38 patents
Utility
Rational decision-making tool for semiconductor processes
3 Oct 23
A robust predictive model.
Tomonori Honda, Lin Lee Cheong, Lakshmikar Kuravi, Bogdan Cirlig
Filed: 4 Jun 21
Utility
Wafer bin map based root cause analysis
19 Sep 23
A template for assigning the most probable root causes for wafer defects.
Tomonori Honda, Lin Lee Cheong, Richard Burch, Qing Zhu, Jeffrey Drue David, Michael Keleher
Filed: 30 Apr 21
Utility
Automatic window generation for process trace
27 Jun 23
Automatic definition of windows for trace analysis.
Richard Burch, Kazuki Kunitoshi, Michio Aruga, Nobichika Akiya
Filed: 22 Jul 21
Utility
Pattern-enhanced spatial correlation of test structures to die level responses
2 May 23
Enhancement of less dominant patterns for parametric wafer measurements.
Richard Burch, Qing Zhu
Filed: 6 Aug 21
Utility
Predicting equipment fail mode from process trace
2 May 23
A predictive model for equipment fail modes.
Richard Burch, Kazuki Kunitoshi
Filed: 22 Jul 21
Utility
Anomalous equipment trace detection and classification
21 Mar 23
Scheme for detection and classification of semiconductor equipment faults.
Richard Burch, Jeffrey D. David, Qing Zhu, Tomonori Honda, Lin Lee Cheong
Filed: 6 Oct 20
Utility
Systems, devices, and methods for aligning a particle beam and performing a non-contact electrical measurement on a cell and/or non-contact electrical measurement cell vehicle using a registration cell
14 Mar 23
Systems, devices, and methods for performing a non-contact electrical measurement (NCEM) on a NCEM-enabled cell included in a NCEM-enabled cell vehicle may be configured to perform NCEMs while the NCEM-enabled cell vehicle is moving.
Indranil De, Jeremy Cheng, Thomas Sokollik, Yoram Schwarz, Stephen Lam, Xumin Shen
Filed: 6 May 22
Utility
Methods for performing a non-contact electrical measurement on a cell, chip, wafer, die, or logic block
24 May 22
Systems, devices, and methods for performing a non-contact electrical measurement (NCEM) on a NCEM-enabled cell included in a NCEM-enabled cell vehicle may be configured to perform NCEMs while the NCEM-enabled cell vehicle is moving.
Indranil De, Marian Mankos, Dennis Ciplickas, Christopher Hess, Jeremy Cheng, Balasubramanian Murugan, Qi Hu
Filed: 1 Oct 20
Utility
Predicting die susceptible to early lifetime failure
10 May 22
Semiconductor yield is modeled at the die level to predict die that are susceptible to early lifetime failure (ELF).
Richard Burch, Qing Zhu, Keith Arnold
Filed: 2 Mar 21
Utility
Methods for aligning a particle beam and performing a non-contact electrical measurement on a cell using a registration cell
10 May 22
Systems, devices, and methods for performing a non-contact electrical measurement (NCEM) on a NCEM-enabled cell included in a NCEM-enabled cell vehicle may be configured to perform NCEMs while the NCEM-enabled cell vehicle is moving.
Indranil De, Jeremy Cheng, Thomas Sokollik, Yoram Schwarz, Stephen Lam, Xumin Shen
Filed: 1 Oct 20
Utility
Maintenance scheduling for semiconductor manufacturing equipment
5 Apr 22
A maintenance tool for semiconductor process equipment and components.
Tomonori Honda, Jeffrey Drue David, Lin Lee Cheong
Filed: 25 Aug 20
Utility
IC with test structures and e-beam pads embedded within a contiguous standard cell area
31 Aug 21
An IC that includes a contiguous standard cell area with a 4x3 e-beam pad that is compatible with advanced manufacturing processes and an associated e-beam testable structure.
Stephen Lam, Dennis Ciplickas, Tomasz Brozek, Jeremy Cheng, Simone Comensoli, Indranil De, Kelvin Doong, Hans Eisenmann, Timothy Fiscus, Jonathan Haigh, Christopher Hess, John Kibarian, Sherry Lee, Marci Liao, Sheng-Che Lin, Hideki Matsuhashi, Kimon Michaels, Conor O'Sullivan, Markus Rauscher, Vyacheslav Rovner, Andrzej Strojwas, Marcin Strojwas, Carl Taylor, Rakesh Vallishayee, Larg Weiland, Nobuharu Yokoyama, Matthew Moe
Filed: 30 Jun 19
Utility
IC with test structures and e-beam pads embedded within a contiguous standard cell area
3 Aug 21
An IC that includes a contiguous standard cell area with a 4×3 e-beam pad that is compatible with advanced manufacturing processes and an associated e-beam testable structure.
Stephen Lam, Dennis Ciplickas, Tomasz Brozek, Jeremy Cheng, Simone Comensoli, Indranil De, Kelvin Doong, Hans Eisenmann, Timothy Fiscus, Jonathan Haigh, Christopher Hess, John Kibarian, Sherry Lee, Marci Liao, Sheng-Che Lin, Hideki Matsuhashi, Kimon Michaels, Conor O'Sullivan, Markus Rauscher, Vyacheslav Rovner, Andrzej Strojwas, Marcin Strojwas, Carl Taylor, Rakesh Vallishayee, Larg Weiland, Nobuharu Yokoyama, Matthew Moe
Filed: 30 Jun 19
Utility
IC with test structures and e-beam pads embedded within a contiguous standard cell area
3 Aug 21
An IC that includes a contiguous standard cell area with a 4×3 e-beam pad that is compatible with advanced manufacturing processes and an associated e-beam testable structure.
Stephen Lam, Dennis Ciplickas, Tomasz Brozek, Jeremy Cheng, Simone Comensoli, Indranil De, Kelvin Doong, Hans Eisenmann, Timothy Fiscus, Jonathan Haigh, Christopher Hess, John Kibarian, Sherry Lee, Marci Liao, Sheng-Che Lin, Hideki Matsuhashi, Kimon Michaels, Conor O'Sullivan, Markus Rauscher, Vyacheslav Rovner, Andrzej Strojwas, Marcin Strojwas, Carl Taylor, Rakesh Vallishayee, Larg Weiland, Nobuharu Yokoyama, Matthew Moe
Filed: 30 Jun 19
Utility
IC with test structures and E-beam pads embedded within a contiguous standard cell area
27 Jul 21
An IC that includes a contiguous standard cell area with a 4×3 e-beam pad that is compatible with advanced manufacturing processes and an associated e-beam testable structure.
Stephen Lam, Dennis Ciplickas, Tomasz Brozek, Jeremy Cheng, Simone Comensoli, Indranil De, Kelvin Doong, Hans Eisenmann, Timothy Fiscus, Jonathan Haigh, Christopher Hess, John Kibarian, Sherry Lee, Marci Liao, Sheng-Che Lin, Hideki Matsuhashi, Kimon Michaels, Conor O'Sullivan, Markus Rauscher, Vyacheslav Rovner, Andrzej Strojwas, Marcin Strojwas, Carl Taylor, Rakesh Vallishayee, Larg Weiland, Nobuharu Yokoyama, Matthew Moe
Filed: 30 Jun 19
Utility
Failure detection and classsification using sensor data and/or measurement data
8 Jun 21
A model is generated for predicting failures at the wafer production level.
Tomonori Honda, Lin Lee Cheong, Lakshmikar Kuravi
Filed: 8 Mar 19
Utility
Generating robust machine learning predictions for semiconductor manufacturing processes
8 Jun 21
Robust machine learning predictions.
Tomonori Honda, Rohan D. Kekatpure, Jeffrey Drue David
Filed: 12 Jun 18
Utility
Semiconductor yield prediction
1 Jun 21
A method for predicting yield for a semiconductor process.
Jeffrey Drue David, Tomonori Honda, Lin Lee Cheong
Filed: 24 Aug 18
Utility
IC with test structures and e-beam pads embedded within a contiguous standard cell area
25 May 21
An IC that includes a contiguous standard cell area with a 4×3 e-beam pad that is compatible with advanced manufacturing processes and an associated e-beam testable structure.
Stephen Lam, Dennis Ciplickas, Tomasz Brozek, Jeremy Cheng, Simone Comensoli, Indranil De, Kelvin Doong, Hans Eisenmann, Timothy Fiscus, Jonathan Haigh, Christopher Hess, John Kibarian, Sherry Lee, Marci Liao, Sheng-Che Lin, Hideki Matsuhashi, Kimon Michaels, Conor O'Sullivan, Markus Rauscher, Vyacheslav Rovner, Andrzej Strojwas, Marcin Strojwas, Carl Taylor, Rakesh Vallishayee, Larg Weiland, Nobuharu Yokoyama, Matthew Moe
Filed: 30 Jun 19
Utility
IC with test structures and E-beam pads embedded within a contiguous standard cell area
13 Apr 21
An IC that includes a contiguous standard cell area with a 4×3 e-beam pad that is compatible with advanced manufacturing processes and an associated e-beam testable structure.
Stephen Lam, Dennis Ciplickas, Tomasz Brozek, Jeremy Cheng, Simone Comensoli, Indranil De, Kelvin Doong, Hans Eisenmann, Timothy Fiscus, Jonathan Haigh, Christopher Hess, John Kibarian, Sherry Lee, Marci Liao, Sheng-Che Lin, Hideki Matsuhashi, Kimon Michaels, Conor O'Sullivan, Markus Rauscher, Vyacheslav Rovner, Andrzej Strojwas, Marcin Strojwas, Carl Taylor, Rakesh Vallishayee, Larg Weiland, Nobuharu Yokoyama, Matthew Moe
Filed: 29 Jun 19