function logic and a control circuitry.

A method of fanning an electrical connection in a liquid crystal on silicon (LCOS) device, comprising: providing a silicon substrate including a first surface and a second surface, wherein the silicon substrate includes an conductive pad at the first surface; providing a cover glass panel that includes a cover glass, a transparent electrode layer formed upon the cover glass, and a first sealing material layer formed upon the transparent electrode layer; forming a second sealing material layer upon the first surface of the silicon substrate, wherein the second sealing material layer covers the conductive pad; forming a display layer, comprising a liquid crystal portion, a first seal portion, and a second seal portion, upon the second sealing material layer; wherein the first seal portion and the second seal portion are situated to form a space between them; and wherein the space is situated on top of the conductive pad; placing the cover glass panel upon the display layer, wherein the first sealing material layer is placed directly in contact with the display layer; singulating the cover glass panel, the display layer, and the silicon substrate, through the space between the first seal portion and the second seal portion, wherein the first seal portion is separated from the second seal portion; subsequently dispensing a conductive adhesive to the cover glass panel and the silicon substrate, wherein the conductive adhesive forms an electrical connection between transparent electrode layer and the conductive pad.

A wafer-level method for manufacturing yardless lenses includes (a) depositing light-curable lens resin between a mold and a first side of a transparent substrate, wherein the first side of the transparent substrate has an opaque coating with a plurality of apertures respectively aligned with a plurality of lens-shaped recesses of the mold, and (b) exposing a second side of the transparent substrate, facing away from the first side, to light, thereby illuminating portions of the light-curable lens resin aligned with the plurality of apertures to form a respective plurality of yardless lenses.