as Borrower,
as Lender,
as Facility Agent,
Fab 7 Phase II Project
1. | Facility Agent: | JP Morgan Chase Bank, National Association | |||||
2. | Borrower: | Chartered Semiconductor Manufacturing Ltd | |||||
3. | Borrower’s Country: | Republic of Singapore | |||||
4. | Financed Portion Amount: | U.S.$600,101,520 | |||||
Tranche A Financed Portion Amount: | U.S.$300,101,520 | ||||||
Tranche B Financed Portion Amount: | U.S.$300,000,000less the aggregate amount of all Financed Portion of Disbursements of the Tranche A Guaranteed Credit | ||||||
5. | (a) | Exposure Fee Percentage (applied to Financed Portion Amount) | |||||
Tranche A: | XXXXX | ||||||
Tranche B: | XXXXX | ||||||
(b) | Exposure Fee Amount: | U.S.$9,631,513 | |||||
þ financed þ as disbursed | o not financed o up front |
6. | Guaranteed Credit Amount: | |||
Tranche A Guaranteed Credit: | U.S.$304,573,033 | |||
Tranche B Guaranteed Credit: | U.S.$609,733,033less the aggregate amount of all Disbursements of the Tranche A Guaranteed Credit | |||
Total: | U.S.$609,733,033 | |||
7. | Margin: | As set forth in the definition of “Margin” in Section 1.01. | ||
Floating Rate: | LIBOR plus Margin | |||
Fixed Rate: | As defined |
8. | Guarantee Commitment Fee: XXXXX per annum on the uncancelled and undisbursed amount of the Guaranteed Credit, accruing from July 16, 2007 to the Final Disbursement Date, due and payable on each January 15 and July 15 of each year, beginning on January 15, 2008. | |
9. | Principal Repayment: |
2
Tranche A: semi-annual installments, due and payable on each January 15 and July 15, beginning not later than July 15, 2010, until the Tranche A Credit is repaid in full. | ||
Tranche B: semi-annual installments, due and payable on each January 15 and July 15, beginning not later than July 15, 2012, until the Tranche B Credit is repaid in full. |
10. | Final Maturity Date: | ||
Tranche A: not later than January 15, 2015 | |||
Tranche B: not later than January 15, 2018 |
11. | End of Availability Period: | ||
Tranche A: not later than June 15, 2010 | |||
Tranche B: not later than June 15, 2012 | |||
12. | Except as otherwise provided in the Agreement, all notices shall be directed to the respective parties in accordance with the following: |
Address: | Chartered Semiconductor Manufacturing Ltd 60 Woodlands Industrial Park D Street 2 Singapore 738406 | |
Attention: | George Thomas, Chief Financial Officer | |
Fax: | +65-6362-2909 | |
Telephone: | +65-6360-4350 | |
To the Facility Agent | ||
Address: | Government Agency Unit JPMorgan Chase Bank, N.A. 4 Chase MetroTech Center, 10th Floor Brooklyn, NY 11245 | |
Attention: | Gamal Boulos, Maria Adamczyk, Laura Tamuccio | |
Fax: | (718) 242-2089 | |
Telephone: | (718) 242-3245, 7355, 7893 |
3
cc: | Marguerite Gill JPMorgan Chase Bank, N.A. 1 Chase Manhattan Plaza, 3rd Floor New York, NY 10081 | |
Fax: | (212) 552-7819 | |
Telephone: | (212) 552-4190 | |
To the Lender | ||
Address: | Government Agency Unit JPMorgan Chase Bank, N.A. 4 Chase MetroTech Center, 10th Floor Brooklyn, NY 11245 | |
Attention: | Gamal Boulos, Maria Adamczyk, Laura Tamuccio | |
Fax: | (718) 242-2089 | |
Telephone: | (718) 242-3245, 7355, 7893 | |
cc: | Marguerite Gill JPMorgan Chase Bank, N.A. 1 Chase Manhattan Plaza, 3rd Floor New York, NY 10081 | |
Fax: | (212) 552-7819 | |
Telephone: | (212) 552-4190 | |
To Ex-Im Bank | ||
Address: | Export-Import Bank of the United States 811 Vermont Avenue, N.W. Washington, DC 20571 | |
Attention: | Unless otherwise specified herein, — Asset Management Division | |
Fax: | (202) 565-3625 (Asset Management Division) (202) 565-3380 (Bank-wide) | |
Telephone: | (202) 565-3600 |
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MANUFACTURING LTD
By: | /s/ Chia Song Hwee | |||
(Signature) | ||||
Name: | Chia Song Hwee | |||
(Print) | ||||
Title: | President & CEO | |||
(Print) |
By: | /s/ Barbara O’Boyle | |||
(Signature) | ||||
Name: | Barbara O’Boyle | |||
(Print) | ||||
Title: | Vice President, Structured Finance | |||
(Print) |
97
as Lender
By: | /s/ Marguerite M. Gill | |||
(Signature) | ||||
Name: | Marguerite M. Gill | |||
(Print) | ||||
Title: | Vice President | |||
(Print) |
JPMorgan Chase Bank, N.A.
International Banking Facility
245 Park Avenue
10th Floor
New York, New York 10167
as Facility Agent
By: | /s/ Marguerite M. Gill | |||
(Signature) | ||||
Name: | Marguerite M. Gill | |||
(Print) | ||||
Title: | Vice President | |||
(Print) |
98
(i) | Share Capital of the Borrower as at May 10, 2007 |
Share Capital Issued | No. of shares | Share Capital (S$) | ||
Current Issued and Paid-up capital | 2,538,042,316 | 4,382,108,454.078 |
(ii) | List of shareholder owning directly or indirectly 5% or more of the Borrower’s shares as at May 10, 2007 |
Name of Shareholder | No. of Shares | % of issued share capital | ||
Singapore Technologies Semiconductors Pte Ltd | 1,510,324,883 | 59.5075% |
Note: | Temasek Holdings (Private) Limited is deemed to be interested in the 1,510,324,883 shares held by Singapore Technologies Semiconductors Pte Ltd |
1
Exposure Fee to Ex-Im Bank | 15% * | |
Guarantee Commitment Fee to Ex-Im Bank | 15% * | |
Interest Payment to Lender | 15% |
Service Fee to J.P. Morgan (S.E.A.) Limited | Not Applicable | |
Documentary Processing Fee to Lender | 15% * | |
Commitment Fee to Lender | 15% * | |
L/C Fees to Lender | 15% * | |
Security Trustee Fee to Security Trustee | 15% * |
* | The payments would not be subject to withholding taxes if the following conditions are satisfied: | |
(a) the transactions are conducted at arm’s length; | ||
(b) there is no intention to siphon off Singapore income; and | ||
(c) the arrangement, management, guarantee or service is performed outside Singapore. |
1
List of Indebtedness | Original Principal | |
Amount (US$ million) | ||
Part 1 | ||
Ex-Im Phase I Project Credit Facilities* | 653.0 | |
SMBC Revolving Credit Facility | 150.0 | |
Bank of America Revolving Credit Facility | 50.0 | |
Convertible Redeemable Preference Shares** | 253.0 | |
6.00% Amortizing Bonds due 2010* | 47.0 | |
6.25% Senior Notes due 2013 | 300.0 | |
6.375% Senior Notes due 2015 | 250.0 | |
Part II | ||
5.75% Senior Notes due 2010 | 375.0 | |
Total | 2,078.0 |
* | Has been partly repaid. | |
** | Currently accounted for as mezzanine equity in financial statements. |
1
JPMorgan Chase Bank, N.A.,
as Lender and as Facility Agent
4 Chase MetroTech Center, 10th Floor
Brooklyn, NY 11245
Attention: Gamal Boulos, Maria Adamczyk, Laura Tamuccio
811 Vermont Avenue, NW
Washington, DC 20571
Attention: Asset Management Division
Re: | Chartered Semiconductor Fab 7Phase IIProject — Notice of Borrowing Ex-Im Bank Transaction No. AP082872XX-Singapore |
1 | To be delivered no later than twenty (20) Business Days prior to the Requested Drawdown Date. |
EXHIBIT A
1
Guaranteed Credit | Amount Requested2 | |||||||
Tranche [A][B] Guaranteed Credit | US$ | |||||||
Reimbursements | US$ | |||||||
L/C Payments | US$ | |||||||
Exposure Fee | US$ |
% of Aggregate | ||||||||
Guaranteed Credit | Disbursements | |||||||
Tranche A Guaranteed Credit | US$ | % | ||||||
Reimbursements | US$ | % | ||||||
L/C Payments | US$ | % | ||||||
Exposure Fee | US$ | % | ||||||
[Tranche B Guaranteed Credit | US$ | % | ||||||
Reimbursements | US$ | % | ||||||
L/C Payments | US$ | % | ||||||
Exposure Fee | US$ | %] |
2 | Except with respect to the final Disbursement under each Guaranteed Credit, the minimum draw amount for each Guaranteed Credit shall be (a) US$5,000,000 in the case of the initial Disbursement under each Guaranteed Credit, and (b) US$1,000,000 in the case of any other Disbursement. |
EXHIBIT A
2
EXHIBIT A
3
CHARTERED SEMICONDUCTOR MANUFACTURING LTD | ||||
By: | ||||
Name: | ||||
Title: | ||||
cc: | Marguerite Gill | |
JPMorgan Chase Bank, N.A. 1 Chase Manhattan Plaza, 3rd Floor New York, NY 10081 |
EXHIBIT A
4
A. | All certificates and documentation required by the Notice of Borrowing (including certifications, documents or other items necessary to establish the satisfaction of the conditions of the Ex-Im Bank Facility Agreement);provided,however, that the certificates and documentation required under Section 6.01 of the Ex-Im Bank Facility Agreement in connection with the Initial Utilization Date shall not be required to be delivered in connection with any subsequent Notice of Borrowing delivered in connection with any subsequent Disbursement, unless the Ex-Im Bank Facility Agreement specifically contemplates otherwise pursuant to Sections 6.02 and 6.03 thereof. | |
B. | Disbursement Certificate signed by an Authorized Officer of the Borrower. |
EXHIBIT A
5
JPMorgan Chase Bank, N.A.,
as Lender and as Facility Agent
4 Chase MetroTech Center, 10th Floor
Brooklyn, NY 11245
Attention: Gamal Boulos, Maria Adamczyk, Laura Tamuccio
811 Vermont Avenue, NW
Washington, DC 20571
Attention: Asset Management Division
Re: | Chartered Semiconductor Fab 7Phase IIProject — Disbursement Certificate Ex-Im Bank Transaction No. AP082872XX-Singapore |
1 | To be delivered no later than twenty (20) Business Days prior to the Requested Drawdown Date with the Notice of Borrowing. |
EXHIBIT B
1
2 | Use only in connection with the initial Disbursement or initial Utilization under the Tranche A Guaranteed Credit. | |
3 | Use only in connection with a Disbursement or Utilization under the Tranche A Guaranteed Credit occurring on or after December 31, 2005. | |
4 | Use only in connection with the initial Disbursement or initial Utilization under the Tranche B Guaranteed Credit. |
EXHIBIT B
2
CHARTERED SEMICONDUCTOR MANUFACTURING LTD | ||||
By: | ||||
Name: | ||||
Title: | ||||
cc: | Marguerite Gill JPMorgan Chase Bank, N.A. 1 Chase Manhattan Plaza, 9th Floor New York, NY 10081 |
Attachments: | Exhibit A Annex 1 Annex 2 Annex 3 | Project Costs Previously paid Due and payable Expected to become due and payable in the thirty (30) days next succeeding the Requested Drawdown Date |
EXHIBIT B
3
TO DISBURSEMENT CERTIFICATE
[Category] | US$ | ||
Total: | US$ |
5 | Categories should correspond to line items in the Ramp and Capital Costs Budget. |
EXHIBIT B
4
TO EXHIBIT A
TO DISBURSEMENT CERTIFICATE
EXHIBIT B
5
TO EXHIBIT A
TO DISBURSEMENT CERTIFICATE
EXHIBIT B
6
TO EXHIBIT A
TO DISBURSEMENT CERTIFICATE
in the thirty (30) days next succeeding the Requested Drawdown Date]
EXHIBIT B
7
JPMorgan Chase Bank, N.A.,
as Lender and as Facility Agent
4 Chase MetroTech Center, 10th Floor
Brooklyn, NY 11245
Attention: Gamal Boulos, Maria Adamczyk, Laura Tamuccio
811 Vermont Avenue, NW
Washington, DC 20571
Attention: Asset Management Division
Re: | Chartered Semiconductor Fab 7Phase IIProject — Borrower’s Closing Certificate Ex-Im Bank Transaction No. AP082872XX — Singapore |
EXHIBIT C
1
Name | Title | Signature | ||
[Name] | [Title] | |||
[Name] | [Title] | |||
[Name] | [Title] |
1 | Insert the bracketed text, if applicable. |
EXHIBIT C
2
EXHIBIT C
3
CHARTERED SEMICONDUCTOR MANUFACTURING LTD | ||||
By: | ||||
Name: | ||||
Title: | ||||
cc: | Marguerite Gill JPMorgan Chase Bank, N.A. 1 Chase Manhattan Plaza, 3rd Floor New York, NY 10081 |
Attachments: | Exhibit A Exhibit B Exhibit C Exhibit D Exhibit E | Articles of Association Certificate of Good Standing and Existence Resolutions Ramp Schedule Ramp and Capital Costs Budget |
EXHIBIT C
4
JPMorgan Chase Bank, N.A.,
as Lender and as Facility Agent
4 Chase MetroTech Center, 10th Floor
Brooklyn, NY 11245
Attention: Gamal Boulos, Maria Adamczyk, Laura Tamuccio
811 Vermont Avenue, NW
Washington, DC 20571
Attention: Asset Management Division
Re: | Chartered Semiconductor Fab 7Phase IIProject — Borrower’s Financial Statement Certificate Ex-Im Bank Transaction No. AP082872XX — Singapore |
1 | If delivered pursuant to Section 6.01(d), date as of the Initial Disbursement Date. If delivered pursuant to Section 10.01(o)(i), deliver as soon as available, but in any event within ninety (90) days after the end of each Fiscal Year. If delivered pursuant to Section 10.01(o)(ii), deliver as soon as available, but in any event within thirty (30) days after the Borrower’s receipt of the relevant financial statements. If delivered pursuant to Section 10.01(o)(iii), deliver as soon as available, but in any event within sixty (60) days after each of the first three (3) fiscal quarters in each Fiscal Year. | |
2 | Insert appropriate section reference. |
EXHIBIT D
1
3 | Must be chief financial officer or other appropriate financial officer. | |
4 | Use regarding statements delivered pursuant to Section 6.01(d). | |
5 | Use regarding statements delivered pursuant to Section 10.01(o). |
EXHIBIT D
2
CHARTERED SEMICONDUCTOR MANUFACTURING LTD | ||||
By: | ||||
Name: | ||||
Title: | ||||
cc: | Marguerite Gill JPMorgan Chase Bank, N.A. 1 Chase Manhattan Plaza, 3rd Floor New York, NY 10081 |
Attachment: | Exhibit A Financial Statements |
EXHIBIT D
3
EXHIBIT E
1
FORM OF TRANCHE [A/B] FLOATING RATE GUARANTEED NOTE | Annex A-1 |
US$__________ | ______________, 20___ |
A-1-1
A-1-2
CHARTERED SEMICONDUCTOR MANUFACTURING LTD | ||||
By: | ||||
(Signature)1 | ||||
Name: | ||||
(Print) | ||||
Title: | ||||
(Print) | ||||
By: | ||||
(Signature) | ||||
Name: | ||||
(Print) | ||||
Title: | ||||
(Print) |
1 | Corporate makers should sign only in their corporate capacities with proper reference to their corporate titles. |
A-1-3
Annex A-1
Percentage of | ||||||||
Guaranteed Credit to Be | ||||||||
Installment | Repaid | Repayment Date2 | Repayment Date3 | |||||
1 | 10.00 | % | July 15, 2010 | July 15, 2012 | ||||
2 | 10.00 | % | January 15, 2011 | January 15, 2013 | ||||
3 | 10.00 | % | July 15, 2011 | July 15, 2013 | ||||
4 | 10.00 | % | January 15, 2012 | January 15, 2014 | ||||
5 | 10.00 | % | July 15, 2012 | July 15, 2014 | ||||
6 | 10.00 | % | January 15, 2013 | January 15, 2015 | ||||
7 | 10.00 | % | July 15, 2013 | July 15, 2015 | ||||
8 | 10.00 | % | January 15, 2014 | January 15, 2016 | ||||
9 | 10.00 | % | July 15, 2014 | July 15, 2016 | ||||
10 | 10.00 | % | January 15, 2015 | January 15, 2017 |
2 | Use this column in connection with the Tranche A Guaranteed Credit. Insert earlier dates, as appropriate, in the event the Phase II Interim Completion Date occurs prior to January 15, 2010 | |
3 | Use this column in connection with the Tranche B Guaranteed Credit. Insert earlier dates, as appropriate, in the event the Phase II Completion Date occurs prior to January 15, 2012 |
A-1-4
Annex A-1
Principal | Payment Date | Unpaid | ||||||||||||||||||
Date of | Amount of | of | Amount Paid or | Principal | Notation Made | |||||||||||||||
Disbursement | Disbursement | Disbursement | Prepaid | Amount | By | |||||||||||||||
A-1-5
FORM OF TRANCHE [A/B] FIXED RATE GUARANTEED NOTE | Annex A-2 |
U.S. $_______ | __________, 20___ |
A-2-1
A-2-2
CHARTERED SEMICONDUCTOR MANUFACTURING LTD | ||||
By: | ||||
(Signature)1 | ||||
Name: | ||||
(Print) | ||||
Title: | ||||
(Print) | ||||
By: | ||||
(Signature) | ||||
Name: | ||||
(Print) | ||||
Title: | ||||
(Print) |
1 | Corporate makers should sign only in their corporate capacities with proper reference to their corporate titles. |
A-2-3
Annex A-2
Percentage of | ||||||||
Guaranteed Credit to Be | ||||||||
Installment | Repaid | Repayment Date1 | Repayment Date2 | |||||
1 | 10.00 | % | July 15, 2010 | July 15, 2012 | ||||
2 | 10.00 | % | January 15, 2011 | January 15, 2013 | ||||
3 | 10.00 | % | July 15, 2011 | July 15, 2013 | ||||
4 | 10.00 | % | January 15, 2012 | January 15, 2014 | ||||
5 | 10.00 | % | July 15, 2012 | July 15, 2014 | ||||
6 | 10.00 | % | January 15, 2013 | January 15, 2015 | ||||
7 | 10.00 | % | July 15, 2013 | July 15, 2015 | ||||
8 | 10.00 | % | January 15, 2014 | January 15, 2016 | ||||
9 | 10.00 | % | July 15, 2014 | July 15, 2016 | ||||
10 | 10.00 | % | January 15, 2015 | January 15, 2017 |
2 | Use this column in connection with the Tranche A Guaranteed Credit. Insert earlier dates, as appropriate, in the event the Phase II Interim Completion Date occurs prior to January 15, 2010. | |
3 | Use this column in connection with the Tranche B Guaranteed Credit. Insert earlier dates, as appropriate, in the event the Phase II Completion Date occurs prior to January 15, 2012. |
A-2-4
Annex A-2
Principal | Payment Date | Unpaid | ||||||||||||||||||
Date of | Amount of | of | Amount Paid or | Principal | Notation Made | |||||||||||||||
Disbursement | Disbursement | Disbursement | Prepaid | Amount | By | |||||||||||||||
A-2-5
UTILIZATION AND DISBURSEMENT PROCEDURES FOR GUARANTEED CREDITS | Annex B |
I. | Introduction |
II. | Reimbursement Procedure |
B-1
III. | L/C Procedure |
1 | The Facility Agent may also be the L/C Bank if the Facility Agent is a commercial bank located in the U.S. |
B-2
B-3
B-4
B-5
IV. | Ocean Transportation — MARAD Waivers |
B-6
1 | — | Form of Exporter’s Certificate | ||
2 | — | Request for Reimbursement to Borrower’s Account | ||
2(a) | — | Itemized Statement of Payments | ||
3 | — | Certificate Authorizing Reimbursement of Goods and Services | ||
4 | — | Request for Letter of Credit Approval | ||
5 | — | Certificate Approving Letter of Credit | ||
6 | — | Request for Ex-Im Bank Approval of Amendment to Letter of Credit | ||
7 | — | Certificate Approving Amendment to Letter of Credit | ||
8 | — | Request for Facility Agent Approval of Amendment to Letter of Credit | ||
9 | — | Notice of Letter of Credit Amendment |
B-7
FORM OF EXPORTER’S CERTIFICATE | EXHIBIT 1 to Annex B |
RE: | Ex-Im Bank Credit/Guarantee/Insurance Number: Purchaser: Supply Contract/Purchase Order No.(s) |
Check one: | o | Initial Exporter’s Certificate | |
o | Amended Exporter’s Certificate. The following has changed: [specify] |
o | The Goods and Services contain only U.S. Content: the U.S. Content Percentage is 100% (i.e., no Foreign Content, Local Costs, or Excluded Goods and Services (defined below)). Please donot complete the chart if this box is checked. | ||
o | The Goods and Services containless than 100% U.S. Content. Please complete the chart if this box is checked. |
Definition | USD | |||||||
A. | Supply Contract/ PurchaseOrder(s) | The aggregate price ofall Goods and Services in the Supply Contract/Purchase Order(s). | ||||||
B. | Excluded Goods and Services | The aggregate price of all Goods and Services that arenot eligible for (or excluded from) Ex-Im Bank support (e.g., goods not shipped from the U.S.) | ||||||
C. | Contract Price | A minus B | ||||||
D. | Local Costs | The aggregate price of all Goods originated/manufactured in the Purchaser’s country and all Services provided by residents of the Purchaser’s country. | ||||||
E. | Net Contract Price | C minus D | ||||||
F. | Foreign Content | The aggregate cost to the Exporter of any Goods (or components thereof) that were produced or manufactured outside the U.S., Services provided by third country-resident personnel, and foreign freight costs and foreign insurance included in the Net Contract Price for Goods exported from the U.S. (Such amount shall not include any Local Costs.) | ||||||
G. | U.S. Content | E minus F | ||||||
H. | U.S. Content Percentage | G divided by E, expressed as a percentage. | % | |||||
I. | Disbursement Percentage | Initial Exporter’s Certificate: input the lower of (i) 85% and (ii) the percentage in H. Amended Exporter’s Certificate: input the percentage obtained from the Disbursement Percentage Calculator page (if any). | % |
B(1)-1
B(1)-2
By: | ||||
(Authorized Officer or Employee) | ||||
Name: | ||||
Title: |
B(1)-3
The information provided in Part A will be used to determine the total amount of Ex-Im Bank guarantee, loan or insurance support for a transaction. Please refer to Ex-Im Bank’s Fact Sheets on Foreign Content, Local Costs, and Ancillary Services athttp://www.exim.gov/products/index.html for a further explanation of Ex-Im Bank’s content and cover policies.
The certifications in Part B cover those Goods and Services sourced from U.S. (or the Purchaser’s country)and approved as eligible for coverage under an Ex-Im Bank Credit/Guarantee/Insurance. If you have any question about what Goods and Services are approved by Ex-Im Bank, please contact your Ex-Im Bank credit officer. For Long-Term transactions (credit over $10MM or more than 7 years repayment), such “Goods and Services” are those listed in the current Acquisition List submitted by the Borrower to Ex-Im Bank.
The Exporter’s Certificate must be completed by the Exporter and presented prior to the borrower’s first request for disbursement related to that exporter’s invoices under the Ex-Im Bank-supported credit. Exporter’s Certificates are also to be completed by U.S. and non-U.S. providers of ancillary services (such as banking, financial advisor, technical consultant, and legal) that have been approved by Ex-Im Bank for financing under the Ex-Im Bank Credit/Guarantee/Insurance.
If an Amended Exporter’s Certificate is required pursuant to Section 6 of the Exporter’s Certificate, the Exporter should check the “Amended Exporter’s Certificate” box at the top of the Certificate and note the change being reflected in the amended Certificate. The Exporter should contact the lender under an Ex-Im Bank Guarantee/Insurance transaction, or Ex-Im Bank if an Ex-Im Bank Credit, for instructions on where to send the Amended Exporter’s Certificate.
For information regarding the Exporter’s Certificate (and other helpful facts), go tohttp://www.exim.gov/. Should you have any further questions regarding the Exporter’s Certificate, please call Ex-Im Bank’s Operations Division at (202) 565-3470. For insurance transactions, please contact your insurance broker or appropriate Ex-Im Bank regional office.
For informational and reporting purposes only, Ex-Im Bank requests that Exporters submit Content Reports and an annual Aggregate Foreign Content Cause Report. Under Medium-Term transactions a Content Report should be submitted with the Application for Ex-Im Bank support. Under Long-Term transactions the Content Report should be submitted with the initial Exporter’s Certificate. If at the completion of the work performed under a Supply Contract/Purchase Order(s), the foreign content amount changed by one percentage point or more of the value of the Net Contract Price, Exporters should submit a final revised Content Report within 60 days. Ex-Im Bank may contact Exporters to reconfirm the information provided in the Content Report.
B(1)-4
B(1)-5
REIMBURSEMENT PROCEDURE | Annex B Exhibit 2 |
JPMorgan Chase Bank, N.A.,
as Facility Agent
4 Chase MetroTech Center, 10th Floor
Brooklyn, NY 11245
Attention: Gamal Boulos, Maria Adamczyk, Laura Tamuccio
811 Vermont Avenue, N.W.
Washington, DC 20571
Subject: | Ex-Im Bank Transaction No. AP082872XX-Singapore Chartered Semiconductor Manufacturing Ltd (the “Borrower”) Request for Disbursement No. ___ |
Reimbursement amount U.S.$__________ Exposure Fee amount U.S.$__________ TOTAL Disbursement U.S.$__________ |
B(2)-1
(i) | we have paid, or caused to be paid, the exact amounts set forth in the attached Itemized Statement of Payments for the Goods and Services specified therein; |
(ii) | we have not, and to the best of our knowledge and belief, the Exporter(s) (and Ancillary Services Provider(s), if any) have not, and will not, agree to, offer to, cause to, arrange for or receive, directly or indirectly, any payment, discount, allowance, rebate, commission, fee or other payment in connection with Goods and Services or the Supply Contract(s) or the Guaranteed Credit,except for (a) payment of manufacturing costs or for the purchase of the Goods; (b) regular remuneration of regular full-time directors, officers and employees; (c) regular commissions or fees, if any, to regular sales agents, brokers or representatives and readily identifiable on the relevant party’s books and records as to amount, purpose and recipient; (d) any discounts, allowances, or rebates that are disclosed in invoices from the Exporter or Ancillary Services Provider, as the case may be and (e) any letter of credit or other fees paid to commercial banks or any payments made to Ex-Im Bank, in either case in connection with the Guaranteed Credit; |
(iii) | we have not made, and to the best of our knowledge and belief, the Exporter(s) (and Ancillary Services Provider(s), if any) have not made, and will not make, any payment in connection with the Goods and Services or the Supply Contract(s) or the Guaranteed Credit to any Person who is debarred, suspended, declared ineligible, or voluntarily excluded from participation in procurement or non-procurement transactions with any United States federal government department or agency pursuant to any of the Debarment Regulations; |
B(2)-2
(iv) | as of the date of this request, no Default or Event of Default has occurred and is continuing; and |
(v) | as of the date of this request, the representations and warranties made by us in Section 9.01 of the Agreement [and Section 6.03(d)(ii) of the Agreement]2 are true. |
Very truly yours, CHARTERED SEMICONDUCTOR MANUFACTURING LTD | ||||
By: | ||||
(Signature)3 | ||||
Name: | ||||
(Print) | ||||
Title: | ||||
(Print) |
cc: | Marguerite Gill JPMorgan Chase Bank, N.A. 1 Chase Manhattan Plaza, 3rd Floor New York, NY 10081 |
Itemized Statement of Payments and supporting documents |
2 | Insert reference to Section 6.03(d)(ii) of the Agreement for all Disbursements other than the initial Disbursement. | |
3 | May only be signed by one (or more, if required) of the Authorized Officers of the Borrower. |
B(2)-3
REIMBURSEMENT PROCEDURE | Annex B Exhibit 2(a) |
Ex-Im Bank Transaction No. AP082872XX-Singapore Itemized Statement of Payments No. __________ Attachment to Request for Reimbursement No. __________ [Exporter][Ancillary Services Provider]:__________ Supply Contract No(s):__________ Date of Exporter’s Certificate:__________ |
Amount of | Brief Description of | Bill of Lading | ||||||||
Invoice No. | Date of Payment | Payment1 (US$) | Good/Service2 | Date/No. | Remarks | |||||
$__________ TOTAL AMOUNT OF PAYMENTS $__________ TOTAL AMOUNT OF PAYMENTS IN US$ $__________ REIMBURSEMENT AMOUNT AT ___%3 $__________ TOTAL DISBURSEMENTS |
1 | If the amount of payment is not for the total invoice value, explain in Remarks. | |
2 | Description must match that provided in the Acquisition List. | |
3 | Total U.S. Invoice Value multiplied by the lesser of: (i) 85%, (ii) the U.S. Content Percentage from the most recently delivered Exporter’s Certificate and (iii) the Disbursement Percentage (if any) from such Exporter’s Certificate. | |
NOTE: | PLEASE COMPLETE ONE PAGE PER EXPORTER (OR ANCILLARY SERVICES PROVIDER) |
B(2a)-1
Exhibit 3
JPMorgan Chase Bank, N.A.,
as Facility Agent
4 Chase MetroTech Center, 10th Floor
Brooklyn, NY 11245
Attention: Gamal Boulos, Maria Adamczyk, Laura Tamuccio
Subject: | Ex-Im Bank Transaction No. AP082872XX-Singapore Chartered Semiconductor Manufacturing Ltd (the “Borrower”) Certificate Authorizing Reimbursement No. [___] for Goods and Services |
1 | Insert date which is 30 days after the date of the Certificate Authorizing Reimbursement |
B(3)-1
EXPORT-IMPORT BANK OF THE UNITED STATES | ||||
By: | ||||
Name: | ||||
Title: | ||||
cc: | Marguerite Gill JPMorgan Chase Bank, N.A. 1 Chase Manhattan Plaza, 3rd Floor New York, NY 10081 |
B(3)-2
L/C PROCEDURE | Annex B Exhibit 4 |
JPMorgan Chase Bank, N.A.,
as Facility Agent
4 Chase MetroTech Center, 10th Floor
Brooklyn, NY 11245
Attention: Gamal Boulos, Maria Adamczyk, Laura Tamuccio
811 Vermont Avenue, N.W.
Washington, DC 20571
Attention: Operations Division
Subject: | Ex-Im Bank Transaction No. AP082872XX-Singapore Chartered Semiconductor Manufacturing Ltd (the “Borrower”) Request for Letter of Credit Approval |
B(4)-1
B(4)-2
MANUFACTURING LTD
By: | ||||
(Signature)1 | ||||
Name: | ||||
(Print) | ||||
Title: | ||||
(Print) |
cc: | Marguerite Gill JPMorgan Chase Bank, N.A. 1 Chase Manhattan Plaza, 3rd Floor New York, NY 10081 |
3 copies of Proposed L/C 1 copy of Exporter’s pro forma invoice, |
Supply Contract, or other document covering purchase |
[1 originally executed Exporter’s Certificate (Exhibit 1)] [Delete if previously provided |
in connection with previous Utilization or Disbursement] |
1 | May only be signed by one (or more, if required) of the Authorized Officers of the Borrower. |
B(4)-3
L/C PROCEDURE | Annex B Exhibit 5 |
Subject: | Ex-Im Bank Transaction No. AP082872XX-Singapore Chartered Semiconductor Manufacturing Ltd (the “Borrower”) Certificate Approving Letter of Credit No. ___ |
B(5)-1
EXPORT-IMPORT BANK OF THE UNITED STATES | ||
cc: | Government Agency Unit |
as Facility Agent
4 Chase MetroTech Center, 10th Floor
Brooklyn, NY 11245
Attention: Gamal Boulos, Maria Adamczyk, Laura Tamuccio
B(5)-2
JPMorgan Chase Bank, N.A.,
as Facility Agent
4 Chase MetroTech Center, 10th Floor
Brooklyn, NY 11245
Attention: Gamal Boulos, Maria Adamczyk, Laura Tamuccio
811 Vermont Ave., N.W.
Washington, DC 20571
Attention: Operations Division
Subject: | Ex-Im Bank Transaction No. AP082872XX-Singapore Chartered Semiconductor Manufacturing Ltd (the “Borrower”) Request to Amend Letter of Credit No. |
1 | Describe the facts or circumstances that justify the amendment. |
B(6)-1
Very truly yours, CHARTERED SEMICONDUCTOR MANUFACTURING LTD | |||
By: | |||
(Signature)2 | |||
Name: | |||
(Print) | |||
Title: | |||
(Print) |
2 | May only be signed by one (or more, if required) of the Authorized Officers of the Borrower. |
B(6)-2
cc: | Marguerite Gill JPMorgan Chase Bank, N.A., as Lender 1 Chase Manhattan Plaza, 3rd Floor New York, NY 10081 |
B(6)-3
L/C PROCEDURE | Annex B Exhibit 7 |
as L/C Bank
[address]
Subject: | Ex-Im Bank Transaction No. AP082872XX-Singapore Chartered Semiconductor Manufacturing Ltd (the “Borrower”) Certificate Approving Amendment to Letter of Credit No. __________ |
B(7)-1
EXPORT-IMPORT BANK OF THE UNITED STATES | ||||
By: | ||||
(Signature) | ||||
Name: | ||||
(Print) | ||||
Title: | ||||
(Print) |
cc: | Government Agency Unit |
as Facility Agent
4 Chase MetroTech Center, 10th Floor
Brooklyn, NY 11245
Attention: Gamal Boulos, Maria Adamczyk, Laura Tamuccio
B(8)-2
AMENDMENT TO LETTER OF CREDIT
JPMorgan Chase Bank, N.A.,
as Facility Agent
4 Chase MetroTech Center, 10th Floor
Brooklyn, NY 11245
Attention: Gamal Boulos, Maria Adamczyk, Laura Tamuccio
Subject: | Ex-Im Bank Transaction No. AP082872XX-Singapore Chartered Semiconductor Manufacturing Ltd (the “Borrower”) Request for Amendment to Letter of Credit No. |
o | Allow sufficient time for the presentation of all documents and the making of all Letter of Credit disbursements by extending the expiry date to the earlier of: (i) or (ii) the expiry of the relevant Availability Period deemed by Ex-Im Bank to be effective under the Guaranteed Credits; | |
o | Extend the final shipment date to the earlier of: (i) or (ii) the Letter of Credit’s expiry date; | |
o | Permit partial shipment(s); | |
o | Permit transhipments in accordance with the provisions of 46 USC. §1241-1 (Public Resolution No. 17 of the 73rd Congress of the United States, as amended); | |
o | Permit shipment(s) by any airline rather than ocean vessel; we acknowledge that air waybill(s) will be required with respect to such shipment(s) instead of ocean bill(s) of lading; | |
o | Permit a reduction of the Letter of Credit’s face amount; we enclose each beneficiary’s consent to this request; |
B(8)-1
o | Permit “on-deck” shipment(s); | |
o | Permit a change in the address of [Name of Beneficiary], a beneficiary, to the following street address located in the United States: |
. |
o | Permit a change in the address of [Name of Letter of Credit Applicant], a letter of credit applicant, to the following street address located in the United States: |
. |
o | Permit ocean shipment(s); we acknowledge that clean, signed, on-board ocean bill(s) of lading will be required with respect to such shipment(s), and that such bill(s) of lading will evidence shipment(s) on ocean vessel(s) of either (i) U.S. registry or (ii) non-U.S. registry pursuant to a MARAD waiver of the provisions of 46 USC. §1241-1 (Public Resolution No. 17 of the 73rd Congress of the United States, as amended); | |
o | Permit the following language or spelling changes: |
. |
We certify that the requested changes (x) will not constitute or give rise to a material change in the terms and conditions of the Letter of Credit, and (y) are requested in order to: (i) correct a typographical error; (ii) correct an omission; or (iii) clarify otherwise ambiguous language: | ||
o | Permit changes made on account of requirements for the following consularized document(s): |
. |
B(8)-2
We certify that the requested change(s) shall not result in the modification or elimination of a commercial invoice, which we recognize is a necessary document for presentation; | ||
o | Permit acceptance of “stale” documents or documents that are presented or are to be presented later than 21 calendar days from the related shipment date, provided that such documents are dated no earlier than the Initial Eligibility Date set forth in the Agreement.; | |
o | Permit the change of either (i) the originating port or originating airport to a different U.S. port or U.S. airport; or (ii) the port of destination or airport of destination to a different port located in the Borrower’s Country or a different airport located in the Borrower’s Country; | |
o | Permit changes in the number of copies of documents to be presented by a beneficiary, except that such change shall not result in the deletion or modification in the terms of a document required for presentation. |
1 | Describe the facts or circumstances that justify the amendment. |
B(8)-3
By: | (Signature) | |||
Name: | (Print) | |||
Title: | (Print) |
B(8)-4
cc: | Marguerite Gill JPMorgan Chase Bank, N.A., as Lender 1 Chase Manhattan Plaza, 3rd Floor New York, NY 10081 |
1 copy of amended Supply Contract, purchase order or other document evidencing need for amendment
B(8)-5
L/C PROCEDURE | Annex B Exhibit 9 |
811 Vermont Avenue, N.W.
Washington, DC 20571
Subject: | Ex-Im Bank Transaction No. AP082872XX-Singapore Chartered Semiconductor Manufacturing Ltd (the “Borrower”) Certificate Approving Letter of Credit No. _______ |
o | Allow sufficient time for the presentation of all documents and the making of all Letter of Credit disbursements by extending the expiry date to the earlier of: (i) _______________ or (ii) the expiry of the relevant Availability Period deemed by Ex-Im Bank to be effective under the Guaranteed Credits; |
o | Extend the final shipment date to the earlier of: (i) _______________ or (ii) the Letter of Credit’s expiry date; |
o | Permit partial shipment(s); |
o | Permit transhipments in accordance with the provisions of 46 USC. §1241-1 (Public Resolution No. 17 of the 73rd Congress of the United States, as amended); |
B(9)-1
o | Permit shipment(s) by any airline rather than ocean vessel; we acknowledge that air waybill(s) will be required with respect to such shipment(s) instead of ocean bill(s) of lading; |
o | Permit a reduction of the Letter of Credit’s face amount; we enclose each beneficiary’s consent to this request; |
o | Permit “on-deck” shipment(s); |
o | Permit a change in the address of [Name of Beneficiary], a beneficiary, to the following street address located in the United States: |
; |
o | Permit a change in the address of [Name of Letter of Credit Applicant], a letter of credit applicant, to the following street address located in the United States: |
. |
o | Permit ocean shipment(s); we acknowledge that clean, signed, on-board ocean bill(s) of lading will be required with respect to such shipment(s), and that such bill(s) of lading will evidence shipment(s) on ocean vessel(s) of either (i) U.S. registry or (ii) non-U.S. registry pursuant to a MARAD waiver of the provisions of 46 USC. §1241-1 (Public Resolution No. 17 of the 73rd Congress of the United States, as amended); |
o | Permit the following language or spelling changes: |
; |
We certify that the requested changes (x) will not constitute or give rise to a material change in the terms and conditions of the Letter of Credit, and (y) are requested in order to: (i) correct a typographical error; (ii) correct an omission; or, (iii) clarify otherwise ambiguous language; |
B(9)-2
o | Permit changes made on account of requirements for the following consularized document(s): |
. |
We certify that the requested change(s) shall not result in the modification or elimination of a commercial invoice, which we recognize is a necessary document for presentation; |
o | Permit acceptance of “stale” documents or documents that are presented or are to be presented later than 21 calendar days from the related shipment date, provided that such documents are dated no earlier than the Initial Eligibility Date set forth in the Agreement; |
o | Permit the change of either (i) the originating port or originating airport to a different U.S. port or U.S. airport; or (ii) the port of destination or airport of destination to a different port located in the Borrower’s Country or a different airport located in the Borrower’s Country; |
o | Permit changes in the number of copies of documents to be presented by a beneficiary, except that such change shall not result in the deletion or modification in the terms of a document required for presentation. |
B(9)-3
NATIONAL ASSOCIATION,
as Facility Agent
1 copy of the Amended L/C
B(9)-4
811 Vermont Avenue, N.W.
Washington, DC 20571
Attention: | Operations Division |
Subject: | Ex-Im Bank Transaction No. AP082872XX-Singapore Chartered Semiconductor Manufacturing Ltd (“Borrower”) Operations Review Notice No. ________ Disbursement Date: ________________ |
1 | Select appropriate Section reference. | |
2 | Specify any unresolved omissions or deficiencies in the Submitted Documents or non-compliance with any conditions precedent. | |
3 | Specify any non-compliance with any non-documentary conditions precedent to Disbursement actually known to the Responsible Officer. |
C1-1
Very truly yours, JPMORGAN CHASE BANK, NATIONAL ASSOCIATION, as Facility Agent | ||||
By: | ||||
(Signature) | ||||
Name: | ||||
(Print) | ||||
Title: | ||||
(Print) |
Required Documents
cc: | Export-Import Bank of the United States Attention: Asset Management Division (without attachments) |
4 | Choose the appropriate alternative and specify a Default or Event of Default, if applicable. |
C1-2
C1-3
811 Vermont Avenue, N.W.
Washington, DC 20571
Attention: | Asset Management Division |
Subject: | Ex-Im Bank Transaction No. AP082872XX-Singapore Chartered Semiconductor Manufacturing Ltd (“Borrower”) Disbursement Review Notice No. _______ Disbursement Date: ___________ |
1 | Select appropriate section reference. | |
2 | Specify any non-compliance with any conditions precedent. |
C2-1
Very truly yours, JPMORGAN CHASE BANK, NATIONAL ASSOCIATION, as Facility Agent | ||||
By: | ||||
(Signature) | ||||
Name: | ||||
(Print) | ||||
Title: | ||||
(Print) |
Required Documents
3 | Specify any non-compliance with any non-documentary condition precedent to Disbursement actually known to the Responsible Officer. | |
4 | Choose the appropriate alternative and specify a Default or Event of Default, if applicable. |
C2-2
C2-3
811 Vermont Avenue, N.W.
Washington, DC 20571
Attention: | Asset Management Division | ||
Subject: | Ex-Im Bank Transaction No. AP082872XX-Singapore Chartered Semiconductor Manufacturing Ltd (“Borrower”) Utilization Review Notice No. |
(i) | the Borrower has sent all required documents to us in accordance with Section3.03(b) of the Agreement and the Utilization and Disbursement Procedures; and the required documents to be delivered pursuant to Section3.03(b) of the Agreement attached hereto and set forth onSchedule 1 are complete in all respects and comply with the specified requirements and conditions of each L/C Issuance set forth in Section3.03(d) of the Agreement [and with the requirements set forth in Sections [6.01 / 6.02 ] and 6.03 (if the initial Utilization occurs before the initial Disbursement)][other than in the following respects];1 | ||
(ii) | we have delivered the Operations Review Notice to the Operations Division in accordance with Section 3.03(c) of the Agreement; | ||
(iii) | we have not received any written notice nor does the Responsible Officer otherwise have actual knowledge of any termination of or any asserted invalidity |
1 | Specify any unresolved omissions or deficiencies in the required documents or non-compliance with any L/C Issuance Conditions. |
C3-1
of the Agreement, any Guaranteed Note or the Ex-Im Bank Guarantee Agreement; | |||
(iv) | taking into account such information of which the Responsible Officer has actual knowledge, as of the time of issuance of this Utilization Review Notice, in the Facility Agent’s judgment [it is not apparent that a Default or Event of Default has occurred and is continuing] [it is apparent that a Default or Event of Default has occurred and is continuing as follows]; and | ||
(v) | we have not received any written notice nor does the Responsible Officer otherwise have actual knowledge that the Borrower has not paid all fees, expenses and other amounts, if any, then due in connection with the Agreement and the proposed L/C Issuance. |
Very truly yours, JPMORGAN CHASE BANK, NATIONAL ASSOCIATION, as Facility Agent | ||||
By: | ||||
(Signature) | ||||
Name: | ||||
(Print) | ||||
Title: | ||||
(Print) |
Required Documents
C(3)-2
C(3)-3
To: | JPMORGAN CHASE BANK, NATIONAL ASSOCIATION, as Facility Agent | |
From: | [THE EXISTING LENDER] (the “Existing Lender”) and [THE NEW LENDER] (the “New Lender”) | |
Date: | [ ] |
By: | ||||
Name: Title: |
By: | ||||
Name: Title: |
D-1
with Chartered Semiconductor Manufacturing Ltd, as Borrower
Date of this Lender Transfer Agreement: | |||
Legal Name of Transferor: | |||
Legal Name of Transferee: | |||
Transferee’s Address for Notices: | |||
Effective Date of Assignment (“Assignment Date”): | |||
Portion Held By Transferor | Percentage thereof | |||||||
Immediately Prior to | Transferred by the | |||||||
Facility Description | Assignment | Transferor to the Transferee | ||||||
D-2
811 Vermont Avenue, N.W.
Washington, DC 20571
Attention: Operations Division
Subject: | Ex-Im Bank Transaction No. AP082872XX-Singapore Chartered Semiconductor Manufacturing Ltd (the “Borrower”) Anti-Lobbying Certificate |
The undersigned certifies, to the best of his or her knowledge and belief, that: | ||
(a) | No Federal appropriated funds have been paid or will be paid, by or on behalf of the undersigned, to any person for influencing or attempting to influence an officer or employee of any agency, a Member of Congress, an officer or employee of Congress, or an employee of a Member of Congress in connection with the awarding of any Federal contract, the making of any Federal grant, the making of any Federal loan, the entering into of any cooperative agreement and the extension, continuation, renewal, amendment or modification of any Federal contract, grant, loan or cooperative agreement. | |
(b) | If any funds other than Federal appropriated funds have been paid or will be paid to any person for influencing or attempting to influence an officer or employee of any agency, a Member of Congress, an officer or employee of Congress or an employee of a Member of Congress in connection with this Federal contract, grant, loan or cooperative agreement, the undersigned shall complete and submit Standard Form-LLL, “Disclosure Form to Report Lobbying”, in accordance with its instructions. | |
(c) | The undersigned shall require that the language of this certification be included in the award documents for all subawards at all tiers (including subcontracts, subgrants, and contracts under grants, loans and cooperative agreements) and that all subrecipients shall certify and disclose accordingly. |
E-1
[TO BE EXECUTED BY EACH LENDER AND THE FACILITY AGENT] | ||||
By: | 1 | |||
Name: | ||||
Title: | ||||
1 | This certificate must be signed by an authorized officer(s) of the Lender / Facility Agent. Execution of this certificate constitutes a representation that the signer(s) are fully authorized to do so on behalf of the Lender / Facility Agent. Any person who makes a false representation to Ex-Im Bank may be subject to fine and/or imprisonment pursuant to 18 USC.§1001. The Lender / Facility Agent agrees that, upon request, it will provide Ex-Im Bank with evidence of authority with respect to the person(s) signing this certificate. |
E-2
JPMorgan Chase Bank, N.A.,
as Facility Agent
4 Chase MetroTech Center, 10th Floor
Brooklyn, NY 11245
Attention: Gamal Boulos, Maria Adamczyk, Laura Tamuccio
Subject: | Ex-Im Bank Transaction No. AP082872XX-Singapore Chartered Semiconductor Manufacturing Ltd (the “Borrower”) |
[ ], as L/C Bank | ||||
By: | ||||
Name: | ||||
Title: | ||||
cc: | Marguerite Gill JPMorgan Chase Bank, N.A., as Lender 1 Chase Manhattan Plaza, 3rd Floor New York, NY 10081 |
F1-1
Subject: | Ex-Im Bank Transaction No. AP082872XX-Singapore Chartered Semiconductor Manufacturing Ltd (the “Borrower”) |
JP MORGAN CHASE BANK, NATIONAL ASSOCIATION, as Facility Agent | ||||
By: | ||||
Name: | ||||
Title: | ||||
F2-1
Chartered Semiconductor Manufacturing Ltd | ||
60 Woodlands Industrial Park D | ||
Street 2 | ||
Singapore 738406 | ||
Attention: | George Thomas, Chief Financial Officer | |
Fax: | +65-6362-2909 | |
Telephone: | +65-6360-4350 |
JPMorgan Chase Bank, N.A.,
as Lender and as Facility Agent
4 Chase MetroTech Center, 10th Floor
Brooklyn, NY 11245
Attention: Gamal Boulos, Maria Adamczyk, Laura Tamuccio
1 Chase Manhattan Plaza, 9th Floor
New York, NY 10081
Attention: Marguerite Gill
Subject: | Ex-Im Bank Transaction No. AP082872XX-Singapore Chartered Semiconductor Manufacturing Ltd (the “Borrower”) |
Annex G-1
EXPORT-IMPORT BANK OF THE UNITED STATES | ||||||||
By: | ||||||||
Name | ||||||||
(Print) | ||||||||
Title | ||||||||
(Print) |
Annex G-2
Long Term Credit / Guarantee — Acquisition List
Exporter’s Name: | ||||
U.S. Street Address: | ||||
Telephone Number: | ||||
Fax Number: | ||||
Eqpt | ||||||||||||||||||
Shipdate | ||||||||||||||||||
(Rev | EST Eqpt | |||||||||||||||||
Eqpt ID | Module | Vendor | Currency | Eqpt Model | Main Process | 12D) | Budget | Remark | ||||||||||
FLTO703 | THIN FILM — CVD | AMAT | USD | PRODUCER SE | LOW TEMP OXIDE | 21-Mar-07 | $ | 2,650,000 | Phase 2 | |||||||||
FNBK704 | THIN FILM — CVD | AMAT | USD | PRODUCER SE | N BLOK | 26-Jan-07 | $ | 3,670,000 | Phase 2 | |||||||||
MSEM713 | METRO | AMAT | USD | VERITY | CD SEM | 25-Apr-07 | $ | 1,275,000 | Phase 2 | |||||||||
MSEM714 | METRO | AMAT | USD | VERITY | CD SEM | 08-Jun-07 | $ | 1,275,000 | Phase 2 | |||||||||
FALD703 | THIN FILM — PVD | AMAT | USD | ENDURA 2 | ALCU | 24-Jul-07 | $ | 5,820,000 | Phase 2 | |||||||||
PCUD772 | CMP | AMAT | USD | REFLEXION LK (COUNTOUR HEAD) | CU CMP | 25-Jan-08 | $ | 5,380,000 | Phase 2 | |||||||||
MSEM715 | METRO | AMAT | USD | VERITY | CD SEM | 24-Jan-08 | $ | 1,275,000 | Phase 2 | |||||||||
FLTO704 | THIN FILM — CVD | AMAT | USD | PRODUCER SE | LOW TEMP OXIDE | 20-Oct-07 | $ | 2,650,000 | Phase 2 | |||||||||
FLWK705 | THIN FILM — CVD | AMAT | USD | PRODUCER SE | LOW K | 20-Oct-07 | $ | 3,670,000 | Phase 2 | |||||||||
PCUD716 | CMP | AMAT | USD | REFLEXION LK | CU CMP | 12-Jan-08 | $ | 3,900,000 | Phase 2 | |||||||||
POXI703 | CMP | AMAT | USD | REFLEXION LK | OXIDE CMP | 28-Apr-07 | $ | 3,720,000 | Phase 2 | |||||||||
MSEM716 | METRO | AMAT | USD | VERITY | CD SEM | 23-Feb-08 | $ | 1,325,000 | Phase 2 | |||||||||
FNBK705 | THIN FILM — CVD | AMAT | USD | PRODUCER SE | N BLOK | 20-Oct-07 | $ | 3,670,000 | Phase 2 | |||||||||
FTEO707 | THIN FILM — CVD | AMAT | USD | PRODUCER SE | FTEOS/TEOS | 13-Apr-08 | $ | 3,440,000 | Phase 2 | |||||||||
PCUD717 | CMP | AMAT | USD | REFLEXION LK | CU CMP | 12-Feb-08 | $ | 3,900,000 | Phase 2 | |||||||||
DRTG708 | DIFFUSION | AMAT | USD | CENTURA RADIANCE/DPN | RTNO-GATE/RTO/DPN/ISSG | 03-Dec-07 | $ | 4,370,000 | Phase 2 | |||||||||
PSTI703 | CMP | AMAT | USD | REFLEXION FA | STI CMP | 15-Feb-07 | $ | 4,300,000 | Phase 2 |
Annex H-page 3
Eqpt | ||||||||||||||||||
Shipdate | ||||||||||||||||||
(Rev | EST Eqpt | |||||||||||||||||
Eqpt ID | Module | Vendor | Currency | Eqpt Model | Main Process | 12D) | Budget | Remark | ||||||||||
DRTN703 | DIFFUSION | AMAT | USD | CENTURA SINGEN PLUS | BTBAS/SINGEN | 23-Jun-08 | $ | 4,300,000 | Phase 2 | |||||||||
FTEO706 | THIN FILM — CVD | AMAT | USD | PRODUCER SE | FTEOS/TEOS | Arrived | $ | 3,440,000 | Phase 2 | |||||||||
MSEM711 | METRO | AMAT | USD | VERITY | CD SEM | Arrived | $ | 1,275,000 | Phase 2 | |||||||||
MSEM712 | METRO | AMAT | USD | VERITY | CD SEM | Arrived | $ | 1,275,000 | Phase 2 | |||||||||
PCUD713 | CMP | AMAT | USD | REFLEXION LK | CU CMP | Arrived | $ | 3,900,000 | Phase 2 | |||||||||
PCUD718 | CMP | AMAT | USD | REFLEXION LK | CU CMP | Not Req | $ | 3,900,000 | Phase 2 | |||||||||
FTEO708 | THIN FILM — CVD | AMAT | USD | PRODUCER SE | FTEOS/TEOS | 14-Nov-08 | $ | 3,440,000 | Phase 2 | |||||||||
FCOD702 | THIN FILM — PVD | AMAT | USD | ENDURA 2 | CO DEP | Arrived | $ | 5,420,000 | Phase 2 | |||||||||
FTBM761 | THIN FILM — PVD | AMAT | USD | ENDURA 2 (Ni) | NIPT DEP & CA LINER | Arrived | $ | 5,620,000 | Phase 2 | |||||||||
DRTA705 | DIFFUSION | AMAT | USD | VANTAGE RADIANCE PLUS | RTA/SPIKE ANNEAL (ATM) | Arrived | $ | 2,290,000 | Phase 2 | |||||||||
DRTA706 | DIFFUSION | AMAT | USD | VANTAGE RADIANCE PLUS | RTA/SPIKE ANNEAL (ATM) | 05-Jun-08 | $ | 2,500,000 | Phase 2 | |||||||||
FCUD763 | THIN FILM — PVD | AMAT | USD | ENCORE | CU BARRIER SEED | 03-Nov-08 | $ | 5,300,000 | Phase 2 | |||||||||
FCUD764 | THIN FILM — PVD | AMAT | USD | ENCORE | CU BARRIER SEED | 03-Feb-09 | $ | 5,300,000 | Phase 2 | |||||||||
PCUD773 | CMP | AMAT | USD | REFLEXION LK (COUNTOUR HEAD) | CU CMP | 26-Oct-08 | $ | 5,380,000 | Phase 2 | |||||||||
PCUD774 | CMP | AMAT | USD | REFLEXION LK (COUNTOUR HEAD) | CU CMP | 24-Jan-09 | $ | 5,380,000 | Phase 2 | |||||||||
PCUD775 | CMP | AMAT | USD | REFLEXION LK (COUNTOUR HEAD) | CU CMP | 23-Feb-09 | $ | 5,380,000 | Phase 2 | |||||||||
PCUD776 | CMP | AMAT | USD | REFLEXION LK (COUNTOUR HEAD) | CU CMP | 25-Apr-09 | $ | 5,380,000 | Phase 2 | |||||||||
FTEO709 | THIN FILM — CVD | AMAT | USD | PRODUCER SE | FTEOS/TEOS | 14-Mar-09 | $ | 3,620,000 | Phase 2 | |||||||||
FPSG702 | THIN FILM — CVD | AMAT | USD | PRODUCER SE | PEPSG | 28-Dec-08 | $ | 3,900,000 | Phase 2 | |||||||||
FOTC703 | THIN FILM — CVD | AMAT | USD | PRODUCER SE | OZONE TEOS OXIDE/CLN | 30-Aug-08 | $ | 4,765,000 | Phase 2 | |||||||||
FOTC704 | THIN FILM — CVD | AMAT | USD | PRODUCER SE | OZONE TEOS OXIDE/CLN | 28-Dec-08 | $ | 4,765,000 | Phase 2 | |||||||||
FSAC763 | THIN FILM — CVD | AMAT | USD | PRODUCER SE | SACVD (480C) | 10-Sep-08 | $ | 4,650,000 | Phase 2 | |||||||||
FNBK706 | THIN FILM — CVD | AMAT | USD | PRODUCER SE | N BLOK | 28-Oct-08 | $ | 3,850,000 | Phase 2 | |||||||||
FNBK707 | THIN FILM — CVD | AMAT | USD | PRODUCER SE | N BLOK | 25-Feb-09 | $ | 3,850,000 | Phase 2 | |||||||||
FLWK706 | THIN FILM — CVD | AMAT | USD | PRODUCER SE | LOW K | 29-Sep-08 | $ | 3,850,000 | Phase 2 | |||||||||
FLWK707 | THIN FILM — CVD | AMAT | USD | PRODUCER SE | LOW K | 02-Jan-09 | $ | 3,850,000 | Phase 2 | |||||||||
FLWK708 | THIN FILM — CVD | AMAT | USD | PRODUCER SE | LOW K | 27-Feb-09 | $ | 3,850,000 | Phase 2 | |||||||||
FLWK772 | THIN FILM — CVD | AMAT | USD | PRODUCER ULK | BD + UV | 13-Dec-08 | $ | 4,000,000 | Phase 2 | |||||||||
FESL702 | THIN FILM — CVD | AMAT | USD | PRODUCER SE | ESL SiN | 31-Aug-08 | $ | 3,900,000 | Phase 2 |
Annex H-page 4
Eqpt | ||||||||||||||||||
Shipdate | ||||||||||||||||||
(Rev | EST Eqpt | |||||||||||||||||
Eqpt ID | Module | Vendor | Currency | Eqpt Model | Main Process | 12D) | Budget | Remark | ||||||||||
FESL703 | THIN FILM — CVD | AMAT | USD | PRODUCER SE | ESL SiN | 29-Jan-09 | $ | 3,900,000 | Phase 2 | |||||||||
FLTO705 | THIN FILM — CVD | AMAT | USD | PRODUCER SE | LOW TEMP OXIDE | 04-Dec-08 | $ | 2,650,000 | Phase 2 | |||||||||
FSTI772 | THIN FILM — CVD | AMAT | USD | PRODUCER HARP | STI GAPFILL | 02-Nov-08 | $ | 4,300,000 | Phase 2 | |||||||||
FALD704 | THIN FILM — PVD | AMAT | USD | ENDURA 2 | ALCU | 22-Dec-08 | $ | 6,000,000 | Phase 2 | |||||||||
FTBM762 | THIN FILM — PVD | AMAT | USD | ENDURA 2 (Ni) | NIPT DEP & CA LINER | 29-Sep-08 | $ | 5,740,000 | Phase 2 | |||||||||
DRTA707 | DIFFUSION | AMAT | USD | VANTAGE RADIANCE PLUS | RTA/SPIKE ANNEAL (ATM) | 03-Nov-08 | $ | 2,500,000 | Phase 2 | |||||||||
DRTS705 | DIFFUSION | AMAT | USD | VANTAGE RADIANCE PLUS | NICKEL SILIDE RTA | 11-Oct-08 | $ | 2,400,000 | Phase 2 | |||||||||
DRTG709 | DIFFUSION | AMAT | USD | CENTURA RADIANCE/DPN | RTNO-GATE/RTO/DPN/ISSG | 01-Sep-08 | $ | 4,700,000 | Phase 2 | |||||||||
MSEM717 | METRO | AMAT | USD | VERITY | CD SEM | 11-Aug-08 | $ | 1,325,000 | Phase 2 | |||||||||
MSEM718 | METRO | AMAT | USD | VERITY | CD SEM | 25-Aug-08 | $ | 1,325,000 | Phase 2 | |||||||||
MSEM719 | METRO | AMAT | USD | VERITY | CD SEM | 23-Oct-08 | $ | 1,325,000 | Phase 2 | |||||||||
MSEM720 | METRO | AMAT | USD | VERITY | CD SEM | 23-Nov-08 | $ | 1,325,000 | Phase 2 | |||||||||
MSEM721 | METRO | AMAT | USD | VERITY | CD SEM | 23-Dec-08 | $ | 1,325,000 | Phase 2 | |||||||||
MSEM722 | METRO | AMAT | USD | VERITY | CD SEM | 22-Feb-09 | $ | 1,325,000 | Phase 2 | |||||||||
PCUD777 | CMP | AMAT | USD | REFLEXION LK (COUNTOUR HEAD) | CU CMP | 26-May-09 | $ | 5,380,000 | Phase 2 | |||||||||
POXI704 | CMP | AMAT | USD | REFLEXION LK | OXIDE CMP | 22-Dec-08 | $ | 3,900,000 | Phase 2 | |||||||||
PSTI772 | CMP | AMAT | USD | REFLEXION FA (COUNTOUR HEAD) | STI CMP | 01-May-09 | $ | 4,900,000 | Phase 2 | |||||||||
FTEO710 | THIN FILM — CVD | AMAT | USD | PRODUCER SE | FTEOS/TEOS | 14-Jun-09 | $ | 3,620,000 | Phase 2 | |||||||||
FOTC705 | THIN FILM — CVD | AMAT | USD | PRODUCER SE | OZONE TEOS OXIDE/CLN | 30-Apr-09 | $ | 4,765,000 | Phase 2 | |||||||||
FLWK709 | THIN FILM — CVD | AMAT | USD | PRODUCER SE | LOW K | 15-Jun-09 | $ | 3,850,000 | Phase 2 | |||||||||
FLWK773 | THIN FILM — CVD | AMAT | USD | PRODUCER ULK | BD + UV | 15-May-09 | $ | 4,000,000 | Phase 2 | |||||||||
FLTO706 | THIN FILM — CVD | AMAT | USD | PRODUCER SE | LOW TEMP OXIDE | 06-May-09 | $ | 2,650,000 | Phase 2 | |||||||||
FNBM702 | THIN FILM — CVD | AMAT | USD | ENDURA 2 | NiPt Dep Ca Liner | 01-Mar-09 | $ | 6,000,000 | Phase 2 | |||||||||
DRTN704 | DIFFUSION | AMAT | USD | CENTURA SINGEN PLUS | BTBAS/SINGEN | 21-Jan-09 | $ | 4,300,000 | Phase 2 | |||||||||
DRTG710 | DIFFUSION | AMAT | USD | CENTURA RADIANCE/DPN | RTNO-GATE/RTO/DPN/ISSG | 02-Dec-08 | $ | 4,700,000 | Phase 2 | |||||||||
MSEM723 | METRO | AMAT | USD | VERITY | CD SEM | 26-Mar-09 | $ | 1,325,000 | Phase 2 | |||||||||
MSEM771 | METRO | AMAT | USD | VERITY | CD SEM | Arrived | $ | 1,600,000 | Phase 2 | |||||||||
AMAT Total | $ | 265,750,000 | ||||||||||||||||
DEPI703 | DIFFUSION | ASM | USD | EPSILON 3200 | EPI REACTOR | 16-Mar-07 | $ | 2,005,697 | Phase 2 | |||||||||
DEPI704 | DIFFUSION | ASM | USD | EPSILON 3200 | EPI REACTOR | 16-Mar-07 | $ | 2,005,697 | Phase 2 | |||||||||
DEPI705 | DIFFUSION | ASM | USD | EPSILON 3200 | EPI REACTOR | 15-Jun-07 | $ | 2,005,697 | Phase 2 | |||||||||
DEPI706 | DIFFUSION | ASM | USD | EPSILON 3200 | EPI REACTOR | 01-Dec-07 | $ | 1,860,000 | Phase 2 | |||||||||
DEPI702 | DIFFUSION | ASM | USD | EPSILON 3200 | EPI REACTOR | Arrived | $ | 1,855,697 | Phase 2 |
Annex H-page 5
Eqpt | ||||||||||||||||||
Shipdate | ||||||||||||||||||
(Rev | EST Eqpt | |||||||||||||||||
Eqpt ID | Module | Vendor | Currency | Eqpt Model | Main Process | 12D) | Budget | Remark | ||||||||||
DEPI707 | DIFFUSION | ASM | USD | EPSILON 3200 | EPI REACTOR | 02-Jun-08 | $ | 2,100,000 | Phase 2 | |||||||||
DEPI708 | DIFFUSION | ASM | USD | EPSILON 3200 | EPI REACTOR | 31-Jul-08 | $ | 2,100,000 | Phase 2 | |||||||||
DEPI709 | DIFFUSION | ASM | USD | EPSILON 3200 | EPI REACTOR | 31-Aug-08 | $ | 2,100,000 | Phase 2 | |||||||||
DEPI710 | DIFFUSION | ASM | USD | EPSILON 3200 | EPI REACTOR | 30-Sep-08 | $ | 2,100,000 | Phase 2 | |||||||||
DEPI711 | DIFFUSION | ASM | USD | EPSILON 3200 | EPI REACTOR | 31-Oct-08 | $ | 2,100,000 | Phase 2 | |||||||||
DEPI712 | DIFFUSION | ASM | USD | EPSILON 3200 | EPI REACTOR | 31-Dec-08 | $ | 2,100,000 | Phase 2 | |||||||||
DEPI713 | DIFFUSION | ASM | USD | EPSILON 3200 | EPI REACTOR | 31-Jan-09 | $ | 2,100,000 | Phase 2 | |||||||||
ASM Total | $ | 24,432,788 | ||||||||||||||||
CARS707 | CLEAN TECH | FSI | USD | ANTARES | AEROSOL CLEAN | 21-Apr-08 | $ | 1,615,000 | Phase 2 | |||||||||
CARS708 | CLEAN TECH | FSI | USD | ANTARES | AEROSOL CLEAN | 19-Dec-08 | $ | 1,615,000 | Phase 2 | |||||||||
CARS709 | CLEAN TECH | FSI | USD | ANTARES | AEROSOL CLEAN | 18-Feb-09 | $ | 1,850,000 | Phase 2 | |||||||||
FSI Total | $ | 5,080,000 | ||||||||||||||||
LOVL708 | LITHO | KT | USD | ARCHER 10 | OVERLAY | Arrived | $ | 1,125,000 | Phase 2 | |||||||||
DMET702 | DIFFUSION | KT | USD | Metrix | Precision Gate Measurement | 16-May-07 | $ | 2,500,000 | Phase 2 | |||||||||
LOVL709 | LITHO | KT | USD | ARCHER 10 | OVERLAY | 22-Mar-07 | $ | 1,125,000 | Phase 2 | |||||||||
MFLM712 | METRO | KT | USD | F5X | OXIDE THICKNESS | 23-Apr-07 | $ | 850,000 | Phase 2 | |||||||||
LMAC705 | LITHO | KT | USD | VIPER | MACRO INSPECTION | Arrived | $ | 1,200,000 | Phase 2 | |||||||||
YBFI706 | YDD | KT | USD | 2367 | BRIGHTFIELD | 11-Mar-08 | $ | 6,600,000 | Phase 2 | |||||||||
LOVL710 | LITHO | KT | USD | ARCHER 10 | OVERLAY | 13-Jan-08 | $ | 1,125,000 | Phase 2 | |||||||||
MFLM713 | METRO | KT | USD | F5X | OXIDE THICKNESS | 23-Mar-08 | $ | 850,000 | Phase 2 | |||||||||
LMAC704 | LITHO | KT | USD | VIPER | MACRO INSPECTION | Arrived | $ | 1,200,000 | Phase 2 | |||||||||
YBFI704 | YDD | KT | USD | 2367 | BRIGHTFIELD | Arrived | $ | 2,500,000 | Phase 2 | |||||||||
YBFI707 | YDD | KT | USD | 2367 | BRIGHTFIELD | 11-Oct-08 | $ | 6,600,000 | Phase 2 | |||||||||
LMAC706 | LITHO | KT | USD | VIPER | MACRO INSPECTION | 29-Jul-08 | $ | 1,200,000 | Phase 2 | |||||||||
MFLM714 | METRO | KT | USD | F5X | OXIDE THICKNESS | 23-Aug-08 | $ | 1,700,000 | Phase 2 | |||||||||
MFLM715 | METRO | KT | USD | F5X | OXIDE THICKNESS | 23-Sep-08 | $ | 1,700,000 | Phase 2 | |||||||||
MFLM716 | METRO | KT | USD | F5X | OXIDE THICKNESS | 21-Oct-08 | $ | 1,700,000 | Phase 2 | |||||||||
MFLM717 | METRO | KT | USD | F5X | OXIDE THICKNESS | 21-Nov-08 | $ | 1,700,000 | Phase 2 | |||||||||
MFLM718 | METRO | KT | USD | F5X | OXIDE THICKNESS | 07-Jan-09 | $ | 1,700,000 | Phase 2 | |||||||||
MFLM719 | METRO | KT | USD | F5X | OXIDE THICKNESS | 21-Jan-09 | $ | 1,700,000 | Phase 2 | |||||||||
MFLM720 | METRO | KT | USD | F5X | OXIDE THICKNESS | 20-Feb-09 | $ | 1,700,000 | Phase 2 | |||||||||
DQTX702 | DIFFUSION | KT | USD | QUANTOX | Surface Charge | 28-Aug-08 | $ | 1,300,000 | Phase 2 | |||||||||
DQTX703 | DIFFUSION | KT | USD | QUANTOX | Surface Charge | 28-Sep-08 | $ | 1,300,000 | Phase 2 | |||||||||
LMAC707 | LITHO | KT | USD | VIPER | MACRO INSPECTION | 26-Nov-08 | $ | 1,300,000 | Phase 2 | |||||||||
LRCP705 | LITHO | KT | USD | SLF27 | RETICLE INSPECTION | 12-Aug-08 | $ | 9,500,000 | Phase 2 | |||||||||
LRCP706 | LITHO | KT | USD | SLF27 | RETICLE INSPECTION | 26-Aug-08 | $ | 9,500,000 | Phase 2 | |||||||||
LRCP707 | LITHO | KT | USD | SLF27 | RETICLE INSPECTION | 24-Oct-08 | $ | 9,500,000 | Phase 2 | |||||||||
YDLS705 | YDD | KT | USD | SP1 | PROCESS DEFECT MONITOR | 29-Aug-08 | $ | 1,500,000 | Phase 2 | |||||||||
YDLS706 | YDD | KT | USD | SP1 | PROCESS DEFECT MONITOR | 27-Jan-09 | $ | 1,500,000 | Phase 2 |
Annex H-page 6
Eqpt | ||||||||||||||||||
Shipdate | ||||||||||||||||||
(Rev | EST Eqpt | |||||||||||||||||
Eqpt ID | Module | Vendor | Currency | Eqpt Model | Main Process | 12D) | Budget | Remark | ||||||||||
YBFI708 | YDD | KT | USD | 2367 | BRIGHTFIELD | 11-Mar-09 | $ | 7,000,000 | Phase 2 | |||||||||
YDFI753 | YDD | KT | USD | PUMA | DARK FIELD | 27-Jul-08 | $ | 4,300,000 | Phase 2 | |||||||||
YDFI754 | YDD | KT | USD | PUMA | DARK FIELD | 10-Aug-08 | $ | 4,300,000 | Phase 2 | |||||||||
YDFI755 | YDD | KT | USD | PUMA | DARK FIELD | 27-Aug-08 | $ | 4,300,000 | Phase 2 | |||||||||
YDFI756 | YDD | KT | USD | PUMA | DARK FIELD | 10-Sep-08 | $ | 4,300,000 | Phase 2 | |||||||||
YDFI757 | YDD | KT | USD | PUMA | DARK FIELD | 24-Sep-08 | $ | 4,300,000 | Phase 2 | |||||||||
YDFI758 | YDD | KT | USD | PUMA | DARK FIELD | 08-Oct-08 | $ | 4,300,000 | Phase 2 | |||||||||
YDFI759 | YDD | KT | USD | PUMA | DARK FIELD | 08-Nov-08 | $ | 4,300,000 | Phase 2 | |||||||||
LOVL711 | LITHO | KT | USD | ARCHER 10 | OVERLAY | 13-Oct-08 | $ | 1,300,000 | Phase 2 | |||||||||
MFLM721 | METRO | KT | USD | F5X | OXIDE THICKNESS | 23-Mar-09 | $ | 1,700,000 | Phase 2 | |||||||||
LOVL712 | LITHO | KT | USD | ARCHER 10 | OVERLAY | 12-Feb-09 | $ | 1,300,000 | Phase 2 | |||||||||
LRCP708 | LITHO | KT | USD | SLF27 | RETICLE INSPECTION | 26-Mar-09 | $ | 9,500,000 | Phase 2 | |||||||||
KT Total | $ | 125,075,000 | ||||||||||||||||
EPOL709 | ETCH | LAM | USD | KIYO | STI/POLY/SPCR ETCH | 01-Mar-07 | $ | 5,900,000 | Phase 2 | |||||||||
EMTL704 | ETCH | LAM | USD | 2300 VERSYS | METAL ETCHER | 08-Aug-07 | $ | 3,500,000 | Phase 2 | |||||||||
EOXP716 | ETCH | LAM | USD | EXELAN | SICOH Via/PAD ETCH | 15-May-07 | $ | 4,850,000 | Phase 2 | |||||||||
EOXP717 | ETCH | LAM | USD | EXELAN | SICOH Via/PAD ETCH | 28-Jun-07 | $ | 4,850,000 | Phase 2 | |||||||||
EOXP718 | ETCH | LAM | USD | EXELAN | SICOH Via/PAD ETCH | 29-Jul-07 | $ | 4,850,000 | Phase 2 | |||||||||
EOXP719 | ETCH | LAM | USD | EXELAN | SICOH Via/PAD ETCH | 28-Aug-07 | $ | 4,850,000 | Phase 2 | |||||||||
EPOL710 | ETCH | LAM | USD | KIYO | STI/POLY/SPCR ETCH | 03-Jun-07 | $ | 5,900,000 | Phase 2 | |||||||||
EOXP772 | ETCH | LAM | USD | FLEX45 | SICOH Via/PAD ETCH | 28-Sep-07 | $ | 6,200,000 | Phase 2 | |||||||||
EOXP720 | ETCH | LAM | USD | EXELAN | SICOH Via/PAD ETCH | 28-Mar-08 | $ | 4,850,000 | Phase 2 | |||||||||
EOXP773 | ETCH | LAM | USD | FLEX45 | SICOH Via/PAD ETCH | 28-Apr-08 | $ | 6,200,000 | Phase 2 | |||||||||
EMTL703 | ETCH | LAM | USD | 2300 VERSYS | METAL ETCHER | Arrived | $ | 3,500,000 | Phase 2 | |||||||||
EPOL708 | ETCH | LAM | USD | KIYO | STI/POLY/SPCR ETCH | Arrived | $ | 5,900,000 | Phase 2 | |||||||||
EPOL711 | ETCH | LAM | USD | KIYO | STI/POLY/SPCR ETCH | 04-Jul-08 | $ | 5,900,000 | Phase 2 | |||||||||
EOXP721 | ETCH | LAM | USD | EXELAN | SICOH Via/PAD ETCH | 29-Oct-08 | $ | 4,850,000 | Phase 2 | |||||||||
EOXP722 | ETCH | LAM | USD | EXELAN | SICOH Via/PAD ETCH | 26-Nov-08 | $ | 4,850,000 | Phase 2 | |||||||||
EPOL712 | ETCH | LAM | USD | KIYO | STI/POLY/SPCR ETCH | 02-Oct-08 | $ | 6,200,000 | Phase 2 | |||||||||
EPOL772 | ETCH | LAM | USD | KIYO45 | STI/POLY ETCH | 02-Nov-08 | $ | 6,700,000 | Phase 2 | |||||||||
EPOL713 | ETCH | LAM | USD | KIYO | STI/POLY/SPCR ETCH | 18-Nov-08 | $ | 6,200,000 | Phase 2 | |||||||||
EPOL714 | ETCH | LAM | USD | KIYO | STI/POLY/SPCR ETCH | 02-Dec-08 | $ | 6,200,000 | Phase 2 | |||||||||
EOXP774 | ETCH | LAM | USD | FLEX45 | SICOH Via/PAD ETCH | 28-Sep-08 | $ | 6,200,000 | Phase 2 | |||||||||
EOXP775 | ETCH | LAM | USD | FLEX45 | SICOH Via/PAD ETCH | 27-Dec-08 | $ | 6,200,000 | Phase 2 | |||||||||
EOXP776 | ETCH | LAM | USD | FLEX45 | SICOH Via/PAD ETCH | 26-Jan-09 | $ | 6,200,000 | Phase 2 | |||||||||
EOXP777 | ETCH | LAM | USD | FLEX45 | SICOH Via/PAD ETCH | 26-Feb-09 | $ | 6,200,000 | Phase 2 | |||||||||
EMTL705 | ETCH | LAM | USD | 2300 VERSYS | METAL ETCHER | 08-Nov-08 | $ | 3,800,000 | Phase 2 | |||||||||
EOXP778 | ETCH | LAM | USD | FLEX45 | SICOH Via/PAD ETCH | 28-Apr-09 | $ | 6,200,000 | Phase 2 | |||||||||
EOXP779 | ETCH | LAM | USD | FLEX45 | SICOH Via/PAD ETCH | 29-May-09 | $ | 6,200,000 | Phase 2 | |||||||||
EMTL706 | ETCH | LAM | USD | 2300 VERSYS | METAL ETCHER | 08-Jun-09 | $ | 3,800,000 | Phase 2 | |||||||||
LAM Total | $ | 147,050,000 |
Annex H-page 7
Eqpt | ||||||||||||||||||
Shipdate | ||||||||||||||||||
(Rev | EST Eqpt | |||||||||||||||||
Eqpt ID | Module | Vendor | Currency | Eqpt Model | Main Process | 12D) | Budget | Remark | ||||||||||
LLSR702 | LITHO | LUMONICS | USD | SIGMA CLEAN 300 | LASER MARK | 11-Aug-07 | $ | 700,000 | Phase 2 | |||||||||
LUMONICS Total | $ | 700,000 | ||||||||||||||||
FSIN762 | THIN FILM — CVD | NOVELLUS | USD | VECTOR | TENSILE STRESS (CA) | 13-Jun-07 | $ | 1,598,000 | Phase 2 | |||||||||
FPVN702 | THIN FILM — CVD | NOVELLUS | USD | VECTOR | PSVN SiN/SiO2 | 14-Oct-07 | $ | 1,598,000 | Phase 2 | |||||||||
FPVN706 | THIN FILM — CVD | NOVELLUS | USD | VECTOR | PSVN SiN/SiO2 | 14-Aug-08 | $ | 1,900,000 | Phase 2 | |||||||||
FECP707 | THIN FILM — PVD | NOVELLUS | USD | SABRE XT | CU ECP | Arrived | $ | 3,478,000 | Phase 2 | |||||||||
FSTI703 | THIN FILM — CVD | NOVELLUS | USD | SPEED | HDP STI | Arrived | $ | 3,948,000 | Phase 2 | |||||||||
FSTI704 | THIN FILM — CVD | NOVELLUS | USD | SPEED | HDP STI | Not Req | $ | 3,948,000 | Phase 2 | |||||||||
FCUD703 | THIN FILM — PVD | NOVELLUS | USD | INOVA | CU BARRIER SEED | Arrived | $ | 752,000 | Phase 2 | |||||||||
FCUD706 | THIN FILM — PVD | NOVELLUS | USD | INOVA | CU BARRIER SEED | Arrived | $ | 752,000 | Phase 2 | |||||||||
FPVN707 | THIN FILM — CVD | NOVELLUS | USD | VECTOR | PSVN SiN/SiO2 | 14-Nov-08 | $ | 1,900,000 | Phase 2 | |||||||||
FPVN708 | THIN FILM — CVD | NOVELLUS | USD | VECTOR | PSVN SiN/SiO2 | 11-Feb-09 | $ | 1,900,000 | Phase 2 | |||||||||
FPVN709 | THIN FILM — CVD | NOVELLUS | USD | VECTOR | PSVN SiN/SiO2 | 13-Apr-09 | $ | 1,900,000 | Phase 2 | |||||||||
FSIN763 | THIN FILM — CVD | NOVELLUS | USD | VECTOR | TENSILE STRESS (CA) | 11-Nov-08 | $ | 2,000,000 | Phase 2 | |||||||||
FILD702 | THIN FILM — CVD | NOVELLUS | USD | SPEED | HDP SiN | 17-Sep-08 | $ | 4,500,000 | Phase 2 | |||||||||
FECP710 | THIN FILM — PVD | NOVELLUS | USD | SABRE XT | CU ECP | 06-Oct-08 | $ | 3,700,000 | Phase 2 | |||||||||
FECP711 | THIN FILM — PVD | NOVELLUS | USD | SABRE XT | CU ECP | 04-Dec-08 | $ | 3,700,000 | Phase 2 | |||||||||
FECP712 | THIN FILM — PVD | NOVELLUS | USD | SABRE XT | CU ECP | 05-Mar-09 | $ | 3,700,000 | Phase 2 | |||||||||
FPVN710 | THIN FILM — CVD | NOVELLUS | USD | VECTOR | PSVN SiN/SiO2 | 14-Jun-09 | $ | 1,900,000 | Phase 2 | |||||||||
FSIN764 | THIN FILM — CVD | NOVELLUS | USD | VECTOR | TENSILE STRESS (CA) | 13-Apr-09 | $ | 2,000,000 | Phase 2 | |||||||||
NOVELLUS Total | $ | 45,174,000 | ||||||||||||||||
PMAC703 | CMP | RUDOLPH | USD | AXI | MACRO INSPECTION | 21-Jan-07 | $ | 750,000 | Phase 2 | |||||||||
PMAC701 | CMP | RUDOLPH | USD | AXI | MACRO INSPECTION | Arrived | $ | 1,050,000 | Phase 2 | |||||||||
PMAC704 | CMP | RUDOLPH | USD | AXI | MACRO INSPECTION | 23-Aug-07 | $ | 1,050,000 | Phase 2 | |||||||||
QMAC705 | QA | RUDOLPH | USD | AXI | MACRO INSPECTION | 23-Mar-08 | $ | 800,000 | Phase 2 | |||||||||
PMAC702 | CMP | RUDOLPH | USD | AXI | MACRO INSPECTION | Arrived | $ | 750,000 | Phase 2 | |||||||||
QMAC706 | QA | RUDOLPH | USD | AXI | MACRO INSPECTION | 23-Aug-08 | $ | 800,000 | Phase 2 | |||||||||
QMAC707 | QA | RUDOLPH | USD | AXI | MACRO INSPECTION | 20-Feb-09 | $ | 800,000 | Phase 2 | |||||||||
PMAC705 | CMP | RUDOLPH | USD | AXI | MACRO INSPECTION | 23-Apr-09 | $ | 1,050,000 | Phase 2 | |||||||||
RUDOLPH Total | $ | 7,050,000 |
Annex H-page 8
Eqpt | ||||||||||||||||||
Shipdate | ||||||||||||||||||
(Rev | EST Eqpt | |||||||||||||||||
Eqpt ID | Module | Vendor | Currency | Eqpt Model | Main Process | 12D) | Budget | Remark | ||||||||||
CBSC703 | CLEAN TECH | SEMITOOL | USD | RAIDER | BEVEL ETCH | 04-Mar-07 | $ | 2,600,000 | Phase 2 | |||||||||
CBSC704 | CLEAN TECH | SEMITOOL | USD | RAIDER | BEVEL ETCH | 02-Apr-07 | $ | 2,600,000 | Phase 2 | |||||||||
CBSC705 | CLEAN TECH | SEMITOOL | USD | RAIDER | BEVEL ETCH | 06-Jul-08 | $ | 2,800,000 | Phase 2 | |||||||||
CBSC706 | CLEAN TECH | SEMITOOL | USD | RAIDER | BEVEL ETCH | 03-Nov-08 | $ | 2,800,000 | Phase 2 | |||||||||
SEMITOOL Total | $ | 10,800,000 | ||||||||||||||||
IMCI709 | IMPLANT | VARIAN | USD | VIISTA XE | MEDIUM CURRENT IMPLANT | Arrived | $ | 3,040,000 | Phase 2 | |||||||||
IHCI712 | IMPLANT | VARIAN | USD | VIISTA HC | HIGH CURRENT IMPLANT | 14-Oct-07 | $ | 3,000,000 | Phase 2 | |||||||||
IMCI710 | IMPLANT | VARIAN | USD | VIISTA XE | MEDIUM CURRENT IMPLANT | 23-Sep-07 | $ | 3,350,000 | Phase 2 | |||||||||
IHCI713 | IMPLANT | VARIAN | USD | VIISTA HC | HIGH CURRENT IMPLANT | 14-Dec-07 | $ | 3,300,000 | Phase 2 | |||||||||
IMCI711 | IMPLANT | VARIAN | USD | VIISTA XE | MEDIUM CURRENT IMPLANT | 23-Feb-08 | $ | 3,350,000 | Phase 2 | |||||||||
IHCI711 | IMPLANT | VARIAN | USD | VIISTA HC | HIGH CURRENT IMPLANT | Arrived | $ | 3,000,000 | Phase 2 | |||||||||
IHCI710 | IMPLANT | VARIAN | USD | VIISTA HC | HIGH CURRENT IMPLANT | Arrived | $ | 3,000,000 | Phase 2 | |||||||||
IHCI709 | IMPLANT | VARIAN | USD | VIISTA HC | HIGH CURRENT IMPLANT | Arrived | $ | 3,000,000 | Phase 2 | |||||||||
IHCI714 | IMPLANT | VARIAN | USD | VIISTA HC | HIGH CURRENT IMPLANT | 15-May-08 | $ | 3,300,000 | Phase 2 | |||||||||
IMCI712 | IMPLANT | VARIAN | USD | VIISTA XE | MEDIUM CURRENT IMPLANT | 24-Apr-08 | $ | 3,350,000 | Phase 2 | |||||||||
IHCI715 | IMPLANT | VARIAN | USD | VIISTA HC | HIGH CURRENT IMPLANT | 15-Jun-08 | $ | 3,300,000 | Phase 2 | |||||||||
IMCI713 | IMPLANT | VARIAN | USD | VIISTA XE | MEDIUM CURRENT IMPLANT | 25-May-08 | $ | 3,350,000 | Phase 2 | |||||||||
IHCI716 | IMPLANT | VARIAN | USD | VIISTA HC | HIGH CURRENT IMPLANT | 13-Jul-08 | $ | 3,300,000 | Phase 2 | |||||||||
IHCI717 | IMPLANT | VARIAN | USD | VIISTA HC | HIGH CURRENT IMPLANT | 13-Aug-08 | $ | 3,300,000 | Phase 2 | |||||||||
IHCI718 | IMPLANT | VARIAN | USD | VIISTA HC | HIGH CURRENT IMPLANT | 12-Sep-08 | $ | 3,300,000 | Phase 2 | |||||||||
IHCI719 | IMPLANT | VARIAN | USD | VIISTA HC | HIGH CURRENT IMPLANT | 13-Oct-08 | $ | 3,300,000 | Phase 2 | |||||||||
IMCI714 | IMPLANT | VARIAN | USD | VIISTA XE | MEDIUM CURRENT IMPLANT | 23-Jul-08 | $ | 3,350,000 | Phase 2 | |||||||||
IMCI715 | IMPLANT | VARIAN | USD | VIISTA XE | MEDIUM CURRENT IMPLANT | 22-Aug-08 | $ | 3,350,000 | Phase 2 | |||||||||
IMCI716 | IMPLANT | VARIAN | USD | VIISTA XE | MEDIUM CURRENT IMPLANT | 22-Sep-08 | $ | 3,350,000 | Phase 2 | |||||||||
IHCI720 | IMPLANT | VARIAN | USD | VIISTA HC | HIGH CURRENT IMPLANT | 13-Dec-08 | $ | 3,300,000 | Phase 2 | |||||||||
IHCI721 | IMPLANT | VARIAN | USD | VIISTA HC | HIGH CURRENT IMPLANT | 13-Jan-09 | $ | 3,300,000 | Phase 2 | |||||||||
IMCI717 | IMPLANT | VARIAN | USD | VIISTA XE | MEDIUM CURRENT IMPLANT | 22-Nov-08 | $ | 3,350,000 | Phase 2 | |||||||||
IMCI718 | IMPLANT | VARIAN | USD | VIISTA XE | MEDIUM CURRENT IMPLANT | 23-Dec-08 | $ | 3,350,000 | Phase 2 | |||||||||
VARIAN Total | $ | 74,890,000 | ||||||||||||||||
Grand Total | $ | 706,001,788 |
Annex H-page 9