25 patents
Page 2 of 2
Utility
Method and apparatus for uniformly metallization on substrate
2 Feb 21
The present invention relates to applying at least one ultra/mega sonic device and its reflection plate for forming standing wave in a metallization apparatus to achieve highly uniform metallic film deposition at a rate far greater than conventional film growth rate in electrolyte.
Hui Wang, Fuping Chen, Xi Wang
Filed: 26 Sep 18
Utility
Methods and system for cleaning semiconductor wafers
2 Feb 21
A method for cleaning semiconductor substrate without damaging patterned structure on the substrate using ultra/mega sonic device comprising applying liquid into a space between a substrate and an ultra/mega sonic device; setting an ultra/mega sonic power supply at frequency f1 and power P1 to drive said ultra/mega sonic device; before bubble cavitation in said liquid damaging patterned structure on the substrate, setting said ultra/mega sonic power supply at frequency f2 and power P2 to drive said ultra/mega sonic device; after temperature inside bubble cooling down to a set temperature, setting said ultra/mega sonic power supply at frequency f1 and power P1 again; repeating above steps till the substrate being cleaned.
Hui Wang, Fufa Chen, Fuping Chen, Jian Wang, Xi Wang, Xiaoyan Zhang, Yinuo Jin, Zhaowei Jia, Liangzhi Xie, Jun Wang, Xuejun Li
Filed: 20 May 15
Utility
Coater with automatic cleaning function and coater automatic cleaning method
26 Oct 20
A coater with automatic cleaning function and a coater automatic cleaning method.
Hui Wang, Fuping Chen, Wenjun Wang, Hongchao Yang, Voha Nuch, Fufa Chen, Jian Wang, Xiaoyan Zhang, Shu Yang
Filed: 15 Sep 14
Utility
Substrate supporting apparatus
7 Sep 20
A substrate supporting apparatus (300) for cleaning a back side of a substrate (107) is provided.
Fufa Chen, Zhiyou Fang, Jun Wu, Hui Wang, Fuping Chen, Wenjun Wang
Filed: 5 Jul 16
Utility
Fall-proof apparatus for cleaning semiconductor devices and a chamber with the apparatus
7 Sep 20
A fall-proof apparatus for cleaning semiconductor devices is provided.
Zhenming Chu, Xi Wang, Hui Wang, Shena Jia, Jun Wu, Fuping Chen, Xuejun Li
Filed: 7 Sep 15