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CSBG represented 47% of our June quarter revenue. This is a historically high concentration percentage, driven largely by continued strength in the specialty node investments which are serviced by Reliant systems business.
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2023 Q4
30 Jul 23
We continue to expect NAND spending to remain at low levels for the remainder of the 2023 calendar year.
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2023 Q4
30 Jul 23
NAND spending is at the lowest levels we've seen since the advent of the 3D NAND architecture
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2023 Q4
30 Jul 23
The DRAM segment within memory remained flat at 9% of systems revenue. And NAND came down to 18% of systems revenue, down from the March quarter level of 23%.
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2023 Q4
30 Jul 23
We had a record level of concentration in the logic and other segment with 26% of systems revenue in the June quarter
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2023 Q4
30 Jul 23
Investments were biased towards leading-edge devices. There also continues to be robust spending to support more mature specialty nodes.
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2023 Q4
30 Jul 23
we see strong concentration of systems revenue in the foundry segment with the June quarter revenue percentage at 47%
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2023 Q4
30 Jul 23
Memory as a percentage of systems revenue in the June quarter was low at 27%, which was a decline from the prior quarter level of 32% and our lowest concentration percentage for this segment in the last decade.
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2023 Q4
30 Jul 23
We expect a significant portion of these deposits to convert to revenue during the second half of calendar year 2023.
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2023 Q4
30 Jul 23
our deferred revenue balance is currently still at higher than historic levels
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2023 Q4
30 Jul 23
We've got all the deferred revenue related to outstanding back order parts completely back to normal levels.
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2023 Q4
30 Jul 23
We closed the June quarter with $1.8 million in deferred revenue on the balance sheet, which was a decrease of $165 million sequentially.
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2023 Q4
30 Jul 23
our SABRE 3D copper electroplating tool and Syndion etch system hold 100% market share across all leading memory customers for through-silicon
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2023 Q4
30 Jul 23
Overall, we have greater than 50% market share in deposition and edge solutions required for advanced 3D stacking of high bandwidth memory.
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2023 Q4
30 Jul 23
Some of these schemes enable up to 50% improved memory density, 10 times improvement in bandwidth and 60% gain in power efficiency.
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2023 Q4
30 Jul 23
Customers are increasingly adopting a wide variety of packaging schemes to enable logic and memory integration.
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2023 Q4
30 Jul 23
3D DRAM and advanced packaging are important 3D inflections that are expected to drive strong SAM and share growth for Lam
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2023 Q4
30 Jul 23
Lam is the established leader in 3D NAND
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2023 Q4
30 Jul 23
every incremental 1% penetration of AI servers and data centers is expected to drive $1 billion to $1.5 billion of additional WFE investment
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2023 Q4
30 Jul 23
We continue to see second half 2023 WFE tracking higher than first half.
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2023 Q4
30 Jul 23