98 patents
Page 4 of 5
Utility
Multilayered ceramic capacitor structures for use at high power
16 Nov 20
An improved multilayered ceramic capacitor is provided wherein the capacitor has improved heat dissipation properties.
John Bultitude, Philip M. Lessner, Abhijit Gurav
Filed: 29 Oct 18
Utility
Conductive Polymer Dispersion for Improved Reliability
11 Nov 20
An improved capacitor is provided wherein the capacitor comprises a conductive polymer layer.
Ajaykumar Bunha, Antony P. Chacko, Yaru Shi, Qingping Chen, Philip M. Lessner
Filed: 27 Jul 20
Utility
Component Stability Structure
7 Oct 20
An electronic component assembly is described which comprises a stack of electronic components wherein each electronic component comprises a face and external terminations.
John E. McConnell, John Bultitude
Filed: 16 Jun 20
Utility
Method of forming a leadless stack comprising multiple components
28 Sep 20
A method of forming a leadless stack comprising multiple components is provided.
John E. McConnell, Garry L. Renner, John Bultitude, R. Allen Hill, Galen W. Miller
Filed: 27 Jun 19
Utility
Hybrid capacitor and method of manufacturing a capacitor
14 Sep 20
An improved capacitor is described herein.
Darius Toader, Victor Andoralov, Ralf Deisenhofer
Filed: 28 Feb 18
Utility
Method to reduce anode lead wire embrittlement in capacitors
14 Sep 20
An improved capacitor, and method of manufacturing the improved capacitor, is provided.
Steven C. Hussey, Yuri Freeman, Christian Guerrero, Chris Stolarski, Jeffrey N. Kelly, Philip M. Lessner, Siva Jyoth Lingala, Javaid Qazi
Filed: 14 Nov 19
Utility
Hybrid capacitor and method of manufacturing a capacitor
7 Sep 20
An improved capacitor is described wherein the capacitor comprises a working element.
Victor Andoralov, Débora Sá, Alexandre Guerreiro Fonseca, Antony P. Chacko, Yaru Shi, Philip M. Lessner
Filed: 17 Jul 18
Utility
Micropatterned Anode and Cathode Surface for Adhesion and Reliability
26 Aug 20
An improved capacitor is provided.
Antony P. Chacko, Christian L. Guerrero, John Joseph Ols
Filed: 6 Feb 20
Utility
Gate Drive Interposer with Integrated Passives for Wide Band Gap Semiconductor Devices
26 Aug 20
An improved electronic assembly is provided.
Allen Templeton, John Bultitude, Lonnie G. Jones, Philip M. Lessner
Filed: 27 Aug 19
Utility
Packages for Power Modules with Integrated Passives
26 Aug 20
Provided herein is a module for packaging semiconductors comprising: at least one PDC comprising parallel internal electrodes of alternating polarity with a paraelectric dielectric between adjacent internal electrodes wherein the paraelectric dielectric has a permittivity above 10 to no more than 300; and wherein the PDC forms a capacitor couple with at least one semiconductor.
John Bultitude, Lonnie G. Jones, Allen Templeton, Philip M. Lessner
Filed: 4 Aug 19
Utility
Cathode materials containing core shell nanoparticles
24 Aug 20
Provided herein is a capacitor, and method for forming a capacitor, comprising an anode, a dielectric over the anode; a cathode over the dielectric; and the cathode comprises core shell particles.
Antony P Chacko, John Joseph Ols
Filed: 30 Jun 19
Utility
High density multi-component packages
24 Aug 20
Provided is a high density multi-component package and a method of manufacturing a high density multi-component package.
John Bultitude, Galen Miller, John E. McConnell
Filed: 18 Nov 18
Utility
Higher density multi-component and serial packages
24 Aug 20
A high density multi-component package is provided.
James A. Burk, John Bultitude, Galen W. Miller
Filed: 5 Dec 18
Utility
Ceramic Overvoltage Protection Device Having Low Capacitance and Improved Durability
12 Aug 20
Provided is an improved overvoltage protection element.
Lonnie G. Jones, Iain D. Kinnon, John Bultitude, Nathan A. Reed, Jeffrey W. Bell, George Michael Theis
Filed: 26 Apr 20
Utility
Component stability structure
27 Jul 20
John E. McConnell, John Bultitude
Filed: 19 Jun 16
Utility
Method for making a multilayered ceramic capacitor
13 Jul 20
A method for forming an MLCC with an identification mark consisting of non-active internal electrodes which can be used to determine chip orientation for mounting or reeling.
Randal J. Vaughan, Gregory L. Crosby
Filed: 28 Nov 18
Utility
Ceramic Overvoltage Protection Device Having Low Capacitance and Improved Durability
8 Jul 20
Provided is an improved overvoltage protection element.
Iain D. Kinnon, John Bultitude, Lonnie G. Jones
Filed: 19 Mar 20
Utility
High density multi-component packages
6 Jul 20
Provided is a high density multi-component package and a method of manufacturing a high density multi-component package.
John Bultitude, Galen Miller, John E. McConnell
Filed: 5 Nov 17
Utility
High density multi-component packages
8 Jun 20
Provided is a high density multi-component package and a method of manufacturing a high density multi-component package.
John Bultitude, Galen W. Miller, John McConnell
Filed: 7 Sep 17
Utility
Ceramic Overvoltage Protection Device Having Low Capacitance and Improved Durability
20 May 20
Provided is an improved overvoltage protection element.
Iain D. Kinnon, John Bultitude, Lonnie G. Jones
Filed: 18 Nov 18