5 patents
Utility
Three-dimensional Optoelectronic Device Package and Method for Manufacturing the Same
23 Mar 23
A three-dimensional optoelectronic device package is disclosed.
Po-Wei LEE
Filed: 24 Nov 22
Utility
Three-dimensional optoelectronic device package and method for manufacturing the same
3 Jan 23
A three-dimensional optoelectronic device package is disclosed.
Po-Wei Lee
Filed: 20 May 20
Utility
UV LED Package Having Encapsulating Extraction Layer
28 Apr 22
A UV LED package includes a substrate having a dam, a LED die on the substrate, a lens bonded to the substrate, an extraction layer covering a light emitting surface of the LED die, and a lens sealing layer between the lens and the dam.
TZU-YING LIN, PO-WEI LEE, SHENG-LUNG CHANG, TZU-HAN LIN
Filed: 16 Nov 21
Utility
Three-dimensional Optoelectronic Device Package and Method for Manufacturing the Same
25 Nov 21
A three-dimensional optoelectronic device package is disclosed.
Po-Wei LEE
Filed: 20 May 20
Utility
Semiconductor Components And Semiconductor Structures And Methods Of Fabrication
4 Mar 21
A semiconductor component for fabricating semiconductor structures includes a plate having an elastomeric polymer layer thereon and at least one semiconductor structure adhesively attached to the elastomeric polymer layer.
Trung Tri Doan, CHEN-FU CHU, SHIH-KAI CHAN, DAVID TRUNG DOAN, YI-FENG SHIH
Filed: 23 Jul 20
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