in joining bottom you and everyone, executed today. afternoon, top and line Good Anthony. solid with Veeco thank our for QX call results. you, Thank well
executing strategy provide questions. John our highlights be I'll update shareholders. our a our team and to create guidance, on and you for to our we'll remains technologies. and and will take markets quarter take and perform well to discuss Today, customers value then growth continues through focused Our and first financial happy
in million, and non-GAAP million. QX the operating end all in in $XXX range. above income came top Non-GAAP guided Revenue at of diluted came $X.XX, our at EPS totaled $XX
semiconductor execution. results year-over-year, laser quarter's reflect for solid increasing our XX% Revenue remained annealing. led by elevated, products by This
team managing chain excellent an Our did supply the job during of quarter.
elevated, to the While that of see starting times material material in have times improve lead We're remained could on-time suppliers' some our signs improved. second lead the deliveries half year.
for As semiconductor solutions remain XXXX, differentiated in ahead we markets investing to with positioning we long-term committed Veeco in look compound growth. semiconductor the and
to switching our and Now markets technologies. gears
the semiconductor, our in the and AI, key data discussed automobile transformation the the we've driving of in megatrends mobility As immersive past, and semiconductor, markets primary user compound are trends high-performance X These and of cloud. there industry the storage. are experience, computing and X growth
Turning first market. semiconductor to the
Our delivering with the solutions is leading served expand edge. this at strategy to differentiated accomplished key technologies. our available X market We by
customers. momentum. company. We're opportunity which market by our which advanced reduces for growth additional for budgets traction logic at memory steps recent the a annealing advanced gaining annealing orders is also long-term significant for line, product is nodes demonstrated First, the laser at leading represents This seeing within thermal nodes,
and blanks years. many to manufacture beam is and used defect-free differentiated are for of adopt. for deposition choice another technology continue mask system new ion our the system have Second, to systems been EUV that customers These nearly existing EUV
X every systems XX recently one EUV lithography. sized at of deposition expect X increased ASML XX adoption market we our We reiterated beam to EUV XX continued customers systems to to with ion for to as systems, ship the capacity around for required per XXXX, plans their systems approximately year. of add our in EUV demand support lithography lithography systems
lithography packaging wet advanced and IDMs, And solutions third, and to processing provide OSATs. foundries we
systems and layers wafer-level lithography packaging. such as serve redistribution Our bumping, pillar copper applications
solvent strip wet used photoresist for cleans. primarily are processing systems Our and
consensus widely towards decline range weighted As XX%. wafer equipment XX% prevailing memory this The year the somewhere of heavily by is reported, fab to than more decline for forecasted spend logic. in the to
semiconductor our remain business outperform market currently semiconductor As spend sales that confident more our logic, is will to exposed XXXX. WFE in we
node from few despite and outlook from our system over recent for the logic a device advanced for further making our application, system deposition metals. LSA annealing toward that customer, evaluation towards shipment logic industry-wide key an evaluation ion production DRAM A advanced of LSA positive CapEx low-resistivity memory progress multiple evaluation an for beam solution, we're devices next-generation highlights an quarter reductions, our manufacturer system world-leading from support QX a next include: additional second orders further orders shipping advancement most for
demand. our EUV expect We weak and our in packaging growth advanced to wet in point softness processing product lines offset electronic more LSA business mask due to and than consumer lithography
in we be up expect such, semiconductor XXXX. revenue to our slightly As
our to on processing primarily RF devices, semiconductor the power compound our wet this We along market for for equipment and amplifier electronics Now power epitaxy with applications. serve with equipment and filter market. photonics
not over wet market. X months yet the to weak in has to due business the clear. of market processing smartphone the X last recovery Timing softness Our been is
opportunities progressing markets of technology which the ready half focused we second is carbide, legacy with growth. our However, expected on offer technology Power acquired. photonics to acquired power and well we're demo the MOCVD for silicon be with In CVD XXXX. in the system CVD our GaN of electronics recently with and Electronics, promising Integration
electric demand address growing system opportunity electronics solution in a significant Our represents differentiated for a the vehicle market. to power
micro display evaluations making including We're customer supporting in investments applications R&D, promising to ongoing continues to Our demos epitaxy this potential. to market these and growth area, opportunities. LED long-term equipment penetrate address
the manufacture based challenges the Veeco's dates excess on our at reported heads. remain over our to promising. to an XXXX years. in shipments XX% continue looking in widely our ion of Gartner HDD is approximate and to According next continue orders trends beam as backlog. customers' and Now we data X industry expect magnetic the exabyte the at to to disk hard revenue ship Nearline used internal Taking growth CAGR grow Despite inventory, storage estimates, industry's long-term a such step market. our capacity are in equipment back, drive expected
HAMR second opportunity Adoption equipment. more Larger complex not initial offers up are Seagate they recently the magnetic their quarter newer for heads to product on executing and their and magnetic heads. use addition, year. like of of etch more recording stated well this technologies let have recognize recording tracking map heat-assisted an technology In and deposition or the plan use HAMR-based to revenue in increased road drives
remain opportunity the as from recovers long-term its on current challenges. such, positive industry the we As
to our on Moving XXXX priorities.
that teamwork As to to and safe objective employees is our execution. prioritizes always, our healthy and a keep culture promote first and
we initiatives. progress commitment the improving culture our on corporate survey quarter, maintained During assess to our biannual key by launching our our to employee
transparency, reiterated further improve inclusion environmental by also to our our commitment We responsibility fourth our diversity, issuing and report. sustainability
priorities our one improving are quality to In our supply delivery execution, top is chain on-time as regard metrics and customer to on and of satisfaction. focusing essential maintaining
on market. to strategy. silicon success innovation evaluation to shipments growth through future our and future and in investments growing development remain are carbide our system penetrating engage customers focused continue and product We'll critical rapidly the Our
growth on outperforming with we're levels. products, WFE semiconductor Lastly, profitability support should which our us maintaining expectations focused in
stakeholders. building John. stronger a committed that, material difference it mind, Veeco in all I'll priorities and making over these a to With serves we're that With turn to