C. C. Wei
everybody staying We Thank hope this safe and is you, Wendell. healthy during time.
first mainly our TWD me revenue end XX.X which with let of above near-term First, USD and or billion quarter inventory. is the demand high start XXX.X of We ensure billion, forecast our the with concluded months our than security automotive-related and and supply guidance, X due ago smartphone with customer’s of COVID-related emergency better from applications continuing our uncertainties. demand to need to
second Moving into XXXX. quarter
demand, partially business smartphone by by expect be and We our offset to HPC supported seasonality. automotive-related
longer geopolitical the chain higher compared for COVID-related to uncertainties brought by recent tension. front, continue level supply to inventory disruptions time, level of to a the seasonal about we of and the prolonged historical inventory period a supply On by as chain maintain expect
XXXX. semiconductor device XG applications. makeup On to likely structural year uncertainties, guidance capture XXXX IoT for enrichment devices HPC, smartphone, technologies. TSMC. year and throughout substantial and support our the the trend underpinned much our the XXs high in demand, across growth to multiyear positioned drive despite or percent increase dollar terms. tight exceed growth, at unit will of U.S. the our applications. to automotive the with And will end in macro-related demand growth volume content of recent observe mid- technology in the long-term importantly, And we our semiconductor is high we and This to another expect demand we structural and range the young well be side, leadership, many capacity more our strong [markets], full HPC-related be of TSMC strong remain continue advanced expect With to by megatrend specialty industry
given recent constraint supply Next, me update. talk about the in the delivery tool tool chain, the let
As plan TSMC suppliers a in major chain, global and our all capacity player our semiconductor supply closely tool in the worked advance. to with CapEx
component suppliers their closely mature great several our industries, taking supply other is chains impact chip constraint our supply both suppliers working for [indiscernible] to supply from many and nodes. the and their chain TSMC COVID-XX, labor with like the of extending facing our challenges towards delivery in and creating chain lead time are which and actions do in to advanced are continued challenges. However, part
have regular high-level to We trace increased progress. communications the
are them We delivery. suppliers the to that chips identify closely have sent tool with support several critical are teams and working our on-site to gauging
are meet on we customers to and those We to taking XXXX with plan, help support critical so to and issue. such capacity to demand. customers’ the closely our with working we to constraint expect actions, our chip By wafer XXXX we chips our suppliers prioritize that mitigate any capacity impact our our work ramp-up can capacity continue beyond not to do
supply identify implement risk and risk will and I a access the to update. enterprise proactively materials system about TSMC all strategies. mitigation operates talk management relevant Now well-established risk
continuously local is supply, solutions global supply TSMC’s and well-diversified the to of terms build strategy supplier In multi-source chain. a material to develop base to improve supply
prepared we suppliers For have different from including source a neon on certain inventory stock and multiple specialty chemicals regions, in hand. gases, and and of we level geon
further strengthen supply. sustainability We do the are also of to any the suppliers on working materials resilience from our impact operations Thus, supply not our chain. closely our with expect and we
talk the status. NXE NX Finally, and about let me
will transistor maturity, structure cost best the use for technology NX our FinFET Our deliver to and customers. performance technology
half on schedule production is for XXXX good NX track year. second we’re unchanged, of with Our volume and in
expect NX both applications. be to HPC We ramp of and smartphone driven the by
our see with continue as expect We power level family with new to customer NX yield. performance, engagement will for further extend tape-outs more NX. for NX of [first] high and the NX enhanced at NX year NXE compared a and and
observed scheduled after production of also We volume NXE, year is and X NX. at high level customer a engagement for
advanced and technology it be technology transistor when is will technology most PPA foundry X-nanometer Our in both introduced. the
profitability, bring our even gross NX for the new And outlook process X challenging. of is as corporate initial has target margin achieving particularly with challenges such X as long-term terms increasing improved the always to the node nodes greater XX% higher. the to In complexity corporate profitability margin of quarters, of and in gross leading average
our TSMC. our done return that confident long-lasting our the and be key With technology diligently to continue will thank reducing we large for cost right to for NX. ensure prior our will are As have you strong and effort concludes we improvement another nodes, with we message, node on and that attention. we your earn and at our profitability demand, customer and family leadership NX This work