10 patents
Utility
Method for fabricating (LED) dice using semiconductor structures on a substrate and laser lift-off to a receiving plate
2 Jan 24
A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate.
Chen-Fu Chu, Shih-Kai Chan, Yi-Feng Shih, David Trung Doan, Trung Tri Doan, Yoshinori Ogawa, Kohei Otake, Kazunori Kondo, Keiji Ohori, Taichi Kitagawa, Nobuaki Matsumoto, Toshiyuki Ozai, Shuhei Ueda
Filed: 10 May 22
Utility
Method for fabricating (LED) dice using laser lift-off from a substrate to a receiving plate
2 Jan 24
A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate.
Chen-Fu Chu, Shih-Kai Chan, Yi-Feng Shih, David Trung Doan, Trung Tri Doan, Yoshinori Ogawa, Kohei Otake, Kazunori Kondo, Keiji Ohori, Taichi Kitagawa, Nobuaki Matsumoto, Toshiyuki Ozai, Shuhei Ueda
Filed: 20 Jul 22
Utility
Method for making electronic device arrays using a temporary substrate and a carrier substrate
14 Nov 23
A method for making light emitting device LED arrays includes the steps of providing a plurality of LEDs having a desired configuration (e.g., VLED, FCLED, PLED); attaching the LEDs to a carrier substrate and to a temporary substrate; forming one or more metal layers and one or more insulator layers configured to electrically connect the LEDs to form a desired circuitry; and separating the LEDs along with the layered metal layers and insulator layers that form the desired circuitry from the carrier substrate and the temporary substrate.
David Trung Doan, Trung Tri Doan
Filed: 21 Feb 22
Utility
Single light emitting diode (LED) structure having epitaxial structure separated into light emitting zones
15 Aug 23
A single light emitting diode (LED) structure includes an array of spaced discrete light emitting zones separated by isolation areas.
Trung Tri Doan, David Trung Doan
Filed: 7 Dec 20
Utility
Method and system for transferring alignment marks between substrate systems
3 Jan 23
David Trung Doan, Yoshinori Ogawa, Nobuaki Matsumoto
Filed: 27 Apr 21
Utility
Method for fabricating (LED) dice using laser lift-off from a substrate to a receiving plate
16 Aug 22
A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate.
Chen-Fu Chu, Shih-Kai Chan, Yi-Feng Shih, David Trung Doan, Trung Tri Doan, Yoshinori Ogawa, Kohei Otake, Kazunori Kondo, Keiji Ohori, Taichi Kitagawa, Nobuaki Matsumoto, Toshiyuki Ozai, Shuhei Ueda
Filed: 7 Aug 20
Utility
Method for making light emitting device (LED) arrays using a temporary substrate and a carrier substrate
12 Jul 22
A method for making light emitting device LED arrays includes the steps of providing a plurality of LEDs having a desired configuration (e.g., VLED, FCLED, PLED); attaching the LEDs to a carrier substrate and to a temporary substrate; forming one or more metal layers and one or more insulator layers configured to electrically connect the LEDs to form a desired circuitry; and separating the LEDs along with the layered metal layers and insulator layers that form the desired circuitry from the carrier substrate and the temporary substrate.
David Trung Doan, Trung Tri Doan
Filed: 23 Oct 20
Utility
Single light emitting diode (LED) structure
30 Mar 21
A single light emitting diode (LED) structure includes an array of spaced discrete light emitting zones separated by isolation areas.
Trung Tri Doan, David Trung Doan
Filed: 28 Aug 18
Utility
Method for making light emitting device LED arrays
2 Feb 21
A method for making light emitting device LED arrays includes the steps of providing a plurality of LEDs having a desired configuration (e.g., VLED, FCLED, PLED); attaching the LEDs to a carrier substrate and to a temporary substrate; forming one or more metal layers and one or more insulator layers configured to electrically connect the LEDs to form a desired circuitry; and separating the LEDs along with the layered metal layers and insulator layers that form the desired circuitry from the carrier substrate and the temporary substrate.
David Trung Doan, Trung Tri Doan
Filed: 24 Sep 18
Utility
Light emitting diode device having electrode with low illumination side and high illumination side
7 Dec 20
A high-brightness vertical light emitting diode (LED) device includes an outwardly located metal electrode having a low illumination side and a high illumination side.
Wen-Huang Liu, Li-Wei Shan, Chen-Fu Chu
Filed: 23 Apr 13
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