3 patents
Utility
High Temperature Acid Etch for Silicon
16 Sep 21
A method includes etching silicon using a mixture of nitric acid and hydrofluoric acid in which less than 6 mols of hydrofluoric acid is used to etch one mol of silicon.
Ralf JONCZYK, Patrick MCMAHON
Filed: 15 Mar 21
Utility
Semi-conductor Wafers Longer Than Industry Standard Square
5 Aug 20
A semiconductor wafer is as wide as the industry standard width A (presently 156 mm+/−1 mm) and is longer than the industry standard A by at least 1 mm and as much as the standard equipment can reasonably accommodate, presently approximately 3-20 mm and potentially longer, thus, gaining significant additional surface area for sunlight absorption.
Robertus Antonius STEEMAN
Filed: 22 Oct 18
Utility
Methods for Creating a Semiconductor Wafer Having Profiled Doping and Wafers and Solar Cell Components Having a Profiled Field, Such As Drift and Back Surface
25 Dec 19
A semiconductor wafer forms on a mold containing a dopant.
RALF JONCZYK, BRIAN D. KERNAN, G.D. STEPHEN HUDELSON, ADAM M. LORENZ, EMANUEL M. SACHS
Filed: 3 Sep 19
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