36 patents
Utility
Wafer-level Optoelectronic Packaging
19 Jan 23
A wafer-level optoelectronic packaging method includes fabricating a pre-singulated wafer.
Yee Loy LAM
Filed: 19 Sep 22
Utility
Optical dielectric planar waveguide process
3 Jan 23
A method for depositing silicon oxynitride film structures is provided that is used to form planar waveguides.
William Ring, Miroslaw Florjanczyk, Suresh Venkatesan
Filed: 25 Oct 21
Utility
Optical dielectric waveguide structure
27 Dec 22
An optical subassembly includes a planar dielectric waveguide structure that is deposited at temperatures below 400 C.
William Ring, Miroslaw Florjanczyk
Filed: 19 Apr 21
Utility
Methods for optical dielectric waveguide structure
20 Dec 22
An optical subassembly includes a planar dielectric waveguide structure that is deposited at temperatures below 400 C.
Suresh Venkatesan, Yee Loy Lam
Filed: 28 Sep 20
Utility
Wafer-level optoelectronic packaging
20 Sep 22
A wafer-level optoelectronic packaging method includes fabricating a pre-singulated wafer.
Yee Loy Lam
Filed: 28 Apr 20
Utility
Optical dielectric waveguide subassembly structures
23 Aug 22
An optical subassembly includes a planar dielectric waveguide structure that is deposited at temperatures below 400 C.
Suresh Venkatesan, Yee Loy Lam
Filed: 17 May 20
Utility
Optical Dielectric Planar Waveguide Process
10 Feb 22
A method for depositing silicon oxynitride film structures is provided that is used to form planar waveguides.
William Ring, Miroslaw Florjanczyk, Suresh Venkatesan
Filed: 25 Oct 21
Utility
Method of Forming an Hermetic Seal on Electronic and Optoelectronic Packages
16 Dec 21
A method for forming hermetic seals between the cap and sub-mount for electronic and optoelectronic packages includes the formation of metal mounds on the sealing surfaces.
Yee Loy Lam, Suresh Venkatesan, Long Cheng Koh
Filed: 23 Aug 21
Utility
Loopback Waveguide
18 Nov 21
A structure for, and method of, forming a first optoelectronic circuitry that generates an optical signal, a second optoelectronic circuitry that receives an optical signal, and a loopback waveguide that connects the output from the first optoelectronic circuitry to the second optoelectronic circuitry on an interposer substrate are described.
Suresh Venkatesan, Yee Loy Lam
Filed: 28 Apr 21
Utility
Structure and Method for Testing of Pic with an Upturned Mirror
18 Nov 21
A structure and method for the wafer level testing of interposer-based photonic integrated circuits is described that includes the formation of an upturned mirror structure and the method of utilizing the interposer-based mirror structure for electrical and optical testing of optoelectrical circuits that include emitting components such as lasers, detecting components such as photodetectors, and both emitting and detecting components.
Lucas Soldano, Jing Yang, Yong Meng Lee, Suresh Venkatesan
Filed: 28 Apr 21
Utility
Structure and Method for Testing of Pic with an Upturned Mirror
18 Nov 21
A structure and method for the wafer level testing of interposer-based photonic integrated circuits is described that includes the formation of an upturned mirror structure and the method of utilizing the interposer-based mirror structure for electrical and optical testing of optoelectrical circuits that include emitting components such as lasers, detecting components such as photodetectors, and both emitting and detecting components.
Lucas Soldano, Jing Yang, Yong Meng Lee, Suresh Venkatesan
Filed: 28 Apr 21
Utility
Loopback Waveguide
28 Oct 21
A structure for, and method of, forming a first optoelectronic circuitry that generates an optical signal, a second optoelectronic circuitry that receives an optical signal, and a loopback waveguide that connects the output from the first optoelectronic circuitry to the second optoelectronic circuitry on an interposer substrate are described.
Suresh Venkatesan, Yee Loy Lam
Filed: 28 Apr 21
Utility
Optical dielectric planar waveguide process
26 Oct 21
A method for depositing silicon oxynitride film structures is provided that is used to form planar waveguides.
William Ring, Miroslaw Florjanczyk, Suresh Venkatesan
Filed: 20 Jul 20
Utility
Method of forming an hermetic seal on electronic and optoelectronic packages
24 Aug 21
A method for forming hermetic seals between the cap and sub-mount for electronic and optoelectronic packages includes the formation of metal mounds on the sealing surfaces.
Yee Loy Lam, Suresh Venkatesan, Long Cheng Koh
Filed: 25 Jan 19
Utility
Optical Dielectric Waveguide Structure
19 Aug 21
An optical subassembly includes a planar dielectric waveguide structure that is deposited at temperatures below 400 C.
William Ring, Miroslaw Florjanczyk
Filed: 19 Apr 21
Utility
Dual Core Waveguide
19 Aug 21
The invention described herein pertains to the structure and formation of dual core waveguide structures and to the formation of optical devices including spot size converters from these dual core waveguide structure for the receiving and routing of optical signals on substrates, interposers, and sub-mount assemblies.
Suresh Venkatesan, Miroslaw Florjanczyk, Trevor Hall, Peng Liu, Jing Yang
Filed: 12 Apr 21
Utility
Dual Core Waveguide
29 Jul 21
The invention described herein pertains to the structure and formation of dual core waveguide structures and to the formation of optical devices including spot size converters from these dual core waveguide structure for the receiving and routing of optical signals on substrates, interposers, and sub-mount assemblies.
Suresh Venkatesan, Miroslaw Florjanczyk, Trevor Hall, Peng Liu, Jing Yang
Filed: 12 Apr 21
Utility
Methods for Optical Dielectric Waveguide Structures
15 Jul 21
An optical subassembly includes a planar dielectric waveguide structure that is deposited at temperatures below 400 C.
William Ring, Suresh Venkatesan
Filed: 29 Mar 21
Utility
Planar Laser Structure with Vertical Signal Transition
29 Apr 21
The invention described herein pertains to the structure and formation of an optical device that includes a planar laser and a waveguide.
Suresh Venkatesan
Filed: 27 Oct 20
Utility
Dual core waveguide
13 Apr 21
The invention described herein pertains to the structure and formation of dual core waveguide structures and to the formation of optical devices including spot size converters from these dual core waveguide structure for the receiving and routing of optical signals on substrates, interposers, and sub-mount assemblies.
Suresh Venkatesan, Miroslaw Florjanczyk, Trevor Hall, Peng Liu, Jing Yang
Filed: 6 Aug 19