provide to transformation product updates. some joining call. Good you, give I’ll everyone for update and first afternoon highlight our then our results Anthony. of the finally market and you thank and QX Thank an
revenue EUV $XXX achieved was Semi Blanks our guidance. production system was shipments revenue second of of strong midpoint above Mask LSA revenue multiple systems. the our which with market Front-End and from We our million in QX
our guidance beam on and was of product improved which range data than mix products managed storage margin resulting gross higher to XX.X% remained expenses. was solid. sales Non-GAAP higher from the ion volume Additionally customers well
operating per $X non-GAAP report profitability. $X.XX to earnings income happy marking resulting in million of was We're a return to share
$XXX driven are both EUV bookings by Our strength data which storage markets. blank were in mask and million
provide will MOCVD in company's returning and on the by driving will be is company R&D I Phase our the lines shift led rationalizing expenditures. from an completed and emerging commodity to transformation product to the two Making company profitability The photonics markets underway and general transformation. re-prioritizing Now, infrastructure well growth. phases, the X applications. returning to and reductions includes update our profitability
alluded On earnings inventory. our we last call, to slow moving
We also provide reducing details Sam in mentioned will We areas. more profitability. expenses improve few minutes. both a progress in made to
is driving packaging Front-End our Phase data markets. growth advanced the to early storage X of Semi in our steps existing grow taking We're stages. transformation and
growing in complete real we a production addition applications in EUV to markets, semi we as transformation be In our When the current with focused mass growth. blank leaner path are and on MOCVD products. to investing our will company such and new we our applications compound
strong. remains market storage data The update. business a for now And
drive Our compete to ion per improve deposition, solid hard ion enable products aerial storage. with their diamond-like mechanical etch, state as cost bit pursue disk manufacturers beam beam lower they and carbon density to
the is to read improvements which MAMR, in also heads. The required expected steps produce of or coming assisted is next news revolution Veeco. good aerial known number recording, HAMR This density write is increase as energy magnetic manufacturing for from to
accelerated conducted where pace which relies density a total roadmap an will A decade. bit's. storing contributor. on aerial XX% an grow remain through they report data XXXX Hard greater hyperscale provided disk hard XX% at an center Seagate next of than increasing Mizuho market should forecasted technology based with that currently important recent recently disk to their as CAGR Day cloud drives Analyst over the drives XX%
increase increase heads we drive will per will average storage to heads remain flex. the is by Semiconductor forecasted XXXX. heads of and ion the storage The drive In Front-End strong EUV per number five by depositions through enabled evolution day that market create from beam market XXXX. to Consequently, data providing the to XX lithography mass
tool EUV EUV lithography for target adoption TSMC, availability layers. chip made for tools high volume goals designs maturity with proof production. sophisticated recently to allows to fewer more reached points According their The continue market be occur. production to EUV with reaching
they XX% EUV seven market This in plus nanometer XX% lithography to versus EUV. node, delivering products density recently improved their power fact, announced without higher the In consumption provides to enabled customer volume. same high EUV technology and is node
with for order EUV QX in shipped lithography blank XX announcing new third we quarter. recently production is an system. EUV ASML second the for strong systems mask in our and a for systems orders Demand received additional system Accordingly,
Industry lines. driving and to as nodes shrink improvements over ready production Front-End contributor Samsung five performance results and Another are our notes. significant they announced device leaders laser at nanometers. is Advanced prior our area TSMC overall reduce annealing for size such product feature Semiconductor
higher and precise As devices for extremely shrink durations. and short temperatures kneeling requires
product system node. we well market into customers share. increase continued ramp our LSA are suited In is ideally we to a to nodes, and meet on Our our requirements. their our edge at progress advanced recognize move another positioned and these revenue When QX, next leading
market, advanced Now Gallium with Nitride history leadership includes I has to photonics, long technology systems. RF, Veeco will the MOCVD a move display power applications. our of and XG devices compound which semiconductor
and wafer a Our product power for for includes blue/green applications. portfolio multi-wafer single micro system a system and mini XXX-millimeter LEDs
GaN and that and top to fab. single has system customer this we automated system This tool. XXX-millimeter fully a cluster upstanding to exceptional acceptance a development from on that, wafer I'm quality. obtained uniformity completed semiconductor we excited leading-edge shipped our recently On film of share
stacks RF, for semiconductor blue/green emerging enablers GaN micro including electronics. quality film power High and are applications LED key XG
system, we applications we photonics to edge-emitting shipment are on in and red/orange/yellow including beta few is quarter LEDs the arsenide next our announced products, customer of the optimized a last phosphide for of version VCSELs, and our GaN target micro quarters. lasers, going and acceptance In addition This well beta to mini receive LEDs. MOCVD improved
been have to as this to grow, well tool closely We VCSELs. well other share. positioned hope evaluation working another When we gain be to market place for begins customers with and market
XG solutions in and We display best-in-class are technology we products are confident power advanced our needs MOCVD of address performance and the RF ready markets. the with to photonics
end the XXXX, toward made significant progress. come we we As of
wafer We continue semiconductor leading-edge mask completed We system MOCVD ship blank XXX-millimeter EUV the a development to a shipped market. single GaN to into and fab.
laser VCSELs. designed product. next-generation our applications system nanometers penetrating our improvements including made with packaging to And are anneal progress system the We We non-GAAP we made achieved for making photonics with progress beta advanced lithography lastly, of profitability. we MOCVD subset our and
of gross operating forward. margins to and expect company Our continue improve leverage the improve further going we the to
Sam that, the over to for details it turn further financials. With I'll on