184 patents
Page 4 of 10
Utility
Signal transmission circuit for providing control information from secondary side to primary side of power converter, and control circuit for power converter
25 Oct 22
A signal transmission circuit is configured for transmitting control information from a secondary side of a power converter to a primary side of the power converter.
Hung-Ta Hsu, Hsiang-Chung Chang, Yueh-Ping Yu, Tien-Chi Lin
Filed: 30 Apr 20
Utility
Digitally programmable, fully differential error amplifier
25 Oct 22
An error amplifier circuit receives first and second input signals and provides an error amplifier output signal indicative of the difference between the first and second input signals.
Steven P. Laur, Rhys Philbrick, Nicholas Archibald
Filed: 24 Jul 21
Utility
Flyback converter for controlling on time variation
18 Oct 22
A flyback converter to control conduction time in AC/DC conversion technology.
Jung-Pei Cheng, Hung-Ta Hsu
Filed: 29 Sep 20
Utility
Low capacitance bidirectional transient voltage suppressor
4 Oct 22
A bidirectional transient voltage suppressor (TVS) circuit for data pins of electronic devices includes two sets of steering diodes and a diode triggered clamp device in some embodiment.
Shekar Mallikarjunaswamy, Ning Shi
Filed: 13 Jan 21
Utility
USB type-C load switch ESD protection
27 Sep 22
A MOSFET and an electrostatic discharge (ESD) protection device on a common chip includes a MOSFET with a source, a gate, and a drain, and an ESD protection device configured to implement a diode function that is biased to prevent current from flowing through the common chip from the source to the drain.
Shekar Mallikarjunaswamy
Filed: 18 Mar 21
Utility
Charger
13 Sep 22
A charger includes a thermal conductive plate for heat dissipation, and a transistor.
Yu-Ming Chen, Tien-Chi Lin, Guan-Yu Lin, Tin-Wei Chen
Filed: 14 Apr 18
Utility
Dmos Fet Chip Scale Package and Method of Making the Same
1 Sep 22
A method comprises the steps of providing a wafer; applying a redistribution layer, grinding a back side of the wafer; depositing a metal layer; and applying a singulation process.
Yan Xun Xue, Long-Ching Wang, Hongyong Xue, Madhur Bobde, Zhiqiang Niu, Jun Lu
Filed: 26 Feb 21
Utility
Wafer Level Chip Scale Semiconductor Package
1 Sep 22
A wafer level chip scale semiconductor package comprises a device semiconductor layer, a backside metallization layer, a film laminate layer, and a metal layer.
Yan Xun Xue, Madhur Bobde, Long-Ching Wang, Bo Chen
Filed: 20 May 22
Utility
Method for semi-wafer level packaging
30 Aug 22
A semi-wafer level packaging method comprises the steps of providing a wafer; grinding a back side of the wafer; forming a metallization layer; removing a peripheral ring; bonding a first tape; applying a dicing process; bonding a second tape; removing the first tape; bonding a supporting structure; bonding a third tape; removing the second tape; and applying a singulation process.
Yan Xun Xue, Madhur Bobde, Long-Ching Wang, Bo Chen
Filed: 30 Dec 20
Utility
Flyback converter and control method thereof
30 Aug 22
A flyback converter, including: a transformer, a first switch, a second switch, and a control circuit.
Guan-Yu Lin, Yu-Ming Chen, Jung-Pei Cheng, Tien-Chi Lin, Hsiang-Chung Chang, Yueh-Ping Yu
Filed: 22 May 20
Utility
Sic Mosfet with Reduced Channel Length and High VTH
18 Aug 22
A silicon carbide MOSFET device and method for making thereof are disclosed.
David Sheridan, Arash Salemi, Madhur Bobde
Filed: 16 Feb 21
Utility
Igbt Light Load Efficiency
18 Aug 22
An apparatus comprising an insulated gate bipolar transistor and a super junction metal-oxide semiconductor field effect transistor wherein the insulated gate bipolar transistor and the super-junction metal-oxide semiconductor field effect transistor are electrically and optionally structurally coupled.
Madhur Bobde, Lingpeng Guan, Karthik Padmanabhan, Bum-Seok Suh
Filed: 4 May 22
Utility
Phase Redundant Power Supply with Oring Fet Current Sensing
18 Aug 22
A power stage in a multi-phase switching power supply incorporates a current sense circuit coupled to the output voltage disconnect transistor to conduct a portion of an inductor current flowing in the output inductor of the power stage.
Prabal Upadhyaya
Filed: 2 May 22
Utility
Intelligent power module containing IGBT and super-junction MOSFET
16 Aug 22
An intelligent power module (IPM) comprises a first, second, third and fourth die supporting elements, a first group of insulated gate bipolar transistors (IGBTs), a second group of IGBTs, a first group of super-junction metal-oxide-semiconductor field-effect transistors (MOSFETs), a second group of super-junction MOSFETs, a fifth die supporting element, a low voltage IC, a high voltage IC, and a molding encapsulation.
Bum-Seok Suh, Madhur Bobde, Zhiqiang Niu, Junho Lee, Xiaojing Xu, Zhaorong Zhuang
Filed: 9 Nov 20
Utility
High Bandwidth Constant On-Time PWM Control
11 Aug 22
Apparatus and associated methods relate to dynamic bandwidth control of a variable frequency modulation circuit by selective contribution of a crossover frequency tuning engine (XFTE) in response to a transient in a switching frequency.
Chris M. Young
Filed: 9 Feb 21
Utility
Constant on-time flyback converter and control method thereof
12 Jul 22
When a constant on-time flyback converter is in the switch-on stage, the gate voltage of the switch and the input voltage of the flyback converter adopt the primary side of the transformer to control.
Jung-Pei Cheng, Hung-Ta Hsu, Hsiang-Chung Chang, Yueh-Ping Yu, Yu-Ming Chen
Filed: 9 Sep 20
Utility
Method for Semi-wafer Level Packaging
30 Jun 22
A semi-wafer level packaging method comprises the steps of providing a wafer; grinding a back side of the wafer; forming a metallization layer; removing a peripheral ring; bonding a first tape; applying a dicing process; bonding a second tape; removing the first tape; bonding a supporting structure; bonding a third tape; removing the second tape; and applying a singulation process.
Yan Xun Xue, Madhur Bobde, Long-Ching Wang, Bo Chen
Filed: 30 Dec 20
Utility
Semiconductor Package Having Smart Power Stage and E-fuse Solution
30 Jun 22
A semiconductor package comprises a lead frame, a low side metal-oxide-semiconductor field-effect transistor (MOSFET), an E-fuse MOSFET, a high side MOSFET, a metal connection, a gate driver, an E-fuse IC, and a molding encapsulation.
Prabal Upadhyaya
Filed: 28 Dec 20
Utility
Low Capacitance Transient Voltage Suppressor with High Holding Voltage
30 Jun 22
A transient voltage suppressor (TVS) device includes a silicon controlled rectifier (SCR) as the clamp device between a high-side steering diode and a low-side steering diode.
Shekar Mallikarjunaswamy
Filed: 29 Dec 20
Utility
Semiconductor Package Having Wettable Lead Flank and Method of Making the Same
23 Jun 22
A semiconductor package comprises a lead frame, a chip, and a molding encapsulation.
Yan Xun Xue, Long-Ching Wang, Lei Fukuda, Adrian Chee Heong Koh, Peter Wilson, Feng Ye
Filed: 21 Dec 20