626 patents
Utility
DC-DC boost converter
16 Jan 24
The present disclosure discloses a direct current (DC)-DC boost converter, which includes a battery terminal providing a battery voltage, a charge pump coupled between the battery terminal and an interior node, and a power inductor coupled between the interior node and a power supply terminal that provides a power voltage to a radio frequency transceiver.
Nadim Khlat, Michael R. Kay, Jeffrey D. Potts, Michael J. Murphy
Filed: 16 Jun 22
Utility
Fluorinated polymers with low dielectric loss for environmental protection in semiconductor devices
16 Jan 24
Semiconductor devices, and more particularly arrangements of fluorinated polymers with low dielectric loss for environmental protection in semiconductor devices are disclosed.
Christo Bojkov, Michael Roberg, Matthew Essar, Walid Meliane, Terry Hon
Filed: 14 Oct 21
Utility
Sensor with droplet retaining structure
9 Jan 24
This disclosure describes methods and devices that assist in forming biosensors.
James Russell Webster
Filed: 20 Aug 21
Utility
RF devices with enhanced performance and methods of forming the same
9 Jan 24
The present disclosure relates to a radio frequency (RF) device that includes a mold device die and a multilayer redistribution structure underneath the mold device die.
Julio C. Costa, Michael Carroll, Philip W. Mason, Merrill Albert Hatcher, Jr.
Filed: 8 Nov 19
Utility
RF devices with enhanced performance and methods of forming the same
9 Jan 24
The present disclosure relates to a radio frequency device that includes a device region with a back-end-of-line (BEOL) portion and a front-end-of-line (FEOL) portion, first bump structures, a first mold compound, and a second mold compound.
Julio C. Costa, Michael Carroll
Filed: 20 Oct 22
Utility
Gallium-nitride-based module with enhanced electrical performance and process for making the same
9 Jan 24
The present disclosure relates to a Gallium-Nitride (GaN) based module, which includes a module substrate, a thinned switch die residing over the module substrate, a first mold compound, and a second mold compound.
Julio C. Costa, Michael Carroll
Filed: 3 May 21
Utility
Bulk acoustic wave resonator with increased dynamic range
2 Jan 24
Devices that include a low sensitivity bulk acoustic wave (BAW) resonator sensor including a surface to which a low recognition component is immobilized, the low recognition component being configured to selectively bind the analyte, an analyte molecule to which a tag is linked, or a tag, or any one of these molecules to which an amplification element-linked second recognition component is bound; a high sensitivity BAW resonator sensor including a surface to which a high recognition component is immobilized, the high recognition component being configured to selectively bind the analyte, an analyte molecule to which a tag is linked, or a tag, or any one of these molecules to which an amplification element-linked second recognition component is bound; one or more containers housing an amplification molecule, the amplification element-linked second recognition component, and optionally one or both of the tag and the analyte molecule.
James Russell Webster, Ian Robert Harmon
Filed: 6 Jul 22
Utility
RF devices with enhanced performance and methods of forming the same
2 Jan 24
The present disclosure relates to a radio frequency device that includes a device region with a back-end-of-line (BEOL) portion and a front-end-of-line (FEOL) portion, first bump structures, a first mold compound, and a second mold compound.
Julio C. Costa, Michael Carroll
Filed: 30 May 19
Utility
Thermally enhanced semiconductor package with at least one heat extractor and process for making the same
12 Dec 23
The present disclosure relates to a thermally enhanced package, which includes a carrier, a thinned die over the carrier, a mold compound, and a heat extractor.
Julio C. Costa, George Maxim
Filed: 26 May 21
Utility
Method for manufacturing piezoelectric bulk layers with tilted c-axis orientation
21 Nov 23
Methods for depositing bulk layer crystalline material having a predetermined c-axis tilt on a substrate include a first step of depositing a first portion of bulk layer material at a first incidence angle to achieve a predetermined c-axis tilt, and a second step of depositing a second portion of the bulk material layer onto the first portion at a second incidence angle that is smaller than the first incidence angle.
Derya Deniz, Robert Kraft, John Belsick
Filed: 20 Mar 19
Utility
Analyte depletion for sensor equilibration
14 Nov 23
Methods include treating a portion of a sample composition to be tested for presence of an analyte by depleting or blocking the target analyte.
Ian Harmon
Filed: 11 Apr 22
Utility
Integrated piezoresistive and piezoelectric fusion force sensor
7 Nov 23
Described herein is a ruggedized microelectromechanical (“MEMS”) force sensor including both piezoresistive and piezoelectric sensing elements and integrated with complementary metal-oxide-semiconductor (“CMOS”) circuitry on the same chip.
Julius Minglin Tsai, Ryan Diestelhorst, Dan Benjamin
Filed: 14 Dec 22
Utility
Mehtof of manufacturing temperature compensated surface acoustic wave device
31 Oct 23
Embodiments described herein may provide a surface acoustic wave (SAW) device, methods of fabricating the SAW device, and a system incorporating the SAW device.
Marc Solal
Filed: 29 Mar 19
Utility
High power laminate RF package
17 Oct 23
The present disclosure relates to a package capable of handling high radio frequency (RF) power, which includes a carrier, a ring structure attached to a top surface of the carrier, an RF die attached to the top surface of the carrier within an opening of the ring structure and electrically connected to the ring structure, a heat spreader attached to a top surface of the ring structure, and an output signal lead configured to send out RF output signals generated by the RF die.
Dylan Murdock
Filed: 29 Jul 21
Utility
MMICs with backside interconnects for fanout-style packaging
17 Oct 23
Monolithic microwave integrated circuits (MMICs) with backside interconnects for fanout-style packaging are disclosed.
Andrew Arthur Ketterson, Christo Pavel Bojkov
Filed: 3 Sep 19
Utility
Ladder-type surface acoustic wave device
17 Oct 23
The present disclosure relates to a ladder-type surface acoustic wave (SAW) device, which includes a piezoelectric layer, two reflective structures, at least one series interdigital transducer (IDT) coupled between a first signal point and a second signal point, and at least one shunt IDT.
Manjunath Swamy
Filed: 19 Jul 21
Utility
Process for making laminate substrate with sintered components
10 Oct 23
The present disclosure relates to a process to integrate sintered components in a laminate substrate.
Tarak A. Railkar, Deepukumar M. Nair, Jeffrey Dekosky
Filed: 16 Aug 19
Utility
Integrated module with electromagnetic shielding
10 Oct 23
The present disclosure relates to a shielded integrated module, which includes a module substrate with a number of perimeter bond pads, at least one electronic component attached to the module substrate and encapsulated by a mold compound, a number of perimeter vertical shield contacts, and a shielding structure.
Mohsen Haji-Rahim, Howard Joseph Holyoak
Filed: 7 Sep 21
Utility
Bi-polar border region in piezoelectric device
10 Oct 23
An acoustic device includes a foundation structure and a transducer provided over the foundation structure.
Jyothi Swaroop Sadhu, Ralph Rothemund, Alireza Tajic
Filed: 21 Sep 22
Utility
Ladder-type surface acoustic wave device
10 Oct 23
The present disclosure relates to a ladder-type surface acoustic wave (SAW) device, which includes a piezoelectric layer, two reflective structures, at least one series interdigital transducer (IDT) coupled between a first signal point and a second signal point, and at least one shunt IDT.
Manjunath Swamy
Filed: 19 Jul 21